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DIDS-402-2MIO
Para 4,:",1/4-1. 2
SECTION 4
MAINTENANCE
This section contains procedures for troubleshooting to the extent of replac-
ing components mounted on or under the main chassis assembly, and procedures
for removing and replacing parts.
Use the following test equipment (or equivalent) when taking measurements:
a.
Simpson Model 260 Multimeter (20,000 ohms/volt)
b.
Tektronix 545A Oscilloscope
c.
Tektronix Type 53/S4C Dual Trace Preamplifier
d.
Tektronix Type P6022 (lOX Attenuation) Probe
e.
Test Set TS-402
If an oscilloscope with a narrower bandwidth ·capability is u'sed, a reduction
in the fidelity of the waveshape reproduction will occur.
This factor should be
considered when determining whether or not a board is performing properly.
4-1
TROUBLESHOOTING
The following paragraphs cove r the troubleshooting methods for the high-
and low-voltage power supplies, the analog circuits by individual circuit board,
and the digital circuits.
A thorough understanding of the theory covered in Section 3 will provide the
repairman with sufficient system concept to enable him to logically dete-rmine
which boards or components could cause a particular fault.
4-1.
I
Routine Visual Checks.
Depending upon the nature of the trouble, the
following items should be checked:
a.
Interlock switch Sl (figure 2-2)
b.
Fuse F 1 (figure 2-2)
c.
All leads to printed circuit boards to make certain that they are
properly fastened to their respective terminals
4-1.2 Voltage Che~ks.
Use the symptom and probable cause chart (table 4-1)
to check the high- and low-voltage powe r supplies.
WARNING
Extreme caution should be exercised when making
measurements on the high-voltage power supply
(12 kV).
4-1
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