Murata XBSC Series Assembly page 6

XBSC/UBDC/UBSC/BBSC/ULSC 100 µm & 400 µm -
Assembly by soldering
None Solder Mask Defined (NSMD) is also possible:
Note: No varnish between two landing pads can be done.
Landing pad for the substrate and die pad dimensions for the Murata silicon die:
Silicon
Capacitor Type
0201M
0201
0402M (SMD)
0402
0603
Mounting Process Flow
With prebumped capacitor:
The bumps need flux to activate the soldering reflow. The following processes are compatible:
Flux dipping:
Assembly Note – Ref : ASNUBSC1.6
FBC-0003-01
Capacitor size A
(µm) (µm)
600 x 300 100
800 x 600 150
1000 x 500 90
1200 x 700 300
1800 x 1100 400
B C D
(µm) (µm) (µm)
150 200
400 300
610 160
500 400
900 800
Rev 1.2
Rev. 1.6
C
D
A
6