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1.
SCOPE ..................................................................................................................................................... 3
2.
KEY FEATURE ...................................................................................................................................... 3
2.1.
Block Diagram .......................................................................................................................... 3
2.2.
Ordering Information ............................................................................................................... 3
2.3.
RoHS Compliance ..................................................................................................................... 3
3.
ABSOLUTE MAXIMUM RATINGS ...................................................................................................... 4
4.
OPERATING CONDITION ................................................................................................................... 4
5.
DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS ................................................. 5
5.1.
Dimensions ............................................................................................................................... 5
5.2.
Pin Layout ................................................................................................................................. 7
5.3.
Module PIN Descriptions ....................................................................................................... 10
6.
POWER OF SEQUENCE ..................................................................................................................... 14
7.
REFERENCE CIRCUIT....................................................................................................................... 15
8.
ELECTORICAL CHARACTERISTICS (Chain 0/1) ........................................................................... 16
8.1.
DC/RF Characteristics for IEEE802.11b - 2.4GHz .............................................................. 16
8.2.
DC/RF Characteristics for IEEE802.11g - 2.4GHz .............................................................. 16
8.3.
DC/RF Characteristics for IEEE802.11n - 2.4GHz .............................................................. 17
8.4.
DC/RF Characteristics for IEEE802.11ax - 2.4GHz ............................................................ 17
8.5.
DC/RF Characteristics for IEEE802.11a - 5GHz ................................................................. 18
8.6.
DC/RF Characteristics for IEEE802.11n(HT 20/40MHz) - 5GHz ....................................... 18
8.7.
DC/RF Characteristics for IEEE802. 11ac (VHT20/VHT40/VHT80) - 5GHz .................... 20
8.8.
DC/RF Characteristics for IEEE802. 11ax (HE20/HE40/HE80) - 5GHz ........................... 21
8.9.
DC/RF Characteristics for Bluetooth .................................................................................... 22
8.10.
DC/RF Characteristics for Bluetooth（LE） .................................................................... 23
9.
LAND PATTERN (TOP VIEW) ............................................................................................................ 24
10.
TAPE AND REEL PACKING ........................................................................................................... 25
11.
NOTICE ............................................................................................................................................. 28
11.1.
Storage Conditions: ............................................................................................................ 28
11.2.
Handling Conditions: ......................................................................................................... 28
11.3.
Standard PCB Design (Land Pattern and Dimensions): ................................................. 28
11.4.
Notice for Chip Placer: ....................................................................................................... 28
11.5.
Soldering Conditions: ......................................................................................................... 29
11.6.
Cleaning: ............................................................................................................................. 29
11.7.
Operational Environment Conditions: .............................................................................. 29
11.8.
Input Power Capacity: ........................................................................................................ 30
12.
PRECONDITION TO USE OUR PRODUCTS ............................................................................... 31
Please be aware that an important notice concerning availability, standard warranty and use in critical applications of
Murata products and disclaimers thereto appears at the end of this specification sheet.
< Specification may be changed by Murata without notice >
Preliminary Specification Number : SP-8D1VF-H
TABLE OF CONTENTS
Preliminary & Confidential
Murata Manufacturing Co., Ltd.
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