HPE XL260a Gen9 Compute Tray Product End-Of-Life Disassembly Instructions page 2

Item Description
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Trox Driver
Trox Driver
Phillips
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Press the latch to remove top cover from chassis.
2. Remove Air baffle from system by hand.
3. Locate the battery on the mother board, push the lock area of battery holder and remove the battery by hand
4. Loose screws with screw driver and uninstall the MEZZ bracket.
5. Loose screws of M.2 Card and remove the M.2 module.
6. Remove DIMM, Heat sink, and CPU from MB. And install dust cover.
7. Loose screws with screw driver and remove the Tail Board with MGMT Power Cable.
8. Remove all Cables from MB.
9. Loose screws with screw driver, and remove 1 pcs air baffle bracket.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1# System Board Battery
Attachment 2# system MB with CPU dust cover
Attachment 3# Air baffle bracket
MF877-00
Template Revision A
All manuals and user guides at all-guides.com
Notes
HPE instructions for this template are available at
Tool Size (if
applicable)
T10
T15
P1
MF877-01
Quantity
of items
included
in product
0
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