Intel BLKDG45FC Technical Product Specification

Intel BLKDG45FC Technical Product Specification

Product specification
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Intel® Desktop Board
DG45FC
Technical Product Specification
®
The Intel
Desktop Board DG45FC may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DG45FC Specification Update.
June 2008
Order Number: E35964-001US

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Summary of Contents for Intel BLKDG45FC

  • Page 1 Order Number: E35964-001US ® The Intel Desktop Board DG45FC may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DG45FC Specification Update.
  • Page 2: Revision History

    Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
  • Page 3: Intended Audience

    Intended Audience The TPS is intended to provide detailed, technical information about the Intel Desktop Board DG45FC and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
  • Page 4 Intel Desktop Board DG45FC Technical Product Specification Other Common Notation Used after a signal name to identify an active-low signal (such as USBP0#) Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second Gbit Gigabit (1,073,741,824 bits) Kilobyte (1024 bytes) Kbit Kilobit (1024 bits)
  • Page 5: Table Of Contents

    1.2 Legacy Considerations..............14 1.3 Online Support................14 1.4 Processor ..................14 1.5 System Memory ................16 1.5.1 Memory Configurations ............17 1.6 Intel ® G45 Express Chipset .............. 19 1.6.1 Intel G45 Graphics Subsystem ..........19 ® 1.6.2 Intel Viiv™...
  • Page 6 Intel Desktop Board DG45FC Technical Product Specification 2.4 Mechanical Considerations ..............55 2.4.1 Form Factor................. 55 2.5 Electrical Considerations ..............56 2.5.1 Power Supply Considerations ..........56 2.5.2 Fan Header Current Capability..........57 2.5.3 Add-in Board Considerations ..........58 2.6 Thermal Considerations ..............58 2.7 Reliability ..................
  • Page 7 Contents Figures Figure 1. Major Board Components............... 11 Figure 2. Block Diagram................13 Figure 3. Memory Channel and DIMM Configuration ........18 Figure 4. Back Panel Audio Connector Options..........26 Figure 5. LAN Connector LED Locations ............28 Figure 6. Thermal Sensors and Fan Headers ..........30 Figure 7.
  • Page 8 Intel Desktop Board DG45FC Technical Product Specification Table 29. Thermal Considerations for Components.......... 59 ® Table 30. Intel Desktop Board DG45FC Environmental Specifications ....60 Table 31. BIOS Setup Program Menu Bar ............62 Table 32. BIOS Setup Program Function Keys ..........62 Table 33.
  • Page 9: Product Description

    Product Description Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the Intel Desktop Board DG45FC. Table 1. Feature Summary Form Factor Mini-ITX (6.75 inches by 6.75 inches [171.45 millimeters by 171.45 millimeters]) Processor Support for the following: ®...
  • Page 10 Intel Desktop Board DG45FC Technical Product Specification Table 1. Feature Summary (continued) • Support for PCI* Local Bus Specification Revision 2.3 Instantly Available PC Technology • Support for PCI Express* Revision 1.0a • Suspend to RAM support • Wake on PCI, RS-232, front panel, USB ports, LAN, and CIR •...
  • Page 11: Board Layout

    Product Description 1.1.2 Board Layout Figure 1 shows the location of the major components. Figure 1. Major Board Components Table 2 lists the components identified in Figure 1.
  • Page 12: Table 2. Board Components Shown In Figure 1

    Intel Desktop Board DG45FC Technical Product Specification Table 2. Board Components Shown in Figure 1 Item/callout from Figure 1 Description Front panel audio header Back panel connectors CIR emitter (output) header Processor core power connector (2 X 2) Front panel USB header...
  • Page 13: Block Diagram

    Product Description 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas. Figure 2. Block Diagram...
  • Page 14: Legacy Considerations

    65 W. The processors listed above are only supported when falling within the wattage requirements of the Intel Desktop Board DG45FC. See the Intel web site listed below for the most up-to-date list of supported processors.
  • Page 15 Product Description INTEGRATOR’S NOTE Use only ATX12V-compliant power supplies. For information about Refer to Power supply connectors Section 2.2.2.4, page 49...
  • Page 16: System Memory

    Intel Desktop Board DG45FC Technical Product Specification System Memory The board has two DIMM sockets and support the following memory features: • 1.8 V DDR2 SDRAM DIMMs with gold plated contacts, with the option to raise the voltage to support higher performance DDR2 SDRAM DIMMs •...
  • Page 17: Memory Configurations

    Product Description 1.5.1 Memory Configurations The Intel 82G45 GMCH supports the following types of memory organization: • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal.
  • Page 18: Figure 3. Memory Channel And Dimm Configuration

    Intel Desktop Board DG45FC Technical Product Specification Figure 3 illustrates the memory channel and DIMM configuration. NOTE The DIMM 0 sockets of both channels are blue. Figure 3. Memory Channel and DIMM Configuration INTEGRATOR’S NOTE Regardless of the memory configuration used (dual channel, single channel, or flex mode), DIMM 0 of Channel A must always be populated.
  • Page 19: Intel ® G45 Express Chipset

    The Intel G45 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2 1.6.1 Intel G45 Graphics Subsystem The Intel G45 Express chipset contains the Intel Graphics Media Accelerator X4500HD (Intel GMA X4500HD) graphics controller. 1.6.1.1 Intel ® Graphics Media Accelerator X4500HD Graphics...
  • Page 20: Configuration Modes

    Intel Desktop Board DG45FC Technical Product Specification • Display ⎯ Supports digital and analog displays up to 2048 x 1536 at 75 Hz refresh (QXGA); also supports 1920 x 1080 resolution for full High Definition video playback quality ⎯ Dual independent display support 1.6.1.2...
  • Page 21: Intel Viiv™ Processor Technology

    This Intel desktop board supports Intel Viiv™ processor technology. To be eligible for the Intel Viiv processor technology brand, a system must meet certain hardware and software requirements. To get the list of requirements for Intel Viiv processor technology branding as well as all the features supported by Intel Viiv processor technology, refer to: http://www.intel.com/products/viiv/index.htm...
  • Page 22: Serial Ata Interfaces

    Intel Desktop Board DG45FC Technical Product Specification 1.6.4 Serial ATA Interfaces The board provides four Serial ATA (SATA) connectors, which support one device per connector. The board also provides one red-colored external Serial ATA (eSATA) connector on the back panel.
  • Page 23: Real-Time Clock Subsystem

    Rapid Recover Technology (Intel RRT). Intel® Rapid Recover Technology is a feature of Intel® Matrix Storage Manager. It uses RAID 1 (mirroring) functionality to copy data from a designated master drive to a designated recovery drive. The master drive data can be copied to the recovery drive either continuously or on request.
  • Page 24: Consumer Infrared (Cir)

    PC can use to emulate “learned” infrared commands in order to control external electronic hardware. Customers are required to buy or create their own interface modules to plug into Intel Desktop Boards for this feature to work.
  • Page 25: Audio Subsystem

    • Independent multi-streaming 7.1 audio (using the back panel audio connectors) and stereo (using the Intel High Definition Audio front panel header) Table 4 lists the supported functions of the front panel and back panel audio jacks. Table 4. Audio Jack Retasking Support...
  • Page 26: Audio Subsystem Software

    Intel Desktop Board DG45FC Technical Product Specification 1.9.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.2, page 14 1.9.2 Audio Connectors and Headers The board contains audio connectors on the back panel and audio headers on the component side of the board.
  • Page 27: 1.10 Lan Subsystem

    Refer to LAN software and drivers http://downloadcenter.intel.com ® 1.10.1 Intel 82567LF Gigabit Ethernet Controller The Intel 82567LF Gigabit Ethernet Controller supports the following features: • PCI Express link • 10/100/1000 IEEE 802.3 compliant • Compliant to IEEE 802.3x flow control support •...
  • Page 28: Lan Subsystem Software

    Intel Desktop Board DG45FC Technical Product Specification 1.10.2 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers Section 1.2, page 14 1.10.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below).
  • Page 29: 1.11 Hardware Management Subsystem

    Chassis intrusion detection 1.11.1 Hardware Monitoring and Fan Control The features of the hardware monitoring and fan control include: • Intel Quiet System Technology, delivering acoustically-optimized thermal management • Fan speed control controllers and sensors integrated into the ICH10R •...
  • Page 30: Thermal Monitoring

    Intel Desktop Board DG45FC Technical Product Specification 1.11.4 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan headers. Item Description Thermal diode, located on processor die Rear chassis fan Processor fan Thermal diode, located on the GMCH die Thermal diode, located on the ICH10R die Figure 6.
  • Page 31: 1.12 Power Management

    Product Description 1.12 Power Management Power management is implemented at several levels, including: • Software support through Advanced Configuration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯...
  • Page 32: Table 7. Power States And Targeted System Power

    Intel Desktop Board DG45FC Technical Product Specification 1.12.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications.
  • Page 33: Table 8. Wake-Up Devices And Events

    Product Description 1.12.1.2 Wake-up Devices and Events Table 8 lists the devices or specific events that can wake the computer from specific states. Table 8. Wake-up Devices and Events These devices/events can wake up the computer… …from this state (Note 1) S1, S3, S4, S5 (Note 1) PME# signal...
  • Page 34: Hardware Support

    Intel Desktop Board DG45FC Technical Product Specification 1.12.2 Hardware Support CAUTION Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.
  • Page 35: Fan Headers

    Product Description 1.12.2.2 Fan Headers The function/operation of the fan headers is as follows: • The fans are on when the board is in the S0 state. • The fans are off when the board is off or in the S3, S4, or S5 state. •...
  • Page 36: Instantly Available Pc Technology

    Intel Desktop Board DG45FC Technical Product Specification 1.12.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply.
  • Page 37: Wake From Usb

    Product Description 1.12.2.5 Wake from USB USB bus activity wakes the computer from ACPI S1 and S3 state. NOTE Wake from USB requires the use of a USB peripheral that supports Wake from USB and support in the OS. 1.12.2.6 Wake from CIR Consumer IR activity wakes the computer from ACPI S1 and S3 state, and optionally from the ACPI S4 and S5 state.
  • Page 38: Energy Star

    ENERGY STAR* In 2007, the US Department of Energy and the US Environmental Protection Agency revised the ENERGY STAR* requirements. Intel has worked directly with these two governmental agencies to define the new requirements. Currently this Intel Desktop Board meets the Category B requirements when using the appropriate peripherals.
  • Page 39: Technical Reference

    • Memory-mapped I/O that is dynamically allocated for PCI Express add-in cards • Base graphics memory support (1 MB or 8 MB) ® ® • Intel Management Engine Interface (Intel MEI) single channel (8 MB) or dual channel (16 MB)
  • Page 40: Figure 8. Detailed System Memory Address Map

    Intel Desktop Board DG45FC Technical Product Specification The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 8 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.
  • Page 41: Table 9. System Memory Map

    Technical Reference Table 9 lists the system memory map. Table 9. System Memory Map Address Range Address Range (decimal) (hex) Size Description 1024 K - 4096 K 100000 - 400000 4096 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K...
  • Page 42: Connectors And Headers

    Intel Desktop Board DG45FC Technical Product Specification Connectors and Headers CAUTION Only the following connectors and headers have overcurrent protection: Back panel and front panel USB. The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals.
  • Page 43: Back Panel Connectors

    Technical Reference 2.2.1 Back Panel Connectors Figure 9 shows the location of the back panel connectors. Item Description DVI-I output HDMI port USB ports [2] USB ports [2] eSATA port USB ports [2] Rear surround left/right channel audio out S/PDIF Digital audio out (optical) Center channel and LFE (subwoofer) audio out Audio line in/side surround Mic in...
  • Page 44: Component-Side Connectors And Headers

    Intel Desktop Board DG45FC Technical Product Specification 2.2.2 Component-side Connectors and Headers Figure 10 shows the locations of the component-side connectors and headers. Figure 10. Component-side Connectors and Headers...
  • Page 45: Table 10. Component-Side Connectors And Headers Shown In Figure 10

    Technical Reference Table 10 lists the component-side connectors and headers identified in Figure 10. Table 10. Component-side Connectors and Headers Shown in Figure 10 Item/callout from Figure 10 Description Front panel audio header CIR emitter (output) header Processor core power connector (2 X 2) Front panel USB header Front panel USB header Chassis intrusion header...
  • Page 46: Table 11. Front Panel Audio Header

    Intel Desktop Board DG45FC Technical Product Specification 2.2.2.1 Signal Tables for the Connectors and Headers Table 11. Front Panel Audio Header Signal Name Signal Name [Port 1] Left channel Ground [Port 1] Right channel PRESENCE# (Dongle present) [Port 2] Right channel...
  • Page 47: Table 16. Processor (4-Pin) Fan Header

    Technical Reference Table 16. Processor (4-Pin) Fan Header Signal Name Ground +12 V FAN_TACH FAN_CONTROL Table 17. CIR Emitter (Output) Header Signal Name Emitter out 1 Emitter out 2 Ground Key (no pin) Jack detect 1 Jack detect 2 Table 18. CIR Receiver (Input) Header Signal Name Ground Learn-in...
  • Page 48: Table 19. Auxiliary Front Panel Power/Sleep Led Header

    Intel Desktop Board DG45FC Technical Product Specification 2.2.2.3 Auxiliary Front Panel Power/Sleep LED Header Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header. Table 19. Auxiliary Front Panel Power/Sleep LED Header...
  • Page 49: Table 20. Processor Core Power Connector

    Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When...
  • Page 50: Figure 11. Connection Diagram For Front Panel Header

    Intel Desktop Board DG45FC Technical Product Specification 2.2.2.5 Front Panel Header This section describes the functions of the front panel header. Table 22 lists the signal names of the front panel header. Figure 11 is a connection diagram for the front panel header.
  • Page 51: Table 23. States For A One-Color Power Led

    Technical Reference 2.2.2.5.1 Hard Drive Activity LED Header Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires one of the following: •...
  • Page 52: Figure 12. Connection Diagram For Front Panel Usb Headers

    Intel Desktop Board DG45FC Technical Product Specification 2.2.2.6 Front Panel USB Headers Figure 12 is a connection diagram for the front panel USB headers. INTEGRATOR’S NOTES • The +5 V DC power on the USB headers is fused. • Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices.
  • Page 53: Jumper Block

    Technical Reference Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 13 shows the location of the jumper block. The jumper determines the BIOS Setup program’s mode.
  • Page 54: Table 25. Bios Setup Configuration Jumper Settings

    Intel Desktop Board DG45FC Technical Product Specification Table 25. BIOS Setup Configuration Jumper Settings Function/Mode Jumper Setting Configuration Normal The BIOS uses current configuration information and passwords for booting. 3 2 1 Configure After the POST runs, Setup runs automatically. The maintenance menu is displayed.
  • Page 55: Mechanical Considerations

    Technical Reference Mechanical Considerations 2.4.1 Form Factor The board is designed to fit into a Mini-ITX-form-factor chassis. Figure 14 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 6.75 inches by 6.75 inches [171.45 millimeters by 171.45 millimeters].
  • Page 56: Electrical Considerations

    Intel Desktop Board DG45FC Technical Product Specification Electrical Considerations 2.5.1 Power Supply Considerations CAUTION The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.
  • Page 57: Fan Header Current Capability

    Technical Reference 2.5.2 Fan Header Current Capability CAUTION The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 28 lists the current capability of the fan headers.
  • Page 58: Add-In Board Considerations

    Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm...
  • Page 59: Figure 15. Localized High Temperature Zones

    Item Description Processor voltage regulator area Processor Intel 82G45 GMCH Intel 82801JR (ICH10R) Figure 15. Localized High Temperature Zones Table 29 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures.
  • Page 60: Reliability

    Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The Intel Desktop Board DG45FC MTBF is 125,864 hours.
  • Page 61: Overview Of Bios Features

    Overview of BIOS Features Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support.
  • Page 62: Bios Flash Memory Organization

    Intel Desktop Board DG45FC Technical Product Specification Table 31 lists the BIOS Setup program menu features. Table 31. BIOS Setup Program Menu Bar Maintenance Main Advanced Security Power Boot Exit Clears Displays Configures Sets Configures Selects boot Saves or passwords and...
  • Page 63: System Management Bios (Smbios)

    Overview of BIOS Features System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components.
  • Page 64: Legacy Usb Support

    Legacy USB support from the BIOS is no longer used. 7. Additional USB legacy feature options can be access by using Intel Integrator Toolkit. To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s...
  • Page 65: Bios Updates

    Integrator Assistant that is available from Intel can be used to create a custom splash screen. NOTE If you add a custom splash screen, it will share space with the Intel branded logo. Refer to For information about Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/...
  • Page 66: Bios Recovery

    Intel Desktop Board DG45FC Technical Product Specification BIOS Recovery It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 33 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable.
  • Page 67: Boot Options

    Overview of BIOS Features Boot Options In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drive, USB drive, USB flash drive, CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device, the hard drive second, and the ATAPI CD-ROM third.
  • Page 68: Adjusting Boot Speed

    It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen.
  • Page 69: 3.10 Bios Security Features

    Overview of BIOS Features 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: •...
  • Page 70 Intel Desktop Board DG45FC Technical Product Specification...
  • Page 71: Error Messages And Beep Codes

    Error Messages and Beep Codes Speaker The board-mounted speaker provides audible error code (beep code) information during POST. For information about Refer to The location of the onboard speaker Figure 1, page 11 BIOS Beep Codes Whenever a recoverable error occurs during POST, the BIOS causes the board’s speaker to beep an error message describing the problem (see Table 36).
  • Page 72: Port 80H Post Codes

    Intel Desktop Board DG45FC Technical Product Specification Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h.
  • Page 73: Table 39. Port 80H Post Codes

    Error Messages and Beep Codes Table 39. Port 80h POST Codes POST Code Description of POST Operation Host Processor Power-on initialization of the host processor (Boot Strap Processor) Host processor cache initialization (including APs) Starting Application processor initialization SMM initialization Chipset Initializing a chipset component Memory...
  • Page 74 Intel Desktop Board DG45FC Technical Product Specification Table 39. Port 80h POST Codes (continued) POST Code Description of POST Operation Keyboard (PS/2 or USB) Resetting keyboard Disabling keyboard Detecting presence of keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS/2 only)
  • Page 75 Error Messages and Beep Codes Table 39. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs Runtime Phase/EFI OS Boot Entering Sleep state Exiting Sleep state EFI boot service ExitBootServices ( ) has been called EFI runtime service SetVirtualAddressMap ( ) has been called...
  • Page 76: Table 40. Typical Port 80H Post Sequence

    Intel Desktop Board DG45FC Technical Product Specification Table 40. Typical Port 80h POST Sequence POST Code Description Initializing a chipset component Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase...
  • Page 77: Regulatory Compliance And Battery Disposal Information

    Electromagnetic Compatibility (EMC) standards • Product certification markings 5.1.1 Safety Standards The Intel Desktop Board DG45FC complies with the safety standards stated in Table 41 when correctly installed in a compatible host system. Table 41. Safety Standards Standard Title CSA/UL 60950-1, First Edition Information Technology Equipment –...
  • Page 78: European Union Declaration Of Conformity Statement

    European Union Declaration of Conformity Statement ® We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board DG45FC is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).
  • Page 79: Product Ecology Statements

    恰当的重复使用处理。 请参考http://www.intel.com/intel/other/ehs/product_ecology 了解此计划的详情,包括涉及产品之范围、回收地点、运送指导、条款和条件等。 Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der...
  • Page 80 Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à...
  • Page 81: Lead Free Desktop Board

    Regulatory Compliance and Battery Disposal Information Russian В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной...
  • Page 82: Table 42. Lead-Free Board Markings

    Intel Desktop Board DG45FC Technical Product Specification Table 42. Lead-Free Board Markings Description Mark Lead-Free 2 Level Interconnect: This symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in the desktop board...
  • Page 83: Emc Regulations

    Regulatory Compliance and Battery Disposal Information 5.1.4 EMC Regulations The Intel Desktop Board DG45FC complies with the EMC regulations stated in Table 43 when correctly installed in a compatible host system. Table 43. EMC Regulations Regulation Title FCC 47 CFR Part 15,...
  • Page 84: Product Certification Markings (Board Level)

    EMC requirements. You may use this equipment in residential environments and other non-residential environments. 5.1.5 Product Certification Markings (Board Level) The Intel Desktop Board DG45FC has the product certification markings shown in Table 44: Table 44. Product Certification Markings Description Mark UL joint US/Canada Recognized Component mark.
  • Page 85: Battery Disposal Information

    Regulatory Compliance and Battery Disposal Information Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect.
  • Page 86 Intel Desktop Board DG45FC Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
  • Page 87 Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii.
  • Page 88 Intel Desktop Board DG45FC Technical Product Specification...

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