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XBSC/UBDC/UBSC/BBSC/ULSC 100 µm & 400 µm -
Assembly by soldering
Fluxing by stamping:
Fluxing by spraying:
Fluxing by serigraphy:
With unbumped capacitor:
We recommend placing the solder paste by serigraphy directly on the substrate landing pads:
Assembly Note – Ref : ASNUBSC1.6
FBC-0003-01
Rev 1.2
Rev. 1.6
7
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