Power Logic Management - HP BL685c - ProLiant - 4 GB RAM Management Manual

Managing the hp bladesystem c-class systems, 2nd edition
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action to maintain the enclosure's ability to operate, including adjusting fan speed, reducing power
consumption, or performing shutdowns on some or all subsystems. The Fan Zones tab on the OA
Thermal Subsystem page (Figure 8) gives a real-time, single-screen, zone-by-zone view of the thermal
operating conditions.
Figure 8. Onboard Administrator Thermal Subsystem page via a web GUI

Power logic management

The Onboard Administrator manages component power allocation and can limit the overall power
consumption of the enclosure. This feature is often referred to as power capping. Power measurement
sensors are used to accurately monitor how much power is being consumed and how much power is
available. Onboard Administrator manages power using real-time measured power data instead of
maximum power envelopes. Therefore, customers can deploy more servers and interconnect modules
than if the configuration was based only on nameplate power specifications for each component.
Note
If redundancy mode is either AC Redundant or Power Supply
Redundant and power redundancy is lost, any additional power
requests from the Onboard Administrator will not be accepted,
even if there is enough non-redundant power available. For
example, newly inserted server blades will not be allowed to
power on. Either the failure must be corrected or the redundancy
mode must be changed.
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