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electromagnetic fields are generated. It will also require a grounded AC power outlet nearby.
Be sure to read the precautions and considerations noted in Appendix B.
1.3 System Features
The following table provides you with an overview of the main features of the
SSG-6049P-E1CR60H/L/L+. Please refer to Appendix C for additional specifications.
Motherboard
X11DSC+
Chassis
SC946STS-R2K05P
CPU
Dual Intel Xeon 81xx/61xx/51xx/41xx/31xx series or 82xx/62xx/52xx/42xx/32xx series processors (Socket P)
processors with three UltraPath Interconnects (UPIs) of up to 10.4 GT/s. Note: Both CPUs need to be installed
for full access to the PCI-E slots, DIMM slots, and onboard controllers. Refer to the block diagram on page 16 to
determine which slots or devices may be affected.
Chipset
Intel PCH C621 chipset
Memory
Up to 6TB 3DS ECC RDIMM/LRDIMM to speeds of DDR4-2933MHz in 24 DIMM slots
(82xx/62xx/52xx/42xx/32xx series processors) Supports up to twelve Intel Optane DCPMMs.
Up to 3TB 3DS ECC RDIMM/LRDIMM to speeds of DDR4-2666MHz, in 24 DIMM slots
(81xx/61xx/51xx/41xx/31xx series processors) Supports up to twelve Intel Optane DCPMMs.
Expansion Slots
One PCI-E 3.0 x8 slot
Two PCI-E 3.0 x16 slots
One PCI-E 3.0 x8 slot for AOM (Add-on-Module installed by default)
One PCI-E 3.0 x16 slot for SIOM network card
Hard Drives (Max. Capacity: 68 Drives)
Sixty 3.5" hot-swap hard drives
Two 2.5" hot-swap hard drives (rear)
Six U.2 NVMe SSDs (dedicated NVMe bays)
Power
2000W redundant power supply
Form Factor
4U rackmount
Dimensions
WxHxD: 17.2 x 7 x 30.2in (437 x 178 x 767 mm)
System Features
9
Chapter 1: Introduction
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