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Table of Contents
Contents
HP EliteBook 855 G8, HSN-I43C-5 Manual
Items Requiring Selective Treatment
- Items listed below are classified as requiring selective treatment.
- Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
| Item Description | Notes | Quantity of items included in product |
| Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) | With a surface greater than 10 sq cm | 5 |
| Batteries, excluding Li-Ion batteries. | All types including standard alkaline, coin or button style batteries | 0 |
| Li-Ion batteries. Include all Li-Ion batteries if more than one is provided with the product (such as a detachable notebook keyboard battery, RTC coin cell, etc.) | Battery(ies) are attached to the product by (check all that apply with an "x" inside the "[ ]"): [x] screws [x] snaps [ ] adhesive [ ] other. Explain NOTE: Add detailed removal procedures including required tools in the section "Product Disassembly Process". | 2 |
| Mercury-containing components | For example, mercury in lamps, display backlights, scanner lamps, switches, batteries | 0 |
| Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm | Includes background illuminated displays with gas discharge lamps (15.6") | 1 |
| Cathode Ray Tubes (CRT) | 0 | |
| Capacitors/condensers (Containing PCB/PCT) | 0 | |
| Electrolytic Capacitors/Condensers measuring greater than 2.5 cm in diameter or height | 0 | |
| External electrical cables and cords | DC Cable for External Power Supply | 1 |
| Gas Discharge Lamps | 0 | |
| Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above) | ||
| Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner | Include the cartridges, print heads, tubes, vent chambers, and service stations. | 0 |
| Components and waste containing asbestos | 0 | |
| Components, parts and materials containing refractory ceramic fibers | 0 | |
| Components, parts and materials containing radioactive substances | 0 |
Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
| Tool Description | Tool Size (if applicable) |
| Screw driver | Cross |
| Opening pry jig | |
| Hot air gun or Hair dryer | |
| Tweezer |
Product Disassembly Process
- List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure:
- Loosen screws and remove base cover
- Remove main battery
- Remove DDR and small cards
- Disconnect all cables and remove RTC battery
- Take out Thermal module, fan and PCA
- Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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