Reflow Soldering - Murata Xbsc Series Assembly

XBSC/UBDC/UBSC/BBSC/ULSC 100 µm & 400 µm -
Assembly by soldering
Procedure for the solder joint measurement (After reflow):
STEP 1:
Silicon Capacitor
Thickness : X µm
Substrate
Pick and Place
The most common approach is with automatic equipment using vision assist to correct placement after picking but
manual placement can also be done.
Using a rubber tip is particularly preferred for the die manipulation.
A minimum pressure of 50 grams and a maximum of 150 grams is recommended for the die placement on the solder
paste.

Reflow soldering

Murata recommends convection reflow but vapor phase reflow and infrared reflow could be also used.
The reflow must be carried out in accordance with the JEDEC standard.
Assembly Note – Ref : ASNUBSC1.6
FBC-0003-01
Micrometer
Gaging Head
0
STEP 2:
Silicon Capacitor
X µm
Y µm
-
X µm
40 µm (Solder joint thickness)
Rev 1.2
Rev. 1.6
0
Y
(Measured value)
(Capacitor thickness)
9