HP ProBook 440 G8, ZHAN 66 Pro 14 G4, HSN-Q28C-4 Service Manual
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HP ProBook 440 G8, ZHAN 66 Pro 14 G4, HSN-Q28C-4 Service Manual

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Contents
HP ProBook 440 G8, ZHAN 66 Pro 14 G4, HSN-Q28C-4 Service Manual

Introduction

Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP ProBook 440 G8
HP ZHAN 66 Pro 14 G4 Notebook PC
HP ProBook 440 G8 Notebook PC / HSN-Q28C-4

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

warning NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the plastic part. For any questions on plastic marking, please contact HP's Sustainability Contact.

Items Requiring Selective Treatment

  1. Items listed below are classified as requiring selective treatment.
  2. Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description Notes Quantity of items included in product
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) With a surface greater than 10 sq cm
Batteries, excluding Li-Ion batteries. All types including standard alkaline, coin or button style batteries
Li-Ion batteries. Include all Li-Ion batteries if more than one is provided with the product (such as a detachable notebook keyboard battery, RTC coin cell, etc.)

Battery(ies) are attached to the product by (check all that apply with an "x" inside the "[ ]"):
[3] screws
[X] snaps
[1] adhesive
[X] other. Explain X

warning NOTE: Add detailed removal procedures including required tools

 1
Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries NA 0
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Includes background illuminated displays with gas discharge lamps LED
Cathode Ray Tubes (CRT) NA
Capacitors / condensers (Containing PCB/PCT) NA
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height NA
External electrical cables and cords DC Cable for External Power Supply
Gas Discharge Lamps NA
Plastics containing Brominated Flame Retardants NA 0
weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)
Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. NA 0
Components and waste containing asbestos NA 0
Components, parts and materials containing refractory ceramic fibers NA 0
Components, parts and materials containing radioactive substances N 0

Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if applicable)
T8 Screwdriver #T8
Screwdriver #T1

Product Disassembly Process

  1. List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure:
    1. Us Use screwdriver to release base cover #1 screw 5PCS, and disassemble base cover from hinge side.
    2. Use screwdriver to release battery screw 4 PCS and release Battery.
    3. Use screwdriver to release main board #1 screw 6 PCS
    4. Release below cable: Speaker cable, DC-IN Cable, HDD cable, Finger Printer cable, backlight cable, TP cable, SD card cable, KB Cable, Power board cable, EDP cable, WWan antenna cable, Wlan antenna cable. And Disassemble Type-C BKT, RJ-45. Final step release main board
    5. release hinge screw with screwdriver
    6. Set Hinge UP to 90 degree and release hinge up
  2. Optional Graphic.
    If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
    1. Use screwdriver to release base cover #1 screw 5PCS, and disassemble base cover from hinge side
      Product Disassembly Process - Step 1
    2. Use screwdriver to release battery screw 4 PCS and release Battery.
      Product Disassembly Process - Step 2
    3. Use screwdriver to release main board #1 screw 6 PCS
      Product Disassembly Process - Step 3
    4. Release below cable: Speaker cable, DC-IN Cable, HDD cable, Finger Printer cable, backlight cable, TP cable, SD card cable, KB Cable, Power board cable, EDP cable, WWan antenna cable, Wlan antenna cable. And Disassemble TypeC BKT, RJ-45. Final step release main board
      Product Disassembly Process - Step 4
    5. release hinge screw with screwdriver
      Product Disassembly Process - Step 5
    6. Set Hinge UP to 90 degree and release hinge up
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