LS ELECTRIC XEC-DN32H User Manual

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Programmable Logic Control

XGB Main unit(XEC-H Type)

XGT Series

XEC-DN32H

XEC-DN64H

XEC-DP32H

XEC-DP64H

XEC-DR32H

XEC-DR64H

XEC-DN32H/DC

XEC-DR32H/D1

XEC-DR64H/D1

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Summary of Contents for LS ELECTRIC XEC-DN32H

Page 1 Programmable Logic Control XGB Main unit(XEC-H Type) XGT Series XEC-DN32H XEC-DN64H XEC-DP32H XEC-DP64H XEC-DR32H XEC-DR64H XEC-DN32H/DC XEC-DR32H/D1 XEC-DR64H/D1...
Page 2 Safety Instruction Before using the product … For your safety and effective operation, please read the safety instructions thoroughly before using the product. ► Safety Instructions should always be observed in order to prevent accident or risk with the safe and proper use the product. ►...
Page 3 Safety Instruction Safety Instructions when designing Warning  Please, install protection circuit on the exterior of PLC to protect the whole control system from any error in external power or PLC module. Any abnormal output or operation may cause serious problem in safety of the whole system.
Page 4 Safety Instruction Safety Instructions when designing Caution I/O signal or communication line shall be wired at least 100mm  away from a high-voltage cable or power line. If not, it may cause abnormal output or operation. Safety Instructions when designing Caution ...
Page 5 Safety Instruction Safety Instructions when wiring Warning Prior to wiring, be sure that power of PLC and external power is  turned off. If not, electric shock or damage on the product may be caused. Before PLC system is powered on, be sure that all the covers of ...
Page 6 Safety Instruction Safety Instructions for test-operation or repair Warning  Don’t touch the terminal when powered. Electric shock or abnormal operation may occur.  Prior to cleaning or tightening the terminal screws, let all the external power off including PLC power. If not, electric shock or abnormal operation may occur.
Page 7 Safety Instruction...
Page 8 Ch4.1, Ch4.3 Ch7.3.4, Ch7.3.6 Appendix2 1. Domain Of Homepage Changed Front/Back Cover Ch2.1, Ch2.2 V1.6 2014.2 2. Add XEC-DN32H/DC Ch4.1, Ch4.3 Ch7.2.1, Ch7.3.3 Ch8.1.1 Appendix2 1. Address & phone number changed Back Cover 2. Add new module Ch2.1, Ch2.2, V1.7 2015.7...
Page 9 Revision History...
Page 10 About User's Manual About User’s Manual Thank you for purchasing PLC of LS ELECTRIC Co.,Ltd. Before use, make sure to carefully read and understand the User’s Manual about the functions, performances, installation and programming of the product you purchased in order for correct use and importantly, let the end user and maintenance administrator to be provided with the User’s Manual.
Page 11 About User's Manual XGB Profibus-DP I/F It describes how to use XGB Profibus-DP I/F (Slave) User’s 10310001410 (Slave) Commnunication Module Manaual XGB DeviceNet I/F It describes how to use XGB DeviceNet I/F (Slave) User’s 10310001414 (Slave) Commnunication Module Manaual XGB High speed It describes how to use High speed counter(XBF-HO02A, counter module User’s 10310001240...
Page 12: Table Of Contents
Table of Contents ◎ Contents ◎ Chapter 1 Introduction ................1-1~5 1.1 Guide to Use This Manual ..................1-1 1.2 Features ......................... 1-2 1.3 Terminology ......................1-4 Chapter 2 System Configuration .............. 2-1~11 2.1 XGB System Configuration ................... 2-1 2.2 Product List ......................2-2 2.3 Classification and Type of Product Name .............
Page 13 Table of Contents 4.5.3 Life of battery ......................4-8 4.5.4 How to change the battery ..................4-9 Chapter 5 Program Configuration and Operation Method ..... 5-1~28 5.1 Program Instruction ....................5-1 5.1.1 Program execution methods ..................5-1 5.1.2 Operation processing during momentary power failure ........... 5-2 5.1.3 Scan time .........................
Page 14 7.1 Introduction ......................7-1 7.2 Digital Input Specifications of Main Unit ..............7-8 7.2.1 XEC-DR32H / XEC-DN32H input unit (Source/Sink type) ........7-8 7.2.2 XEC-DR64H / XEC-DN64H input unit (Source/Sink Type) ........7-9 7.3 Digital Output Specification of Main Unit ............. 7-10 7.3.1 XEC-DR32H output unit ..................
Page 15 Table of Contents 7.5.4 16 point transistor output module (Sink type) ............7-23 7.5.5 32 point transistor output module (Sink type) ............7-24 7.5.6 8 point transistor output module (Source type)............7-25 7.5.7 16 point transistor output module (Source type) ............. 7-26 7.5.8 32 point transistor output module (Source type) .............
Page 16 Table of Contents 9.3.2 I/O Device wiring ...................... 9-17 9.3.3 Grounding wiring ...................... 9-17 9.3.4 Specifications of wiring cable .................. 9-18 Chapter 10 Maintenance ................ 10-1~-2 10.1 Maintenance and Inspection ................10-1 10.2 Daily Inspection ....................10-1 10.3 Periodic Inspection ................... 10-2 Chapter 11 Troubleshooting ..............
Page 17 Table of Contents Appendix 4.1 Basic Function ................App.4-1 Appendix 4.2 MK(MASTER-K) Function ............. App.4-10 Appendix 4.3 Array Operation Function ............App.4-10 Appendix 4.4 Basic Function Block ..............App.4-11...
Page 18: Chapter 1 Introduction
Chapter 1. Introduction Chapter 1 Introduction 1.1 Guide to Use This Manual This manual includes specifications, functions and handling instructions for the XGB series PLC. This manual is divided up into chapters as follows. Title Contents Describes configuration of this manual, unit’s features and Chapter 1 Introduction terminology.
Page 19: Features
Chapter 1. Introduction 1.2 Features The features of XGB system are as follows. (1) The system secures the following high performances. (a) High Processing Speed (b) Max. 384 I/O control supporting small & mid-sized system implementation Specification (XEC-DxxxH) Item O/S Version: Less than V5.00 O/S Version: V5.00 or later Operation processing speed 83ns / Step...
Page 20 Chapter 1. Introduction (d) Improved maintenance ability by types of comment backup. (e) Built-in RTC function enabling convenient history and schedule management (5) Optimized communication environment. (a) With max. 2 channels of built-in COM (excl. loader), up to 2 channel communication is available without any expanded of module.
Page 21 Chapter 1. Introduction (11) Built-in PID (a) Supporting max. 16 loops. (b) Setting parameters by using XG5000 and supporting loop status monitoring conveniently with trend monitor. (c) Control constant setting through the improved Auto-tuning function. (d) With many other additional functions including PWM output, ∆MV, ∆PV and SV Ramp, improving the control preciseness.
Page 22: Terminology
Chapter 1. Introduction 1.3 Terminology The following table gives definition of terms used in this manual. Terms Definition Remark Example) A standard element that has a specified function which configures Expansion module, Module the system. Devices such as I/O board, which inserted onto the Special module, mother board.
Page 23 Chapter 1. Introduction Terms Definition Remark Current flows from the switch to the PLC input terminal if a input signal turns on. Z: Input Sink Input impedance − Current flows from the PLC input terminal to the switch after a input signal turns on.
Page 24 Chapter 1. Introduction 1.4 Usage notes according to compatibility and O/S version Describes matters that require attention for use depending on the product O/S version. (1) XG5000 - CPU module (XEC-H) In case of CPU O/S V5.00 or higher, you must download the program using XG5000 V4.71 or higher version. XG5000 Version CPU O/S Version Function...
Page 25 Chapter 1. Introduction (2) XG5000 – Memory module (XBO-M2MB) It is possible to write code of version less than V5.00 to the memory module of version less than V1.60. Versions from V1.60 or later can be selected when writing. XG5000 Version Memory module Function O/S version...
Page 26 Chapter 1. Introduction (3) CPU module (XEC-H) - Memory module (XBO-M2MB) For CPU O/S version V5.00 or higher, you must use memory module version V1.60 or higher. Memory module O/S version Function O/S version Less than V1.60 V1.60 or later ○...
Page 27: Chapter 2 System Configuration
Chapter 2. System Configuration Chapter 2 System Configuration The XGB series has suitable to configuration of the basic, computer link and network systems. This chapter describes the configuration and features of each system. 2.1 XGB System Configuration XGB series System Configuration is as follows. Expanded I/O module and special module are available to connect maximum 7 stages for “S”...
Page 28: Product List
Model Description Remark XEC-DR32H AC 100V~240V power, DC24V input 16 points, relay output 16 points XEC-DN32H AC 100V~240V power, DC24V input 16 points, TR output 16 points XEC-DN32H/DC DC 24V power, DC24V input 16 points, TR output 16 points XEC-DR64H...
Page 29 Chapter 2. System Configuration Types Model Description Remark XBF-HD02A High Speed Counter 2 channel, Line Drive Type Counter XBF-HO02A High Speed Counter 2 channel, Open Collector Type XBF-TC04RT Temperature controller module (RTD input, 4 roof) Temperat XBF-TC04TT Temperature controller module (TC input, 4 roof) XBF-LD02S Loadcell input 2 Channels Loadcell...
Page 30: Classification And Type Of Product Name
32 point None XBC-DN64H/DC 32 point None 32 point 16 point 16 point None XEC-DR32H 16 point None 16 point XEC-DN32H 32 point 32 point None XEC-DR64H AC110V~220V Compact type 32 point None 32 point XEC-DN64H main unit 16 point...
Page 31: Classification And Type Of Expansion Module
Chapter 2. System Configuration 2.3.2 Classification and type of expansion module Name of expansion module is classified as follows. No. of IO point XGB series I/O expansion module Relay output(RY) Transistor output (TN/TP) Digital input (DC) Digital input+ sink type transistor output (DN) Digital input+ source type transistor output (DP) Digital input + relay output (DR) Name...
Page 32: Classification And Type Of Special Module
Chapter 2. System Configuration 2.3.3 Classification and type of special module Special module is classified as follows Non-insulation type (A) Insulation type (S) XGB series No. of IO point Expansion special module Analog input (AD) Analog voltage output (DC) Analog current output (DV) Analog combined module (AH) RTD input (RD) Thermocouple input (TC)
Page 33: Classification And Type Of Communication Module
Chapter 2. System Configuration 2.3.4 Classification and type of communication module Name of communication module is classified as follows. C21A C21A : Cnet 1 channel (RS-232C) C41A: Cnet 1 channel (RS-422/485) XGB series EMTA : Fast Ethernet 1chanel EIMT/F/H: RAPIEnet 2 Port (elec.
Page 34: Classification And Type Of Option Module
Chapter 2. System Configuration 2.3.5 Classification and Type of Option Module Name of option module is classified as follows. M2MB Memory module XGB series Option module Classification Name Type Memory module XBO-M2MB Memory module...
Page 35: System Configuration
Chapter 2. System Configuration 2.4 System Configuration 2.4.1 Cnet I/F system Cnet I/F System is used for communication between the main unit and external devices using RS-232C/RS- 422 (485) Interface. The XGB series has a built-in RS-232C port, RS-485 port and has also XBL-C21A for RS-232C, XBL-C41A for RS-422/485.
Page 36 Chapter 2. System Configuration (c) 1:1 RS-232C Communication with remote device via modem by Cnet I/F modules XEC-DR32H XBL-C21A XEC-DR32H XBL-C21A Modem Modem XEC-DR32H XBL-C21A Modem Modem (d) 1:1 communication of an external device (monitoring unit) with main unit using a built-in RS-232C/485 port.
Page 37 Chapter 2. System Configuration (2) 1:n Communication system (a) Using RS-485 built-in function can connect between one computer and multiple main units for up to 32 stations. XEC-DN32H XEC-DN32H PADT connection Max. 32 stations available Max. 32 stations available Built-in RS-232C connection (b) Using RS-485 built-in function/expansion Cnet I/F module can be connect for up to 32 stations.
Page 38: Ethernet System
Chapter 2. System Configuration 2.4.2 Ethernet system Ethernet made by cooperation of Xerox, Intel, DEC is standard LAN connection method (IEEE802.3), which is network connection system using 1.5KB packet with 100Mbps transmission ability. Since Ethernet can combine a variety of computer by network, it is called as standard specification of LAN and diverse products. By adopting CSMA/CD method, it is easy to configure the network and collect large capacity data.
Page 39: Chapter 3 General Specifications
(0.5G) • Peak acceleration: 147 m/s (15G) • Duration: 11ms Shock resistance • Half-sine, 3 times each direction per each axis AC: ±1,500 V Square wave LS ELECTRIC DC: ±900 V Impulse noise standard Electrostatic IEC61131-2 4kV (Contact discharge) discharge...
Page 40 Chapter 3. General Specification...
Page 41: Chapter 4 Cpu Specifications
Chapter 4. CPU Specifications Chapter 4 CPU Specifications 4.1 Performance Specifications The following table shows the general specifications of the XGB main module type Specifications Items Remark XEC- XEC- XEC- XEC- XEC- XEC- DR32H(/D1) DR64H(/D1) DN32H(/DC) DN64H DP32H DP64H Operator Numb Basic function 136 + Real number operation function...
Page 42 Chapter 4. CPU Specifications Items Specifications Remark Controlled by instructions, Auto-tuning, PWM output, Manual output, Adjustable operation scan time, Anti Windup, Delta MV function, SV- PID control function Ramp function Dedicated protocol support MODBUS protocol support RS-232C 1 port Cnet I/F function User defined protocol support RS-485 1 port 1 phase: 100 kHz 4 channel, 20kHz 4 channel...
Page 43: Names Of Part And Function
Chapter 4. CPU Specifications 4.2 Names of Part and Function XGB Compact type main unit (IEC language) ③ ① ⑤ ⑦ ② ⑥ ④ Name Description ① ▪ Input indicator LED Input indicator LED ▪ PADT connecting USB (USB 1.1 supported) 1 channel, PADT connecting ②...
Page 44: Power Supply Specifications
Chapter 4. CPU Specifications 4.3 Power Supply Specifications Describes power specification of main unit Specification XEC-DR32H XEC-DR64H Items XEC- XEC- XEC- XEC-DN32H XEC-DN64H DN32H/DC DR32H/D1 DR64H/D1 XEC-DP32H XEC-DP64H Rated voltage AC 100 ~ 240 V DC24V DC 12/24V (UL warranty voltage) DC19.2~28.8V...
Page 45 Chapter 4. CPU Specifications (1) Consumption current (DC 5V) (Unit : ㎃) Consumption current Type Model XEC-DR32H XEC-DR64H XEC-DN32H XEC-DN64H Main unit XEC-DP32H XEC-DP64H XEC-DR32H/D1 XEC-DR64H/D1 XBE-DC32A XBE-DC16A/B XBE-DC08A XBE-AC08A XBE-RY16A XBE-RY08A/B XBE-TN32A Expansion I/O module XBE-TN16A XBE-TN08A XBE-TP32A XBE-TP16A...
Page 46 Chapter 4. CPU Specifications XBF-TC04TT (Unit : ㎃) Consumption current Type Model XBF-TC04RT Expansion special module XBF-TC04TT XBF-LD02S XBL-C21A XBL-C41A XBL-EMTA XBL-EIMT/F/H 280/670/480 XBL-EIPT Expansion communication module XBL-CMEA XBL-CSEA XBL-PMEC XBL-PSEA XBL-DSEA XBL-RMEA Memory module XBO-M2MB...
Page 47: Calculation Example Of Consumption Current/Voltage
Consumption of current/voltage is calculated as follows. Internal 5V consumption Type Model Unit No. Remark current (Unit : ㎃) Main unit XEC-DN32H In case contact points are On. XBE-DC32A (Maximum consumption current) XBE-TN32A Expansion XBF-AD04A module All channel is used. XBF-DC04A...
Page 48 Chapter 4. CPU Specifications (3) XGB PLC configuration example 3 Internal 5V consumption Type Model Unit No. Remark current (Unit : ㎃) Main unit XEC-DR64H In case of all contact points are XBE-DR16A (Maximum consumption current) XBE-TN32A Expansion module XBF-AD04A All channel is used.
Page 49: Battery
Chapter 4. CPU Specifications 4.5 Battery Battery is inserted in XGB PLC compact main unit (XEC-DR32/64H, XEC-DN32/64H, XEC-DP32/64H) 4.5.1 Battery specification Items Specifications Nominal voltage / current DC 3.0V / 6.5 mAh Warranty term 3 years(at room temperature) Purpose RTC operation during the blackout Charging time About 6 months(25℃) surroundin...
Page 50 Chapter 4. CPU Specifications 4-10...
Page 51: Chapter 5 Program Configuration And Operation Method
Chapter 5. Program Configuration and Operation Method Chapter 5 Program Configuration and Operation Method 5.1 Program Instruction 5.1.1 Program execution methods (1) Cyclic operation method (Scan) This is a basic program proceeding method of PLC that performs the operation repeatedly for the prepared program from the beginning to the last step, which is called ‘program scan’.
Page 52: Operation Processing During Momentary Power Failure
Chapter 5. Program Configuration and Operation Method (2) Interrupt operation (Cycle time, Internal device) This is the method that stops the program operation in proceeding temporarily and carries out the operation processing which corresponds to interrupt program immediately in case that there occurs the status to process emergently during PLC program execution.
Page 53: Scan Time
Chapter 5. Program Configuration and Operation Method 5.1.3 Scan time The processing time from program step 0 to the next step 0 is called ‘Scan Time’. (1) Scan time calculation expression Scan time is the sum of the processing time of scan program and interrupt program prepared by the user and PLC internal time, and is distinguished by the following formula.
Page 54: Scan Watchdog Timer
Chapter 5. Program Configuration and Operation Method 5.1.4 Scan Watchdog timer WDT (Watchdog Timer) is the function to detect the program congestion by the error of hardware and software of PLC CPU module. (1) WDT is the timer used to detect the operation delay by user program error. The detection time of WDT is set in Basic parameter of XG5000.
Page 55: Program Execution
Chapter 5. Program Configuration and Operation Method 5.2 Program Execution 5.2.1 Configuration of program All functional elements need to execute a certain control process are called as a ‘program’. Program is stored in the built-in RAM mounted on a CPU module or flash memory of a external memory module. The following table shows the classification of the program.
Page 56 Chapter 5. Program Configuration and Operation Method (1) Scan program (a) Function • This program performs the operation repeatedly from 0 step to last step in order prepared by the program to process the signal that is repeatedly regularly every scan. •...
Page 57: Interrupt
Chapter 5. Program Configuration and Operation Method 5.2.3 Interrupt For your understanding of Interrupt function, here describes program setting method of XG5000 which is an XGB programming S/W. Example of interrupt setting is as shown bellows. • Interrupt setting Interrupt source Interrupt name priority Task No.
Page 58 Chapter 5. Program Configuration and Operation Method (1) How to prepare interrupt program Generate the task in the project window of XG5000 as below and add the program to be performed by each task. For further information, please refer to XG5000 user’s manual. (It can be additional when XG5000 is not connected with PLC.) (a) Click right button of mouse on project name and click 『Add item』-『Task』.
Page 59 Chapter 5. Program Configuration and Operation Method (b) The screen of Task setting is shown. Click 『Initialization』 in Execution condition and make a Task name. (c) Click right button of mouse at registered task and select『Add Item』-『Program』.
Page 60 Chapter 5. Program Configuration and Operation Method (d) Make initializing program. In initializing program, INIT_DONE instruction must be made. If not, Scan program is not executed. (2) How to prepare Cycle interrupt program Generate the task in the project window of XG5000 as below and add the program to be performed by each task. For further information, please refer to XG5000 user’s manual.
Page 61 Chapter 5. Program Configuration and Operation Method • It shows setting screen of Task. (b) Task type Classification Description Remark Character, number Task name Make Task name. available “2” is the highest Priority Set the priority of task. (2~7) priority number. Set the Task number.
Page 62 Chapter 5. Program Configuration and Operation Method (c) Click right button of mouse at registered task and select『Add Item』-『Program』. (d) Register the Program name and Program description. 5-12...
Page 63 Chapter 5. Program Configuration and Operation Method (e) It is displayed the program window to write task program. (f) It is displayed the setting in project window. 5-13...
Page 64 Chapter 5. Program Configuration and Operation Method (3) Task type Task type and function is as follows. Type Cycle time task I/O task Internal device task Spec. (Interval task) (Interrupt task) (Single task) Max. Task number Cyclic Rising or falling edge of (setting up to max.
Page 65 Chapter 5. Program Configuration and Operation Method (e) Protection of Program in execution from Task Program 1) In case that the continuity of program execution is interrupted by high priority Task Program during program execution, it is available to prohibit the execution of Task Program partially for the part in problem. In this case, it is available to perform the program protection by ‘...
Page 66 Chapter 5. Program Configuration and Operation Method 3) When setting the execution cycle of cyclic task program, consider the possibility that the demand to execute several cyclic task program at the same time occurs. If 4 cyclic task programs that the cycle is 2sec, 4sec, 10sec and 20sec are used, 4 demands of execution per 20 seconds shall be occurred at the same time and scan time may extend instantaneously.
Page 67 Chapter 5. Program Configuration and Operation Method (6) I/O task program processing It described the I/O task program processing. (%IX0.0.0~%IX0.0.7) (a) Items to be set in Task  Set the execution condition and priority to the task being executed. Check the task no. to manage the task. (b) I/O task processing ...
Page 68 Chapter 5. Program Configuration and Operation Method (7) Internal device task program processing Here describes the processing method of international device task program which extended the task (start condition) of task program from contact point to device as execution range. (a) Items to be set in Task Set the execution condition and priority to the task being executed.
Page 69 Chapter 5. Program Configuration and Operation Method (8) Verification of task program (a) Is the task setting proper? If task occurs frequently more than needed or several tasks occur in one scan at the same time, scan time may lengthen or be irregular. In case not possible to change the task setting, verify max. scan time. (b) Is the priority of task arranged well? The low priority task program shall be delayed by the high priority task program, which results in disabling the processing within the correct time and even task collision may occur as next task occurs in the state that the...
Page 70 Chapter 5. Program Configuration and Operation Method Process per time Time (㎳) Process Scan started and scan program started to execute. Scan program is executed. Scan program is stop because execution external I/O (P000) is requested. And program 3 is executed. Request of execution at 7[ms] is ignored because program 3 has been executing.
Page 71: Operation Mode
Chapter 5. Program Configuration and Operation Method 5.3 Operation Mode For operation mode of CPU module, there are 3 types such as RUN mode, STOP mode and DEBUG mode.. Here describes the operation processing of each operation mode. 5.3.1 RUN mode This is the mode to executed program operation normally.
Page 72: Stop Mode
Chapter 5. Program Configuration and Operation Method 5.3.2 STOP mode This is the mode in stop state without Program operation. It is available to transmit the program through XG5000 only in Remote STOP mode. (1) Processing at Mode Change Clear the output image area and execute output refresh. (2) Operation Processing Contents (a) Executes I/O refresh.
Page 73 Chapter 5. Program Configuration and Operation Method Item Description Remark Change the debug ↔ stop mode Start/Stop Debugging It starts debug operation. Step Over It operates by 1 step. Other Step Into It starts the subroutine program. operation is identical to Step Out It finished the subroutine program.
Page 74 Chapter 5. Program Configuration and Operation Method (c) Step Over ▪ Run the program to next step. At break point, Step over indicator is displayed. error 1 error 2 (d) Breakpoint List ▪ It displays current Breakpoint List. It supports Select All, Reset All, Goto, Remove, Remove All. 5-24...
Page 75 Chapter 5. Program Configuration and Operation Method (e) Break condition ▪ It sets Device Break and Scan Break. Remark 1) Refer to XG5000 Users Manual ‘Chapter 12 Debugging’ for detailed information. 5-25...
Page 76: Change Operation Mode
Chapter 5. Program Configuration and Operation Method 5.3.4 Change operation mode (1) Operation Mode Change Method The method to change operation mode are as follows. (a) By mode key of CPU module (b) By connecting the programming tool (XG5000) to communication port of CPU (c) By changing the operation mode of other CPU module connected to network by XG5000 connected to communication port of CPU.
Page 77: Memory
Chapter 5. Program Configuration and Operation Method 5.4 Memory There are two types of memory in CPU module that the user can use. One is Program Memory that saves the user program written by the user to build the system, and the other is Data Memory that provides the device area to save the data during operation.
Page 78: Data Memory
Chapter 5. Program Configuration and Operation Method 5.4.2 Data memory Contents and size of data memory are as follows. Item Size Data memory entire area 256 KB System area :  I/O information table 143 KB  Forced I/O table ...
Page 79 Chapter 5. Program Configuration and Operation Method 1) Initialization of data according to restart mode There are three variable related with restart mode (Default, initialization and retain variable). Initialization method about each variable in case of executing restart mode is as follows. Mode COLD WARM...
Page 80: Data Memory Map
Chapter 5. Program Configuration and Operation Method 5.4.4 Data Memory Map Data area User program area Z000 Automatic variable Parameter area (32 KB) Z127 User program area %IX0.0.0 Input variable (200 KB) (2 KB) %IX15.15.63 “I” %QX0.0.0 Output variable (2 KB) %QX15.15.63 “Q”...
Page 81: Chapter 6 Cpu Functions
Chapter 6. CPU Functions Chapter 6 CPU Functions 6.1 Type Setting It describes setting of XGB PLC type. CPU type Language Description Reference Series XGB-DR16C3 Dedicated product Module type language “S” type : XBM-DN16/32S , XBM- XGB-XBMS Module type language DR16S “H”...
Page 82: Parameter Setting
Chapter 6. CPU Function 6.2 Parameter Setting This paragraph describes how to set parameters. 6.2.1 Basic parameter setting Clicking Basic Parameter in the project window shows the following window. There are three main options ; “Basic Operation Setup” , “Device Area Setup” and “Error Operation Setup”.
Page 83: I/O Parameter Setting
Chapter 6. CPU Functions Category Item Description Note Fixed period 1~999 ㎳ Set the time of fixed period operation. operation 10~1000 ㎳ Watchdog timer Set the time of scan watchdog. 1,3,5,10,20,70,100 ㎳ Standard input filter Set the time of standard input filter. Basic operations Restart mode...
Page 84 Chapter 6. CPU Function Remark (1) If settings are different with I/O module actually accessed, “Inconsistent module type error” occurs, displaying error. (2) Without settings, CPU reads each I/O module information and operates.
Page 85: Self-Diagnosis Function
Chapter 6. CPU Functions 6.3 Self-diagnosis Function 6.3.1 Saving of error log CPU module logs errors occurred so that the causes will be identified and fixed easily. Clicking 『Error/Warning』 of 『Online』 shows the current error and previous error log. Item Description Remarks Error/Warning...
Page 86: Troubleshooting
Chapter 6. CPU Function 6.3.2 Troubleshooting (1) Trouble types Trouble occurs due to PLC itself, system configuration error or abnormal operation result detected. Trouble is divided into trouble mode stopping operation for the safety and warning mode generating alert to user with a mode in trouble.
Page 87: Remote Functions
Chapter 6. CPU Functions 6.4 Remote Functions CPU module may change operation by communication as well as by key switches mounted on the module. To operate it remotely, it is necessary to set ‘RUN/STOP’ switch to ‘STOP’. (1) Remote operations are as follows. (a) Operable by accessing to XG5000 through RS-232C port mounted on CPU module.
Page 88: Forced Input/Output On And Off Function
Chapter 6. CPU Function 6.5 Forced Input/Output On and Off Function Force I/O function is used to force to turn I/O areas on or off, regardless of program results. 6.5.1 Force I/O setup Click『 Online 』-『 Force I/O 』. Item Description Move address Select base and slot...
Page 89 Chapter 6. CPU Functions 6.5.2 Processing time and processing method of Force Input/Output On and Off (1) Forced Input Regarding input, at the time of input refresh it replaces the data of contact set as Force On/Off among data read from input module with the data as Force and updates input image area. Therefore, user program executes operations with actual input data while Force input area is operated with data set as Force.
Page 90: Direct Input/Output Operation
Chapter 6. CPU Function 6.6 Direct Input/Output Operation Refreshing I/O operates after completion of scan program. If data of I/O is changed while program is scanned, it does not refreshed at the changed moment. Refreshed I/O data is applied after ‘END’ instruction on program. In order to refresh I/O data during program execution, use ‘DIREC_IN, DIREC_OUT’...
Page 91: Diagnosis Of External Device
Chapter 6. CPU Functions 6.7 Diagnosis of External Device This flag is provided for a user to diagnose any fault of external device and, in turn, execute halt or warning of the system. Use of this flag displays faults of external device without any complicated program prepared and monitors fault location without any specific device (XG5000 and etc) or source program.
Page 92: Allocation Of Input/Output Number
Type I/O allocation Remarks stage Input : %IX0.0.0 ~ %IX0.0.63 Real input : %IX0.0.0 ~ %IX0.0.15 XEC-DN32H Output: %QX0.0.0 ~ %QX0.0.63 Real output: %QX0.0.0 ~ %QX0.0.15 Input : %IX0.1.0 ~ %IX0.1.63 XBE-DC32A Real input : %IX0.1.0 ~ %IX0.1.31 Output: %QX0.1.0 ~ %QX0.1.63 Input : %IX0.2.0 ~ %IX0.2.63...
Page 93 Chapter 6. CPU Functions In case of using monitor function of XG5000, I/O allocation information is displayed. I/O contact point allocation information Description of each module 6-13...
Page 94: Online Editing
Chapter 6. CPU Function 6.9 Online Editing It is possible to modify program and communication parameter during operation of PLC without control operation stopped. The following describes basic modification. For details of modifying program, refer to XG5000 Users Manual. Items to be modified during operation are as follows. •...
Page 95 Chapter 6. CPU Functions (4) Upon the modification of program, click 『Online』-『Write Modified Program』. 6-15...
Page 96 Chapter 6. CPU Function (5) Upon the writing of program, click 『Online』-『End Online Editing』. 6-16...
Page 97 Chapter 6. CPU Functions (6) The program background returns and the program modification during run is completed. 6-17...
Page 98: Reading Input/Output Information
Chapter 6. CPU Function 6.10 Reading Input/Output Information It monitors information of individual modules consisted of XGB series system. (1) Click『Online』-『I/O Info』. Then, information of each module connected to the system is monitored. (2) If clicking Details after selecting a module, it displays detail information of a selected module. 6-18...
Page 99: Monitoring
Chapter 6. CPU Functions 6.11 Monitoring It monitors system information of XGB series system. (1) Clicking『Monitor』 displays the following sub-menus. (2) Items and descriptions Item Description Remarks Start/Stop Monitoring Designate the start and stop of monitor. Click for reverse turn. Pause Pause monitoring.
Page 100 Chapter 6. CPU Function (a) Change current value It changes the current value of each device selected in the current program window. (b) Device monitoring It monitors by device (type). 6-20...
Page 101 Chapter 6. CPU Functions (c) Pausing conditions It stops monitoring in case a device value set in the program corresponds. (d) Trend monitoring It displays device values graphically. 6-21...
Page 102 Chapter 6. CPU Function (e) Custom events 1) It monitors detail information when an event set by a user occurs. Additional user event may be registered. 2) It sets basic setting and relative device. If rising edge of %MX0 device occurs, it records the message of an alarm, “Out of order Water Tank 1” and the device values of DATA (%MW0), %MW100, tog_4s device are recorded.
Page 103 Chapter 6. CPU Functions 3) Set the relative device(s). 4) Monitor event history of custom event. 6-23...
Page 104 Chapter 6. CPU Function 5) Double-clicking a number produced monitors the relative values of device and the detail message as follows. Remark ▪For details of monitor, refer to XG5000 Users Manual. 6-24...
Page 105: Rtc Function
Chapter 6. CPU Functions 6.12 RTC function XGB PLC supports the RTC (clock) function and user can use this function for time management of system or error log. RTC function is executed steadily when power is off or instantaneous power cut status. Current time of RTC is renewed every scan by system operation status information flag.
Page 106 Chapter 6. CPU Function (c) Modification of clock data by program You can set clock data by program. It is used when you make system to set clock manually by external Digit switch or modify clock periodically through network. ‘RTC-SET’ function block is used to write the clock data to a clock. If you input the clock data and execute the function block, it writes the clock data to a clock at the scan end.
Page 107: Exernal Memory Module
Chapter 6. CPU Functions 6.13 External Memory Module You can save the user program safely and download the program into the system when program is damaged without special manipulation by using external memory module. 6.13.1 Memory module specification Item XBO-M2MB Ref.
Page 108: How To Use Memory Module
Chapter 6. CPU Function 6.13.3 How to use memory module (1) Save program, parameter, communication parameter at external memory module (a) Set the switch of memory module as 1 (b) Install memory module at the RS-232C port of main unit - After installation, program and parameter (including communication) is saved into memory module and READ LED is on - If Saving program and parameter is complete, READ LED is off...
Page 109 Chapter 6. CPU Functions (c) ‘Write’ window is created as follows. (d) “Writing completed” window appears. (e) With above method, through PADT, you can save program, parameter, communication parameter at XBO-M2MB 6-29...
Page 110 Chapter 6. CPU Function (4) Open from memory module (a) Set the mode switch of XBO-M2MB as “5” and connect XBO-M2MB to USB port of PC (b) Select “Project  Open from Memory” on XG5000 menu (c) “Read” window is created as follows. 6-30...
Page 111 Chapter 6. CPU Functions (d) “Reading is completed” window appears. (e) With above method, through PADT, you can save program, parameter, communication parameter from XBO-M2MB 6-31...
Page 112: How To Use When Password Is Set
Chapter 6. CPU Function 6.13.4 How to use when password is set (1) When connecting PADT with memory module (a) When setting password at program and writing program to memory module, it is saved according to rotary switch operating mode without functions cancelling the password 1) When writing program, check whether to use password at ‘Write’...
Page 113 Chapter 6. CPU Functions (b) When reading password-set program to PADT, screen appears, which is same as when password is set in PLC. 1) “Password” window is created. 2) If you input password same as that in memory module, it reads program. 3) When password is incorrect, error message appears as follows.
Page 114 Chapter 6. CPU Function (3) Reading program in PLC to memory module (a) When password of program in PLC is not set 1) When no password is set in the memory module - Reads program from PLC 2) When password is set in the memory module - After reading, it clears password of the memory module (b) When password of program in PLC is set 1) When no password is set in the memory module...
Page 115: Clear All Plc
Chapter 6. CPU Functions 6.14 Clear All PLC Clear All PLC function clears parameter, program, data, password saved on PLC (1) How to clear all PLC (a) Click 『Online』-『Clear All PLC』. (b) After selection connection method, click 『Connect』 or 『OK』. (c) If you select 『Yes』...
Page 116: Password Setting Per Program Block
Chapter 6. CPU Function 6.15 Password Setting per Program Block Password Setting per Program Block function sets password for each program block. You should input password to open program. (1) How to set program block password (a) Click 『Properties』 after selecting program in project window. (b) Click password tap.
Page 117 Chapter 6. CPU Functions (3) How to delete program block password (a) After program in project window, click 『Properties』. (b) Click password tap. (c) After inputting previous password, click 『Delete』. (d) Click 『OK』. 6-37...
Page 118 Chapter 6. CPU Function 6-38...
Page 119: Chapter 7 Input/Output Specifications
Chapter 7. Input/Output Specifications Chapter 7 Input/Output Specifications 7.1 Introduction Here describes the notices when selecting digital I/O module used for XGB series. (1) For the type of digital input, there are two types such as current sink input and current source input. (2) The number of max.
Page 120 Chapter 7 Input/Output Specifications (7) Relay life of Relay output module is shown as below. Max. life of Relay used in Relay output module is shown as below. AC 125V Resistive load DC 30V Resistive load AC 250V Resistive load Open/Close current (A)
Page 121 Chapter 7. Input/Output Specifications (8) Terminal blocks are of barrier type and pluggable type, and pluggable terminal blocks have screw type and push-in type depending on the connection method. 1) Barrier terminal block As a terminal block mainly applied to the XGB compact type basic unit, crimp terminals with insulation sleeves cannot be used.
Page 122 Chapter 7 Input/Output Specifications stripping of the sheath can result in poor contact with the crimp area of the ferrule. Tighten the terminal block screws as follows. Screw thread Flat screwdriver size 0.4 x 2.5 Tightening torque 0.2 N·m (9) Relay life graph is not written based on real use. (This is not a guaranteed value). So consider margin. Relay life is specified under following condition.
Page 123 Chapter 7. Input/Output Specifications (a) Setting input filter 1) Click I/O Parameter』in the project window of XG5000 2) Click『Module』 at the slot location.
Page 124 Chapter 7 Input/Output Specifications 3) Set I/O module really equipped. 4) After setting I/O module, click Input Filter. 5) Set filter value.
Page 125 Chapter 7. Input/Output Specifications (b) Setting output status in case of error 1) Click Emergency Out in the I/O parameter setting window. 2) Click Emergency Output. If it is selected as Clear, the output will be Off and if Hold is selected, the output will be kept.
Page 126: Digital Input Specifications Of Main Unit
Chapter 7 Input/Output Specifications 7.2 Digital Input Specifications of Main Unit 7.2.1 XEC-DR32H / XEC-DN32H input unit (Source/Sink type) Model Main unit XEC-DN32H(/DC) XEC-DR32H XEC-DR32H/D1 Specification XEC-DP32H Input point 16 point Insulation method Photo coupler insulation Rated input voltage DC24V...
Page 127: Xec-Dr64H / Xec-Dn64H Input Unit (Source/Sink Type)
Chapter 7. Input/Output Specifications 7.2.2 XEC-DR64H / XEC-DN64H input unit (Source/Sink Type) Model Main unit XEC-DN64H XEC-DR64H XEC-DR64H/D1 Specification Input point 32 point Insulation method Photo coupler insulation Rated input voltage DC24V DC 12/24V About 5/10 ㎃ About 4 ㎃ (point 0~7: About 10 ㎃) Rated input current (point 0~7: About 7/15 ㎃) DC 9.5~30V...
Page 128: Digital Output Specification Of Main Unit
Chapter 7 Input/Output Specifications 7.3 Digital Output Specification of Main Unit 7.3.1 XEC-DR32H output unit Model Main unit XEC-DR32H Specification Output point 16 point Insulation method Relay insulation Rated load DC24V 2A (Resistive load) / AC220V 2A (COSΦ = 1), 5A/COM voltage/current Min.
Page 129: Xec-Dr64H Output Unit
Chapter 7. Input/Output Specifications 7.3.2 XEC-DR64H output unit Model Main unit Specification XEC-DR64H Output point 32 point Insulation method Relay insulation Rated load DC24V 2A (resistive load) / AC220V 2A (COSΦ = 1), 5A/COM voltage/current Min. load DC5V / 1 ㎃ voltage/current Max.
Page 130: Xec-Dn32H Output Unit (Sink Type)
Chapter 7 Input/Output Specifications 7.3.3 XEC-DN32H output unit (Sink type) Model Main unit Specification XEC-DN32H(/DC) Output point 16 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Range of load voltage DC 10.2 ~ 26.4V General output : 0.5A / 1 point, 2A / 1COM Max.
Page 131: Xec-Dp32H Output Unit (Source Type)
Chapter 7. Input/Output Specifications 7.3.4 XEC-DP32H output unit (Source type) Model Main unit Specification XEC-DP32H Output point 16 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Range of load voltage DC 10.2 ~ 26.4V General output: 0.5A/1 point, 2A / 1COM Max.
Page 132: Xec-Dn64H Output Unit (Sink Type)
Chapter 7 Input/Output Specifications 7.3.5 XEC-DN64H output unit (Sink type) Model Main unit Specification XEC-DN64H Output point 32 point Insulation method Photo coupler insulation Rated load DC 12 / 24V voltage Load voltage range DC 10.2 ~ 26.4V General output : 0.5A / 1 point, 2A / 1COM Max.
Page 133: Xec-Dp64H Output Unit (Source Type)
Chapter 7. Input/Output Specifications 7.3.6 XEC-DP64H Output unit (Source type) Model Main unit Specification XEC-DP64H point Output point Insulation method Photo coupler insulation Rated load DC 12 / 24V voltage Load voltage range DC 10.2 ~ 26.4V General output: 0.5A/1 point, 2A / 1COM Max.
Page 134: Digital Input Module Specification
Chapter 7 Input/Output Specifications 7.4 Digital Input Module Specification 7.4.1 8 point DC24V input module (Source/Sink type) Model DC input module XBE-DC08A Specification Input point 8 point Insulation method Photo coupler insulation Rated input voltage DC24V About 4 ㎃ Rated input current Operation voltage range DC20.4~28.8V (ripple rate <...
Page 135: Point Dc24V Input Module (Sink/Source Type)
Chapter 7. Input/Output Specifications 7.4.2 16 point DC24V input module (Sink/Source type) Model DC input module XBE-DC16A XBE-DC16B Specification Input point 16 point Insulation method Photo coupler insulation Rated input voltage DC24V DC 12/24V About 4 ㎃ Rated input current About 4/8mA DC20.4~28.8V DC 9.5V~30V...
Page 136: Point Dc24V Input Module (Source/Sink Type)
Chapter 7 Input/Output Specifications 7.4.3 32 point DC24V input module (Source/Sink type) Model DC input module XBE-DC32A Specification Input point 32 point Insulation method Photo coupler insulation Rated input voltage DC24V About 4 ㎃ Rated input current Operation voltage range DC20.4~28.8V (ripple rate <...
Page 137: Point Ac110V Input Module
Chapter 7. Input/Output Specifications 7.4.4 8point AC110V input module Model AC input module XBE-AC08A Specification Input point 8 point Insulation method Photo coupler insulation AC100-120V(+10/-15%) 50/60 ㎐(±3 ㎐) (distortion rate < 5%) Rated input voltage About 8 ㎃(AC100,60 ㎐), About 7mA(AC100, 50 ㎐) Rated input current Max.
Page 138: Digital Output Module Specifications
Chapter 7 Input/Output Specifications 7.5 Digital Output Module Specification 7.5.1 8 point relay output module Model Relay output module XBE-RY08A Specification Output point 8 point Insulation method Relay insulation Rated load voltage / Current DC24V 2A (Resistive load) / AC220V 2A (COSΨ = 1), 5A/COM DC5V / 1 ㎃...
Page 139 Chapter 7. Input/Output Specifications 7.5.2 16 point relay output module Model Relay output module XBE-RY16A Specification Output point 16 point Insulation method Relay insulation Rated load voltage/ current DC24V 2A (Resistive load) / AC220V 2A (COSΨ = 1), 5A/COM DC5V / 1 ㎃ Min.
Page 140: Point Transistor Output Module (Sink Type)
Chapter 7 Input/Output Specifications 7.5.3 8 point transistor output module (Sink type) Model Transistor output module XBE-TN08A Specification Output point 8 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Load voltage range DC 10.2 ~ 26.4V Max.
Page 141: Point Transistor Output Module (Sink Type)
Chapter 7. Input/Output Specifications 7.5.4 16 point transistor output module (Sink type) Model Transistor output module XBE-TN16A Specification Output point 16 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Load voltage range DC 10.2 ~ 26.4V Max.
Page 142 Chapter 7 Input/Output Specifications 7.5.5 32 point transistor output module (Sink type) Model Transistor output module XBE-TN32A Specification Output point 32 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Load voltage range DC 10.2 ~ 26.4V Max.
Page 143: Point Transistor Output Module (Source Type)
Chapter 7. Input/Output Specifications 7.5.6 8 point transistor output module (Source type) Model Transistor output module XBE-TP08A Specification Output point 8 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Load voltage range DC 10.2 ~ 26.4V Max.
Page 144 Chapter 7 Input/Output Specifications 7.5.7 16 point transistor output module (Source type) Model Transistor output module XBE-TP16A Specification Output point 16 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Load voltage range DC 10.2 ~ 26.4V Max.
Page 145: Point Transistor Output Module (Source Type)
Chapter 7. Input/Output Specifications 7.5.8 32 point transistor output module (Source type) Model Transistor output module XBE-TP32A Specification Output point 32 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Load voltage range DC 10.2 ~ 26.4V Max.
Page 146: Combined Module Digital Input Specification
Chapter 7 Input/Output Specifications 7.6 Combined Module Digital Input Specification 7.6.1 8 point DC24V input part (Source/Sink type) Model DC input module XBE-DR16A Specification Input Point 8 point Insulation method Photo coupler insulation Rated input voltage DC24V About 4 ㎃ Rated input current Used voltage range DC20.4~28.8V (Within ripple rate 5%)
Page 147: Point Dc24V Input (Source/Sink Type)
Chapter 7. Input/Output Specifications 7.6.2 16 point DC24V input (Source/Sink type) Model DC input module Specification XBE-DN32A Input point 16 point Insulation method Photo coupler insulation Rated input voltage DC24V About 4 ㎃ Rated input current Operation voltage range DC20.4~28.8V (ripple rate < 5%) Input Derating Refer to Derating diagram DC 19V or higher / 3 ㎃...
Page 148: Combined Module Digital Output Specification
Chapter 7 Input/Output Specifications 7.7 Combined Module Digital Output Specification 7.7.1 8 point relay output part Model Relay output module XBE-DR16A Specification Output point 8 point Insulation method Relay insulation DC24V 2A(resistive load 하) / AC220V 2A(COSΨ = 1), 5A/COM Rated load voltage/current DC5V / 1 ㎃...
Page 149: Point Transistor Output (Sink Type)
Chapter 7. Input/Output Specifications 7.7.2 16 point transistor output (Sink type) Model Transistor output module Specification XBE-DN32A Output point 16 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Load voltage range DC 10.2 ~ 26.4V Max.
Page 150: Io Wiring By Using Smart Link Board
Chapter 7 Input/Output Specifications 7.8 IO Wiring by Using Smart Link Board 7.8.1 Smart link board Easy wiring is available by connecting the IO connector with smart link board. The available smart link and IO cable are as follows. Smart link Connection cable Classification Model...
Page 151 Chapter 7. Input/Output Specifications 2) Wiring of XTB-40H and XGB extension modulet Wiring of XGB extension module through XTB-40H and C40HH-10SB-XBE SLT-CT101-XBE is as follows. At this time, relationship of XGB IO signal and Smart link board terminal number is as follows. The following figure describes signal allocation when C40HH-10SB -XBE is used as connection cable.
Page 152 Chapter 7 Input/Output Specifications 3) I/O wiring - XBE-DC32A (XTB-40H) Contact No. - XBE-TN32A (XTB-40H) Contact No. - XBE-TP32A (XTB-40H) Contact No. 7-34...
Page 153 Chapter 7. Input/Output Specifications - XBE-TN32A (R32C-NS5A-40P) 7-35...
Page 154: Chapter 8 Built-In High-Speed Counter Function
Chapter 8 Built-in High-speed Counter Function Chapter 8 Built-in High-speed Counter Function XGB series have built-in function of High-speed counter in main unit. This chapter describes specifications and usage of High-speed counter’s function. 8.1 High-speed Counter Specifications  It describes specifications, setting and usage of function, programming and wiring with external device of built-in main unit.
Page 155: Designation Of Parts
Chapter 8 Built-in High-speed Counter Function (2) Counter/Preset input specification Spcification XEC-DR32H/DR64H Classification XEC-DR32H/D1 XEC-DN32H(/DC)/DN64H XEC-DR64H/D1 XEC-DP32H/DP64H 24V DC (20.4V ~ 28.8V) 12V DC (9.5~30V) Input voltage Input current 4㎃ 4㎃ On guranteed voltage (min.) 20.4V Off guranteed voltage (max.) 8.1.2 Designation of parts...
Page 156 Chapter 8 Built-in High-speed Counter Function (2) Interface with external devices The following table shows list of interface with external device. On/Off Signal Terminal guaranteed Internal circuit ※2 1-phase 2-phase voltage 20.4~28.8V Ch 0 Ch 0 IX0.0.0 Pulse input A-phase input 2.7 kΩ...
Page 157: Counter Function
Chapter 8 Built-in High-speed Counter Function 8.1.3 Counter Function (1) Counter mode (a) High Speed counter module can count High Speed pulses which can not be processed by CPU module’s counter Function Block (CTU, CTD, CTUD, etc.), up to binary value of 32 bits (- 2,147,483,648 ~ 2,147,483,647).
Page 158 Chapter 8 Built-in High-speed Counter Function ● Operation example A-phase input pulse B-phase input pulse Count value 7 Decreasing Increasing Increasing 2) 2-phase count mode a) 2-phase 4-multiplication operation mode A-phase input pulse and B-phase input pulse count at rising/falling respectively. If A-phase input is antecedent to B-phase input, increasing operation starts, and if B-phase input is antecedent to A-phase input, decreasing operation starts.
Page 159 Chapter 8 Built-in High-speed Counter Function (2) Counter mode 2 types of count (Linear counter, Ring counter) can be selected for the applicable use based on functions. ▪ Counter mode is saved at the following special K area. Area per each channel (word) Mode Ref.
Page 160 Chapter 8 Built-in High-speed Counter Function +2,147,483,647 Decreasing Increasing -2,147,483,648 Count start point Borrow Carry (b) Ring count Set Ring Counter Min. Value and Max. value. Preset value and compared set value should be in range of ring counter min. value and max. value. •...
Page 161 Chapter 8 Built-in High-speed Counter Function ▪ Range of Ring counter: user defined min. value ~ user defined max. value ▪ Counter display: in case of using ring counter, user defined max. value is not displayed. 1) During increasing count ■...
Page 162 Chapter 8 Built-in High-speed Counter Function 3) Operation when setting Ring Count based on present count value (during increasing count) ■ When setting the ring count, the current count value is below the minimum value of the ring counter. - Opens an error (Code No. 27), operates as a linear counter, and operates as a ring count when the current count value falls within the range of the ring count (error codes are not cleared).
Page 163 Chapter 8 Built-in High-speed Counter Function 4) Operation when setting Ring Count based on present count value (during decreasing count) ■ When setting the ring count, the current count value is below the minimum value of the ring counter. - When an error (Code No. 27) is displayed, it operates as a linear counter, and if the current count value falls within the range of the ring count, it operates as a ring count.
Page 164 Chapter 8 Built-in High-speed Counter Function (3) Compared output (a) High Speed counter module has a compared output function used to compare present count value with compared value in size to output as compared. (b) Available compared outputs are 2 for 1 channel, which can be used separately. (c) Compared output conditions are 7 associated with >, =, <...
Page 165 Chapter 8 Built-in High-speed Counter Function ■ In order to output the compared output signal, compared output enable flag set to ‘1’ after compared output condition set. Area per channel Classification Operation Ch. 0 Ch. 1 Ch. 2 Ch. 3 Ch.
Page 166 Chapter 8 Built-in High-speed Counter Function (e) Detail of comparator output It describes detail of comparator output (based on comparator output 0) 1) Mode 0 (Present value < Compared value) If counted present value is less than the minimum value of compared output 0, output is sent out, and if present value increases to be equal to or greater than the minimum value of compared output 0, output is not sent out.
Page 167 Chapter 8 Built-in High-speed Counter Function 3) Mode 2 (Count value = Compared value) If present count value is equal to the minimum set value of compared output 0, output is sent out. In order to turn the output Off, Compared output Enable signal 0 or Compared Coincidence Output Enable signal 0 is to be Off.
Page 168 Chapter 8 Built-in High-speed Counter Function 5) Mode 4 (Count value > Compared Output value) ■ If present count value is greater than the minimum set value of compared output 0, output is sent out, and if count value decreases to be less than or equal to the minimum set value of compared output 0, output is not sent out.
Page 169 Chapter 8 Built-in High-speed Counter Function 7) Mode 6 (Count value ≤ Min. set value of Compared Output 0 or Count value ≥ Max. set value of Compared Output 0) ■ If present count value is less than or equal to the minimum set value of compared 0 and greater than or equal to the maximum set value of compared 0, output is sent out, and if count value increases/decreases to exceed compared value’s range, output is not sent out.
Page 170 Chapter 8 Built-in High-speed Counter Function (4) Carry signal (a) Carry signal occurs 1) When count range maximum value of 2,147,483,647 is reached during Linear Count. 2) When user-defined maximum value of Ring Count changed to the minimum value during Ring Count. (b) Count when Carry Signal occurs 1) Count stops if Carry occurs during Linear Count.
Page 171 Chapter 8 Built-in High-speed Counter Function (6) Revolution/Unit time While the Flag about the number of revolution per unit time is On, it counts the number of input pulses for a specified time. (a) Setting 1) Set the unit time and the number of pulse per 1 revolution. Setting value is saved at the following special K area and user can designate directly.
Page 172 Chapter 8 Built-in High-speed Counter Function (b) Count function of Revolution/Unit time is used to count the number of pulses for a specified time while auxiliary mode enable signal is On. (c) With the displayed number of pulses updated for a specified time and the number of pulses per revolution input, Revolution/Unit time can be counted.
Page 173 Chapter 8 Built-in High-speed Counter Function (g) The example that number of pulse per 1 revolution set to ‘10’ and time is set to 60,000 ms is as shown below. Command 1000 Revolution per time 60000㎳ 60000㎳ 60000㎳ 60000㎳ (7) Count latch When Count latch signal is On, present count value is latched.
Page 174 Chapter 8 Built-in High-speed Counter Function (8) Preset function It changes the current value into preset value. There are two types of preset function, internal preset and external preset. External preset is fixed as input contact point. • Preset setting value is saved at the following special K area. Area per each channel (Double word) Type Ref.
Page 175: Installation And Wiring
Chapter 8 Built-in High-speed Counter Function 8.2 Installation and Wiring 8.2.1 Precaution for wiring Pay attention to the counteractions against wiring noise especially for High-speed pulse input. (1) Surely use twisted pair shielded cable, grounded with 3 class applied. (2) Keep away from power cable or I/O line which may cause noise. (3) Stabilized power should be used for filter.
Page 176 Chapter 8 Built-in High-speed Counter Function Pulse Generator High-speed counter input 24VG 8-23...
Page 177: Internal Memory
Chapter 8 Built-in High-speed Counter Function 8.3 Internal Memory 8.3.1 Special area for High-speed counter Parameter and operation command area of built-in high-speed counter use a special K device. If values set in parameter are changed, it works with the changed values. At the moment, makes sure to use APM_WRT function to save the changed value to flash.
Page 178 Chapter 8 Built-in High-speed Counter Function (1) Parameter setting area Description Device area per channel Remark Parameter Ch 0 Ch 1 Ch 2 Ch 3 Value Setting Ch 4 Ch 5 Ch 6 Ch 7 %KW300 %KW330 %KW360 %KW390 h0000 Linear count Counter Word...
Page 179 Chapter 8 Built-in High-speed Counter Function Description Device area per channel Remark Parameter Ch 0 Ch 1 Ch 2 Ch 3 Value Setting Ch 4 Ch 5 Ch 6 Ch 7 %KD154 %KD169 %KD184 %KD199 Ring counter min. value -2,147,483,648 ~ 2,147,483,645 DWord %KD1114 %KD1129 %KD1144 %KD1159 setting...
Page 180 Chapter 8 Built-in High-speed Counter Function Description Device area per channel Remark Parameter Ch 0 Ch 1 Ch 2 Ch 3 Value Setting Ch 4 Ch 5 Ch 6 Ch 7 HFFFF No use %QX0.0.1 h0000 %QX0.0.2 h0001 %QX0.0.3 h0002 %QX0.0.4 %KW321 %KW351 %KW381 %KW411...
Page 181 Chapter 8 Built-in High-speed Counter Function (2) Operation command Device area per channel Parameter Ch 0 Ch 1 Ch 2 Ch 3 Ch 4 Ch 5 Ch 6 Ch 7 %KX4160 %KX4320 %KX4480 %KX4640 %KX34880 %KX35040 %KX35200 %KX35360 Counter enabling Internal preset designation %KX4161 %KX4321 %KX4481 %KX4641 %KX34881 %KX35041 %KX35201 %KX35361 of counter...
Page 182: Error Code
Chapter 8 Built-in High-speed Counter Function 8.3.2 Error code It describes errors of the built-in high-speed counter. ▪ Error occurred is saved in the following area. Device area per channel Category Remark %KW266 %KW276 %KW286 %KW296 %KW2186 %KW2196 %KW2206 %KW2216 Error code Word ▪...
Page 183: Examples: Using High-Speed Counter
Chapter 8 Built-in High-speed Counter Function 8.4 Examples: Using High-speed Counter It describes examples of using high-speed counter. (1) Setting high-speed counter parameter How to set types of parameters to operate a high-speed counter is described as follows. (a) Set 『Internal Parameters』 in the basic project window. (b) Selecting high-speed counter opens a window to set high-speed counter parameters as follows.
Page 184 Chapter 8 Built-in High-speed Counter Function (c) Turn ‘ON’ the high-speed counter Enable signal (CH0:%KX4160) in the program. (d) To use additional functions of the high-speed counter, you needs to turn on the flag allowing an operation command. * Refer to 2. Operation Command, <8.3.1 Special K Area for High-speed Counter> For instance, turn on %KX4165 bit if among additional functions, rotation number function is used.
Page 185 Chapter 8 Built-in High-speed Counter Function (2) Monitoring and setting command Monitoring and command setting of high-speed counter are described as follows. (a) If starting a monitor and clicking a Special Module Monitor, the following window is opened. (b) Clicking 『Monitor』 shows monitor and test window of high-speed counter. 8-32...
Page 186 Chapter 8 Built-in High-speed Counter Function Item Description FLAG Monitor Show flag monitoring and command window of high-speed counter Start Monitoring Start monitoring each item (special K device area monitor). Write each item setting to PLC. Test (Write the setting to special K device) Close Close monitor (c) Clicking 『Start Monitoring』shows the high-speed counter monitor display, in which you...
Page 187 Chapter 8 Built-in High-speed Counter Function (d) Clicking『FLAG Monitor』 shows the monitor of each flag in high-speed counter, in which you may direct operation commands by flags (clicking commands reverse turn). 8-34...
Page 188: Chapter 9 Installation And Wiring
Chapter 9. Installation and Wiring Chapter 9 Installation and Wiring 9.1 Safety Instruction Danger  Please design protection circuit at the external of PLC for entire system to operate safely because an abnormal output or an malfunction may cause accident when any error of external power or malfunction of PLC module.
Page 189: Fail Safe Circuit
Chapter 9. Installation and Wiring Danger Don’t close the control line or communication cable to main circuit or power line. Distance should be more than 100mm. It may cause malfunction by noise. In case of controlling lamp load, heater, solenoid valve, etc. in case of Off -> On, large current (10 times of normal current) may flows, so consider changing the module to module that has margin at rated current.
Page 190 Chapter 9. Installation and Wiring (1) example of system design (In case of not using ERR contact point of power module) In case of AC In case of AC . DC Power Power Check direct Trans Trans current Trans Fuse Fuse Signal input Fuse...
Page 191 Chapter 9. Installation and Wiring Checking Trans Trans Fuse Fuse current Signal input F0045 DC power Start stop circuit F009C Fuse Timer setting PLC RUN output which DC input Available to start as signal is configured. Program Start Stop SW Voltage relay equipped Output module...
Page 192 Chapter 9. Installation and Wiring (3) Fail safe countermeasure in case of PLC error Error of PLC CPU and memory is detected by self diagnosis but in case error occurs in IO control part, etc., CPU can detect the error. At this case, though it is different according to status of error, all contact point is on or off, so safety may not be guaranteed.
Page 193: Plc Heat Calculation
Chapter 9. Installation and Wiring 9.1.2 PLC heat calculation (1) Power consumption of each part (a) Power consumption of module The power conversion efficiency of power module is about 70% and the other 30% is gone with heat; 3/7 of the output power is the pure power consumption. Therefore, the calculation is as follows.
Page 194 Chapter 9. Installation and Wiring (e) Input average power consumption of input module (power consumption of simultaneous On point) • W X E X input point X simultaneous On rate (W) : input current (root mean square value in case of AC) (A) E : input voltage (actually used voltage) (V) (f) Power consumption of special module power assembly •...
Page 195: Attachment/Detachment Of Modules
Chapter 9. Installation and Wiring 9.2 Attachment/Detachment of Modules 9.2.1 Attachment/Detachment of modules Caution in handling Use PLC in the range of general specification specified by manual. In case of using out of range, it may cause electric shock, fire, malfunction, damage of product. Warning ...
Page 196 Chapter 9. Installation and Wiring • Get up the hook for fixation of upper part and lower part and disconnect it. • Detach the module with two hands. (Don’t force over-applied force.) Caution  When separating module, don’t force over-applied power. If so, hook may be damaged.
Page 197 Chapter 9. Installation and Wiring (3) Installation of module Since XGB PLC equips Hook for DIN rail (width of rail: 35mm), so XGB can be installed at DIN rail. (a) When installing module at DIN rail • Pull Hook for DIN rail and install module at DIN rail •...
Page 198 Chapter 9. Installation and Wiring (4) Module equipment location Keep the following distance between module and structure or part for well ventilation and easy detachment and attachment. 30 ㎜ or above 20 ㎜ or above 30 ㎜ or above 5 ㎜ or above 5 ㎜...
Page 199 Chapter 9. Installation and Wiring (6) Distance with other device To avoid radiation noise or heat, keep the distance between PLC and device (connector and relay) as far as the following figure. Device installed in front of PLC: 100 ㎜ or above Device installed beside PLC: 50 ㎜...
Page 200 Chapter 9. Installation and Wiring 9.2.2 Caution in handling Here describes caution from open to install • Don’t drop or impact product. • Don’t disassemble the PCB from case. It may cause the error. • In case of wiring, make sure foreign substance not to enter upper part of module. If it enters, eliminate it. (1) Caution in handling IO module It describes caution in handling IO module.
Page 201: Wire
Chapter 9. Installation and Wiring 9.3 Wire In case using system, it describes caution about wiring. Danger When wiring, cut off the external power. If all power is cut, it may cause electric shock or damage of product. In case of flowing electric or testing after wiring, equip terminal cover included in product. It not, it may cause electric shock.
Page 202 Chapter 9. Installation and Wiring (3) Isolate the PLC power, I/O devices and power devices as follows. Main unit Main power Constant power Voltage AC220V Transformer AC100-240V IO power Main circuit device (4) If using DC24V of the power module (a) Do not connect DC24V of several power modules in parallel.
Page 203 Chapter 9. Installation and Wiring (8) To prevent surge from lightning, use the lightning surge absorber as presented below. I/O device Surge absorber to prevent Note (1) Isolate the grounding(E1) of lightning surge absorber from the grounding(E2) of the PLC. (2) Select a lightning surge absorber type so that the max.
Page 204: I/O Device Wiring
Chapter 9. Installation and Wiring I/O Device wiring 9.3.2 (1) The size of I/O device cable is limited to 0.3~2 mm but it is recommended to select a size(0.3 mm ) to use conveniently. (2) Please isolate input signal line from output signal line. (3) I/O signal lines should be wired 100mm and more away from high voltage/high current main circuit cable.
Page 205: Specifications Of Wiring Cable
Chapter 9. Installation and Wiring Specifications of wiring cable 9.3.4 The specifications of cable used for wiring are as follows. Cable specification (mm Types of external Temperature Wire Type connection rating Lower limit Upper limit Digital input 0.18 (AWG24) 1.5 (AWG16) Digital output 0.18 (AWG24) 2.0 (AWG14)
Page 206: Chapter 10 Maintenance
Chapter 10. Maintenance Chapter 10 Maintenance Be sure to perform daily and periodic maintenance and inspection in order to maintain the PLC in the best conditions. 10.1 Maintenance and Inspection The I/O module mainly consist of semiconductor devices and its service life is semi-permanent. However, periodic inspection is requested for ambient environment may cause damage to the devices.
Page 207: Periodic Inspection
Chapter 10. Maintenance 10.3 Periodic Inspection Check the following items once or twice every six months, and perform the needed corrective actions. Corrective Check Items Checking Methods Judgment Actions Ambient 0 ~ 55 °C Adjust to general temperature -. Measure with thermometer standard Ambient Ambient Humidity...
Page 208: Chapter 11 Troubleshooting
Chapter 11. Troubleshooting Chapter 11 Troubleshooting The following explains contents, diagnosis and corrective actions for various errors that can occur during system operation. 11.1 Basic Procedure of Troubleshooting System reliability not only depends on reliable equipment but also on short downtimes in the event of fault. The short discovery and corrective action is needed for speedy operation of system.
Page 209 Chapter 11. Troubleshooting 11.2.1 Troubleshooting flowchart used when the PWR (Power) LED turns Off. The following flowchart explains corrective action procedure used when the power is supplied or the power LED turns Off during operation. Power LED is turned Off. Is the power supply Supply the power.
Page 210: Troubleshooting Flowchart Used With When The Err(Error) Led Is Flickering
Chapter 11. Troubleshooting 11.2.2 Troubleshooting flowchart used with when the ERR (Error) LED is flickering The following flowchart explains corrective action procedure use when the power is supplied starts or t he ERR LED is flickering during operation. STOP LED goes flickering Check the error code, with connected XG5000.
Page 211 Chapter 11. Troubleshooting 11.2.3 Troubleshooting flowchart used with when the RUN LED turns Off. The following flowchart explains corrective action procedure to treat the lights-out of RUN LED when the power is supplied, operation starts or operation is in the process. RUN LED is Off.
Page 212 Chapter 11. Troubleshooting 11.2.4 Troubleshooting flowchart used when the I/O part doesn’t operate normally. The following flowchart explains corrective action procedure used when the I/O module doesn’t operate normally. When the I/O module doesn’t work normally. I\s the output LED of SOL1 Replace the connector of Measure the voltage of terminal Correct wiring.
Page 213 Chapter 11. Troubleshooting Continue Are the indicator LED of the switch 1 and 2 on? Check voltage of switch 1,2 Check voltage of switch 1,2 by tester by tester Is the Is the measured value terminal screw tighten Is the measured value securely? normal? normal?
Page 214: Troubleshooting Questionnaire
Chapter 11. Troubleshooting 11.3 Troubleshooting Questionnaire When problems have been met during operation of the XGC series, please write down this Questionnaires and contact the service center via telephone or facsimile.  For errors relating to special or communication modules, use the questionnaire included in the User’s manual of the unit.
Page 215: Troubleshooting Examples
Chapter 11. Troubleshooting 11.4 Troubleshooting Examples Possible troubles with various circuits and their corrective actions are explained. 11.4.1 Input circuit troubles and corrective actions The followings describe possible troubles with input circuits, as well as corrective actions. Cause Condition Corrective Actions Leakage current of external device ...
Page 216: Output Circuit And Corrective Actions
Chapter 11. Troubleshooting 11.4.2 Output circuit and corrective actions The following describes possible troubles with output circuits, as well as their corrective actions. Condition Cause Corrective Action  Connect registers of tens to hundreds KΩ Load is half-wave rectified inside (in some When the output is off, excessive cases, it is true of a solenoid)
Page 217 Chapter 11. Troubleshooting Output circuit troubles and corrective actions (continued). Condition Cause Corrective actions  Over current at off state [The large  Insert a small L/R magnetic contact and The load off response solenoid current fluidic load (L/R is large) drive the load using the same contact.
Page 218: Error Code List
Chapter 11. Troubleshooting 11.5 Error Code List Error Action Operation Diagnosis Error cause code (restart mode after taking an action) status status point Program to execute is 0.5 second Start after reloading the program Warning abnormal Flicker mode Start after reloading I/O parameter, Reset Battery change if battery has a problem.
Page 219 Chapter 11. Troubleshooting Error Action Operation Diagnosis Error cause code (restart mode after taking an action) status status point Data memory backup If not error in battery, power reinput 1 second Warning Reset not possible Remote mode is switched to STOP mode. Flicker Setting the time by XG5000 if there is no 0.1 second...
Page 220: Appendix 1 Flag List
Appendix 1. Flag List Appendix 1 Flag List Appendix 1.1 Special Relay (F) List Word Variables Function Description %FD0 _SYS_STATE Mode and state Indicates PLC mode and operation State. %FX0 _RUN Run state. %FX1 _STOP Stop Stop state. %FX2 _ERROR Error Error state.
Page 221 Appendix 1. Flag List Word Variable Function Description %FX40 _BPRM_ER Basic parameter Basic parameter error. %FX41 _IOPRM_ER IO parameter I/O configuration parameter error. Special module parameter is %FX42 _SPPRM_ER Special module parameter Abnormal. Communication module Communication module parameter %FX43 _CPPRM_ER parameter is abnormal.
Page 222 Appendix 1. Flag List Word Variable Function Description %FW10 _USER_CLK User Clock Clock available for user setting. %FX160 _USR_CLK0 Setting scan repeat On/Off as much as set scan Clock 0. %FX161 _USR_CLK1 Setting scan repeat On/Off as much as set scan Clock 1. %FX162 _USR_CLK2 Setting scan repeat...
Page 223 Appendix 1. Flag List Word Variable Function Description %FW90 _IO_TYER_N Mismatch slot Module Type mismatched slot no. %FW91 _IO_DEER_N Detach slot Module detached slot no. %FW93 _IO_RWER_N RW error slot Module read/write error slot no. %FW95 _IP_IFER_N IF error slot Module interface error slot no.
Page 224: Appendix 1.2 Communication Relay (L) List
Appendix 1. Flag List Appendix 1.2 Communication Relay (L) List Here describes data link communication relay(L). (1) High-speed Link 1 Device Keyword Type Description High speed link parameter 1 normal operation of all station Indicates normal operation of all station according to parameter set in High speed link, and On under the condition as below.
Page 225 Appendix 1. Flag List (2) High-speed Link2 Device Keyword Type Description High-speed link parameter 2 normal operation of all station. Indicates normal operation of all station according to parameter set in High- speed link and On under the condition as below. %LX416 _HS2_RLINK 1.
Page 226 Appendix 1. Flag List (3) Common area Communication flag list according to P2P service setting. P2P parameter: 1~3, P2P block: 0~31 Device Keyword Type Description Indicates P2P parameter 1, 0 Block service %LX8192 _P2P1_NDR00 normal end. Indicates P2P parameter 1, 0 Block service %LX8193 _P2P1_ERR00 abnormal end.
Page 227: Appendix 1.3 Network Register (N) List
Appendix 1. Flag List Appendix 1.3 Network Register (N) List Here describes Network Register for communication (N). P2P parameter: 1~3, P2P block: 0~31 Device Keyword Type Description %NW000 _P1B00SN Word Saves another station no. of P2P parameter 1, 00 block. %NW0000~0004 _P1B00RD1 Word...
Page 228: Appendix 2 Dimension
Appendix 2. Dimensions Appendix 2 Dimension (Unit: mm) (1) Compact type main unit (IEC language) -. XEC-DN32H(/DC) -. XEC-DP32H A2-１...
Page 229 Appendix 2. Dimensions -. XEC-DR32H(/D1) A2-２...
Page 230 Appendix 2. Dimensions -. XEC-DN64H -. XEC-DP64H A2-３...
Page 231 Appendix 2. Dimensions -. XEC-DR64H(/D1) A2-４...
Page 232 Appendix 2. Dimensions (2) Extension I/O module -. XBE-DC32A, XBE-TN32A, XBE-TP32A, XBE-DN32A -. XBE-RY16A A2-５...
Page 233 Appendix 2. Dimensions -. XBE-DC08A, XBE-DC16A, XBE-DC16B, XBE-TN08A, XBE-TP08A, XBE-TN16A, XBE-TP16A, XBE-AC08A -. XBE-DR16A, XBE-RY08A, XBE-RY08B A2-６...
Page 234: Appendix 3 Compatibility With Glofa
Appendix 3. Compatibility with GLOFA Appendix 3 Compatibility with GLOFA Appendix 3.1 Compatibility of Flag Classification Type Contents Description Operation error latch flag which is on the basis of User Operation error program block (PB), the error indication which occurs _LER _LER BOOL...
Page 235 Appendix 3. Compatibility with GLOFA Classification Type Contents Description System error Handles error flags about fault of _CNF_ER WORD (heavy fault) operation stop as below. Error flag occurred when normal operation cannot be done due to _CPU_ER BOOL CPU Configuration error diagnosis error of CPU Module.
Page 236 Appendix 3. Compatibility with GLOFA Classification Type Contents Description System warning Handles warning flag about continuation operation as _CNF_WAR _CNF_WAR WORD (light fault) below _RTC_ERR _RTC_ERR BOOL RTC data error Indicates that RTC data is abnormal. Indicates that cold restart starts operation instead of hot or warm restart program, since data memory is destroyed by backup error.
Page 237 Appendix 3. Compatibility with GLOFA Classification Type Contents Description When I/O configuration parameter for each slot is not matched Mismatched with practical module configuration or a specific module is _IO_TYER_N _IO_TYER_N UINT module type slot applied in the wrong location, it is displayed as the lowest slot number number after detecting these mismatch error in slot locations.
Page 238 Appendix 3. Compatibility with GLOFA Classification Type Contents Description Light fault Light fault of external device (detected by user _ANC_WB[n] detection bit-map program) is saved on bit-map. of external device (“0”value is not available.) Task Collision Bit- Displayed on bit-map when same task is operating or _TC_BMAP[n] is ready for operation.
Page 239 Appendix 3. Compatibility with GLOFA Classification Type Contents Description CPU type _CPU_TYPE _CPU_TYPE UINT Indicates the type information of PLC CPU information OS Version _VER_NUM _OS_VER UINT OS version number of PLC CPU Number Memory module Program memory module type _MEM_TYPE UINT type...
Page 240 Appendix 3. Compatibility with GLOFA Classification Type Contents Description GMWIN Indicates the connection state of CPU module and connection state PADT Local GMWIN Bit indicated connection state of local PADT connection _PADT_CNF BYTE Remote GMWIN Bit indicated connection state of remote PADT connection Remote Bit indicated connection state of remote...
Page 241 Appendix 3. Compatibility with GLOFA A3-8...
Page 242 Appendix 4 Instruction List Appendix 4 Instruction List It’s a list of function and function block. For each function and function block, please refer to XGI/XGR/XEC Insturction user manual. Appendix 4.1 Basic Function Appendix 4.1.1 Type Conversion Function It converts each input data type into an output data type. Function Group Function Input data type...
Page 243 Appendix 4 Instruction List Function Group Function Input data type Output data type Remarks SINT_TO_LINT SINT LINT SINT_TO_USINT SINT USINT SINT_TO_UINT SINT UINT SINT_TO_UDINT SINT UDINT SINT_TO_ULINT SINT ULINT SINT_TO_BOOL SINT BOOL SINT_TO_BYTE SINT BYTE SINT_TO_WORD SINT WORD SINT_TO_DWORD SINT DWORD SINT_TO_LWORD SINT...
Page 244 Appendix 4 Instruction List Function Group Function Input data type Output data type Remarks LINT_TO_REAL LINT REAL LINT_TO_LREAL LINT LREAL LINT_TO_STRING LINT STRING USINT_TO_SINT USINT SINT USINT_TO_INT USINT USINT_TO_DINT USINT DINT USINT_TO_LINT USINT LINT USINT_TO_UINT USINT UINT USINT_TO_UDINT USINT UDINT USINT_TO_ULINT USINT ULINT...
Page 245 Appendix 4 Instruction List Function Group Function Input data type Output data type Remarks ULINT_TO_USINT ULINT USINT ULINT_TO_UINT ULINT UINT ULINT_TO_UDINT ULINT UDINT ULINT_TO_BOOL ULINT BOOL ULINT_TO_BYTE ULINT BYTE ULINT_TO_WORD ULINT WORD ULINT_TO_DWORD ULINT DWORD ULINT_TO_LWORD ULINT LWORD ULINT_TO_REAL ULINT REAL ULINT_TO_LREAL ULINT...
Page 246 Appendix 4 Instruction List Function Group Function Input data type Output data type Remarks DWORD_TO_USINT DWORD USINT DWORD_TO_UINT DWORD UINT DWORD_TO_UDINT DWORD UDINT DWORD_TO_ULINT DWORD ULINT DWORD_TO_BOOL DWORD BOOL DWORD_TO_BYTE DWORD BYTE DWORD_TO_WORD DWORD WORD DWORD_TO_LWORD DWORD LWORD DWORD_TO_REAL DWORD REAL DWORD_TO_TIME DWORD...
Page 247 Appendix 4 Instruction List Function Group Function Input data type Output data type Remarks DT_TO_LWORD LWORD DT_TO_DATE DATE DT_TO_*** DT_TO_TOD DT_TO_STRING STRING SINT_TO_BCD_BYTE SINT BYTE(BCD) INT_TO_BCD_WORD WORD(BCD) DINT_TO_BCD_DWORD DINT DWORD(BCD) LINT_TO_BCD_LWORD LINT LWORD(BCD) ***_TO_BCD USINT_TO_BCD_BYTE USINT BYTE(BCD) UINT_TO_BCD_WORD UINT WORD(BCD) UDINT_TO_BCD_DWORD UDINT DWORD(BCD)
Page 248 Appendix 4 Instruction List Appendix 4.1.2 Numerical Operation Function (1) Numerical Operation Function with One Input Function name Description Remarks General Function Absolute value operation SQRT Square root operation Log function Natural logarithm operation Common logarithm Base to 10 operation Natural exponential operation Trigonometric function Sine operation...
Page 249 Appendix 4 Instruction List Appendix 4.1.3 Bit Arrary Function (1) Bit-shift Function Function name Description Remarks Shift input to the left of N bit(the right is filled with 0) Shift input to the right of N bit (the left is filled with 0) Shift input to the designated direction as much as N bit (carry) SHIFT_C_*** Rotate input to the left of N bit...
Page 250 Appendix 4 Instruction List Appendix 4.1.6 Comparison Function Function name Description (n can be extended up to 8) Remarks ‘Greater than’ comparison OUT <= (IN1>IN2) & (IN2>IN3) & ... & (INn-1 > INn) ‘Greater than or equal to’ comparison OUT <= (IN1>=IN2) & (IN2>=IN3) & ... & (INn-1 >= INn) ‘Equal to’...
Page 251 Appendix 4 Instruction List Appendix 4.1.9 System Control Function Function name Description Remarks Invalidates interrupt (Not to permit task program starting) Permits running for a task program STOP Stop running by a task program ESTOP Emergency running stop by a program DIREC_IN Update input data DIREC_O...
Page 252 Appendix 4 Instruction List Appendix 4.1.12 Stack Operation Function Function name Description Remarks FIFO_*** First In First Out LIFO_*** Last In First Out Appendix 4.2 MK(MASTER-K) Function Function name Description(n can be extended up to 8) Remarks Output a position of On bit by number ENCO_B,W,D,L Turn a selected bit on DECO_B,W,D,L...
Page 253 Appendix 4 Instruction List Appendix 4.4 Basic Function Block Appendix 4.4.1 Bistable Function Block No. Function block name Description Remarks Set preference bistable Reset preference bistable Semaphore SEMA Appendix 4.4.2 Edge Detection Function Block No. Function block name Description Remarks R_TRIG Rising edge detector F_TRIG...
Page 254 Appendix 4 Instruction List Appendix 4.4.5 File Function Block No. Function block name Description Remarks EBREAD Read R area data from flash area EBWRITE Write R area data to flash area Appendix 4.4.6 Other Function Block No. Function block name Description Remarks SCON...
Page 255 Appendix 4 Instruction List Appendix 4.4.10 Positioning Function Block Function block name Description Remarks APM_ORG Return to original point run APM_FLT Floating original point setting APM_DST Direct run APM_IST Indirect run APM_LIN Linear interpolation run APM_SST Simultaneous run APM_VTP Speed/position control conversion APM_PTV Position/speed control conversion APM_STP...
Page 256 3. Since the above warranty is limited to PLC unit only, make sure to use the product considering the safety for system configuration or applications. Environmental Policy LS ELECTRIC Co., Ltd supports and observes the environmental policy as below. Environmental Management About Disposal LS ELECTRIC considers the environmental LS ELECTRIC’...
Page 257 Warranty and Environment Policy...
Page 258 Tel: 1-949-333-3140 E-Mail: america@ls-electric.com Disclaimer of Liability LS ELECTRIC has reviewed the information in this publication to ensure consistency with the hardware and software described. However, LS ELECTRIC cannot guarantee full consistency, nor be responsible for any damages or compensation, since variance cannot be precluded entirely.

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LS ELECTRIC XEC-DN32H User Manual

Chapter 1 Introduction

Chapter 2 System Configuration

Chapter 3 General Specifications

Chapter 4 CPU Specifications

Chapter 5 Program Configuration and Operation Method

Chapter 6 CPU Functions

Chapter 7 Input/Output Specifications

Chapter 8 Built-In High-Speed Counter Function

Chapter 9 Installation and Wiring

Chapter 10 Maintenance

Chapter 11 Troubleshooting

Appendix 1 Flag List

Appendix 1.1 Special Relay (F) List

Appendix 1.2 Communication Relay (L) List

Appendix 1.3 Network Register (N) List

Appendix 2 Dimension

Appendix 3 Compatibility with GLOFA

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Troubleshooting

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