Abstract; Introduction; Intel Xeon 5500 Series Processor Technology; Multi-Level Caches - HP DL370 - ProLiant - G6 Performance Introduction Manual

Abstract

This technology brief describes the key technologies implemented in Intel-based HP ProLiant 300-series
G6 servers.

Introduction

HP ProLiant 300-series G6 servers have been the focus of extensive engineering and development.
Characterized by increased performance, better power efficiency, and more powerful management
tools, the servers include these new technologies:
• The Intel® Xeon® Processor 5500 Series
• Double Data Rate-3 (DDR-3) DIMMs
• Thermal sensors incorporated throughout the ProLiant 300-series G6 servers
• The ProLiant Onboard Administrator powered by Integrated Lights-Out 2 (iLO 2) that delivers power
and temperature management through multiple sensors and fan control
• Dynamic Power Capping that limits peak power consumption without impacting performance and
without risk of overloading data center branch circuits
• Input/output (I/O) technologies such as PCIe generation 2 (PCIe 2.0) and faster Smart Array
controllers that incorporate common form factor components
• "Right Size" common slot power supplies in multiple sizes to provide the required amount of power
and improve power efficiency
The technologies discussed in this paper are implemented in all Intel-based ProLiant 300-series G6
servers. Exceptions are noted where different levels of technology implementation or service exist
among individual ProLiant 300-series G6 platforms.
For complete specifications of all ProLiant 300-series servers, see the HP website:
www.hp.com/products/servers/platforms.

Intel Xeon 5500 Series processor technology

ProLiant Intel-based 300-series G6 servers contain the Xeon 5500 Series processors. The Xeon 5500
Series microarchitecture is built on hafnium-based, 45 nanometer, high-k metal gate silicon
technology. Xeon 5500 Series processors use a new material combination of high-k gate dielectrics
and conductors which reduce electrical leakage—enabling smaller, more energy-efficient, and higher
performance processors. This new silicon technology, along with technologies such as distributed
shared memory, simultaneous multi-threading, Turbo Boost, and dynamic power management,
represent the technological heart of the HP ProLiant G6 servers.

Multi-level caches

Xeon 5500 Series processors have a three-level cache hierarchy (Figure 1):
• An on-core 64-kilobyte Level 1 cache, split into two 32 kilobyte caches: one for data and one for
instructions
• 256-kilobyte, Level 2 cache for each core to reduce latency
• A Level 3 cache of up to 8 megabytes shared by all cores
1 For additional information about Intel processors, see the HP technology brief titled "The Intel processor
roadmap for industry-standard servers":
http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00164255/c00164255.pdf.
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