Murata GRM188R71E224KA88 Series Reference Sheet page 4

Distributor of Murata Electronics North America: Excellent Integrated System Limited
Datasheet of GRM188R71E224KA88D - CAP CER 0.22UF 25V X7R 0603
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No Item
10 Vibration Appearance No defects or abnormalities.
Capacitance Within the specified initial value.
Q or D.F. Within the specified initial value.
11 Substrate Appearance No defects or abnormalities.
Bending test Capacitance Within +/-5% or +/-0.5pF
Change (Whichever is larger)
12 Solderability
95% of the terminations is to be soldered evenly and continuously.
13 Resistance to Appearance No defects or abnormalities.
Soldering Heat Capacitance Within +/-2.5% or +/- 0.25pF
Change (Whichever is larger)
Q or D.F. Within the specified initial value.
I.R. Within the specified initial value.
Voltage proof No defects.
14 Temperature Appearance No defects or abnormalities.
Sudden Change Capacitance Within +/-2.5% or+/- 0.25pF
Change (Whichever is larger)
Q or D.F. Within the specified initial value.
I.R. Within the specified initial value.
Voltage proof No defects.
Specification
Temperature High Dielectric
Compensating Type Constant Type
Within +/-10%
Within +/-7.5%
Within +/-7.5%
Type
GRM02
GRM03
GRM15/GRM18
GRM21/GRM31/GRM32
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Solder the capacitor on the test substrate shown in Fig.3.
Kind of Vibration : A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude : 1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
Solder the capacitor on the test substrate shown in Fig.1.
Pressurization method : Shown in Fig.2
: 1mm
Flexure
Holding Time : 5+/-1s
Soldering Method : Reflow soldering
Test Method : Solder bath method
Flux Solution of rojin ethanol 25(wt)%
Preheat : 80℃ to 120℃ for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. : 245+/-5℃
Immersion time : 2+/-0.5s
<GRM03 size min.>
Test Method : Solder bath method
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. : 270+/-5℃
Immersion time : 10+/-0.5s
Exposure Time : 24+/-2h
Preheat : GRM31 size max.: 120℃ to 150℃ for 1 min
GRM32 size : 100℃ to 120℃ for 1 min
· Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature, then measure.
<GRM02 size only>
Test Method : Reflow soldering (hot plate)
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. : 270+/-5℃
Reflow Time : 10+/-0.5s
Test Substrate : Glass epoxy PCB
Exposure Time : 24+/-2h
Preheat : 120℃ to 150℃ for 1 min
· Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature, then measure.
Solder the capacitor on the test substrate shown in Fig.3.
Perform the five cycles according to the four heat treatments
shown in the following table.
Step Temp.(C)
1 Min.Operating Temp.+0/-3
2 Room Temp.
3 Max.Operating Temp.+3/-0
4 Room Temp
Exposure Time : 24+/-2h
· Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature, then measure.
Applied Force(N)
1
2
5
10
and 170℃ to 200℃ for 1 min
Time (min)
30+/-3
2 to 3
30+/-3
2 to 3