Shock Specifications; Acoustic Requirements; Heat Dissipation, Power Consumption, And Air Flow Specifications; Dkc - HP XP20000/XP24000 Manual

Condition
Shipping and storage
(product packed in factory packing)

Shock specifications

Table 9 lists shock specifications. For horizontal shock testing methods, see ASTM D5277-92 Standard
Test Methods for Performing Programmed Horizontal Impacts Using an Inclined Impact Tester. For
vertical shock testing methods, see ASTM D6055-96 Standard Test Methods for Mechanical Handling
of Unitized Loads and Large Shipping Cases and Crates.
Table 9 Shock specifications for the XP24000/XP20000 Disk Arrays
Condition
Operating
Nonoperating
Shipping and storage (in factory packing)

Acoustic requirements

The acoustic emission specifications for the XP24000/XP20000 disks array are:
• 8.27 Bels (A) sound power
• 65 dB (A) sound pressure, operator position (1 meter from the floor and surface of the rack)
You can reduce the ambient noise level caused by equipment and air conditioning blowers in your
computer room by:
• Installing a dropped ceiling covered in commercial-grade, fire-resistant, acoustic-rated, fiberglass
ceiling tile
• Covering the walls in sound-deadening material
• Installing foam rubber removable partitions

Heat dissipation, power consumption, and air flow specifications

Heat and power specifications differ between the XP24000 and XP20000 disk arrays. See the
following tables for information on your specific disk array.
Table 10 XP24000 maximum heat and power specifications
Parameter
Max. power consumption
(kVA)
Max. heat dissipation
(kW)
Specification
0.5 G, 15 min. (at four most severe resonances
between 5 and 200 Hz)
Specification
None
8 G, 15 ms
Horizontal, incline impact: 1.22 m/s
Vertical, rotational edge: 0.15 m

DKC

6.7
6.44
XP24000/XP20000 Disk Array Site Preparation Guide
Each DKU
(1 DKC and 4 DKUs)
6.6
6.27
Full array
32.9
31.5
35