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Notes on chip component replacement
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.

TABLE OF CONTENTS

1.
2.
................................................................... 5
3.
3-1. Disassembly Flow ........................................................... 6
3-2. Panel (Lower) Section ..................................................... 6
3-3. Cabinet (Front) Section ................................................... 7
3-4. MAIN Board .................................................................... 7
3-5. Panel (Upper) Assy .......................................................... 8
3-6. Mechanism Deck (MT-MZRH1-181) ............................. 8
Torsion Spring (Pop Up R) .............................................. 9
3-8. Gear (SA), Gear (SB) ...................................................... 9
3-9. OP Service Assy (ABX-U2) ............................................ 10
3-11. Holder Assy ..................................................................... 11
3-12. Position of Ferrite Core ................................................... 11
4.
.............................................................. 12
5.
6.
6-1. Block Diagram - SERVO Section - ................................ 21
6-2. Block Diagram - AUDIO Section - ................................ 22
- MAIN Board (Component Side) - ............................... 32
- MAIN Board (Conductor Side) - ................................. 33
6-13. Printed Wiring Board - OLED Board - .......................... 34
6-14. Schematic Diagram - OLED Board - ............................. 35
7.
7-1. Panel (Upper) Section ..................................................... 52
7-2. Cabinet (Front) Section ................................................... 53
7-3. Lower Panel Section ........................................................ 54
7-4. Set Chassis Section .......................................................... 55
7-5. MAIN Board Section ....................................................... 56
8.
MZ-RH1
............................................... 4
......................... 16
................................ 58
3

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