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ONTRAK Synergy Integra Operation Manual

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Synergy Integra
TM
Volume 1 of 5
Operations
Manual Set 20-0200-251 (CD)
Software Version 2.2.3
Revision A
May 2000
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  • Page 1 Synergy Integra Volume 1 of 5 Operations Manual Set 20-0200-251 (CD) Software Version 2.2.3 Revision A May 2000 Click to Go Back to Main Menu...

  • Page 2: Copyright

    ® ® , DSS-200 , Envoy , Synergy , and Synergy Integra SOFTWARE The system software (the "Software"), whether on disk or embedded in ROM, and LICENSE related documentation are licensed to the corporation that originally purchased this equipment (the Corporation). Lam Research Corporation retains the title to the Software.

  • Page 3: Preface

    PREFACE This manual provides information on safety and operation of the Intergra cleaner. It is composed of one volume, which contains fifteen chapters of text. The Operations manual contains seven chapters that are also included in the Maintenance manual. They are: Chapter 2, Safety; Chapter 11, GEM Configuration; Chapter 12, System Security;...
  • Page 4 In addition to the Operations manual, the other Integra manuals are the Maintenance manual (Volume 2 of 5), Troubleshooting manual (Volume 3 of 5), Spare Parts manual (Volume 4 of 5), and Installation manual (Volume 5 of 5). The Spare Parts manual contains assembly drawings and part lists for the system and its major modules: Input Station, Brush Station #1, Brush Station #2, and Spin Station.

  • Page 5: Reorder & Revision History

    REORDER & REVISION HISTORY Reorder To reorder one of the manuals in the Integra system manual set, order the Instructions following: 20-0200-231 Operations (clean room manual) 20-0200-232 Operations (standard manual) 20-0200-233 Maintenance (clean room manual) 20-0200-234 Maintenance (standard manual) 20-0200-235 Troubleshooting (clean room manual) 20-0200-236 Troubleshooting (standard manual) 20-0200-237 Spare Parts (clean room manual) 20-0200-238 Spare Parts (standard manual)
  • Page 6 Revision History This manual is new. It includes updated material from the five-volume Synergy Integra manual set, p/n 20-0200-222 (standard) and p/n 20-0200-221 (clean room), as follows: Chapter 1—Introduction. Revised version of Chapter 1, Introduction, in Volume 1, Operations. Chapter 2—Safety. Revised version of Chapter 2, Safety, in Volume 2, Operations. Chapter 3—System Configuration.
  • Page 7 Manual Change Request Please provide the information requested below to assist us in correcting mistakes in the manual. Send the form by mail to Cleaning Product Support, CA-10, Lam Research Corporation, 4650 Cushing Parkway, Fremont, CA 94538-6470; or by fax to 510-572-1389; or by e-mail to CMP/CLN Documentation (on Global Address List) or cmpclndoc@exchange.lamrc.com.

  • Page 9: Table Of Contents

    TA B L E O F C O N T E N T S T A B L E O F C O N T E N T S COPYRIGHT ........................II PREFACE ........................III REORDER & REVISION HISTORY ................V INTRODUCTION ..................1–1 INTEGRA SYSTEM INTEGRATION .................
  • Page 10 TA B L E O F C O N T E N T S SYSTEM CONFIGURATION ..............3–1 INTRODUCTION ......................3–1 SYSTEM OPTIONS ...................... 3–1 Flat Rotate Enable ....................3–1 Maintenance Alarms ..................3–1 Enable/Disable Brush Motor Alarms ..............3–1 First Wafer Clean ....................3–1 Light Tower Options ..................
  • Page 11 TA B L E O F C O N T E N T S Spindle......................3–25 Spindle Fingers....................3–25 Spin Motor......................3–26 Finger Close Safety Spring ................3–26 Z_Lock ......................3–26 Spindle Lock ....................3–26 ) ................3–27 EGASONIC SSEMBLY OPTION Megasonic Arm ....................
  • Page 12 TA B L E O F C O N T E N T S ....................4–8 AFER LEANING Introduction ......................4–8 ) ................... 4–10 LEAN OPTION .................... 4–10 LEAN YCLE IMING ) ................... 4–10 INDER OPTION ) ............4–10 AFER RANSFER WITH INDER...
  • Page 13 TA B L E O F C O N T E N T S ..........6–5 HEMICAL ISPENSE URING AFER ECOVERY ......................6–5 AFER ............6–6 ECOVERY ROCEDURE FOR ROCESS AILURE EMO)......6–7 ECOVERY ROCEDURE OLLOWING OWER AILURE ..........6–8 EQUENCE OF VENTS URING...
  • Page 14 TA B L E O F C O N T E N T S MODIFY BRUSH CLEANING OPTIONS ..............9–23 Drip Wafer Count Brush Cleaning..............9–29 Change DRIP TIME..................9–30 Change DRIP WAFER COUNT..............9–31 Change DRIP CHEM ..................9–32 Change DRIP LOW FLOW DI................
  • Page 15 TA B L E O F C O N T E N T S Accessing Alarm Configuration Menu ............10–8 Alarm Configuration Menu Screen Description ..........10–8 Alarm Description .................... 10–9 Configuration Options - Message Box............. 10–9 Choosing an Alarm for Configuration ............10–10 Configuring the Alarm ...................
  • Page 16 TA B L E O F C O N T E N T S ID: 39 ...................... 10–27 LARM ID: 40 ...................... 10–27 LARM ID: 41 ...................... 10–27 LARM ID: 42 ...................... 10–28 LARM ID: 43 ...................... 10–28 LARM ID: 44 ...................... 10–28 LARM ID: 45 ......................
  • Page 17 TA B L E O F C O N T E N T S ID: 85 ...................... 10–45 LARM ID: 86 ...................... 10–45 LARM ID: 87 ...................... 10–45 LARM ID: 88 ...................... 10–46 LARM ID: 89 ...................... 10–46 LARM ID: 90 ...................... 10–46 LARM ID: 91 ......................
  • Page 18 TA B L E O F C O N T E N T S ID: 131 ....................10–63 LARM ID: 132 ....................10–63 LARM ID: 133 ....................10–64 LARM ID: 134 ....................10–64 LARM ID: 135 ....................10–64 LARM ID: 136 ....................10–65 LARM ID: 137 ....................
  • Page 19 TA B L E O F C O N T E N T S HEARTBEAT TIMER:..................11–7 INITIAL COMM STATE: ................11–7 INITIAL CONTROL STATE:................. 11–7 ONLINE FAILED STATE: ................11–7 OFFLINE SUBSTATE: ................... 11–8 ONLINE SUBSTATE:..................11–8 PROTOCOL PARAMETERS ..................11–8 DEVICE ID:.....................
  • Page 20 TA B L E O F C O N T E N T S (This page intentionally left blank.) 7/26/00 INTEGRA Operations Revision A 20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)

  • Page 21: Introduction

    I N T R O D U C T I O N INTEGRA SYSTEM INTEGRATION The Synergy Integra™ is a cluster tool that integrates with a chemical mechanical polishing (CMP) unit and clean room. The Integra uses proven Synergy cleaning technologies. The Integra system is designed to clean wafers using options for a variety of chemical processes which operate in conjunction with the mechanical processes.

  • Page 22: Manual Set Organization

    Spin Station Rinses and dries the wafers after they have completed the cleaning process. First, the wafer is rinsed, then the wafer is spun to remove excess DI water while a heat lamp assists in completing the drying process. An optional Megasonic cleaning unit can assist in the cleaning process.
  • Page 23 C h a p t e r 1 I N T R O D U C T I O N Chapter 4, Process Description, describes preparation of the system for processing, initialization of the system, operation in normal run mode, and process controls for operators. Chapter 5, Normal Operation, describes operation of the system by an operator under normal operating conditions.
  • Page 24 INTEGRA Operations Revision A 7/26/00 20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)

  • Page 25: Safety

    C H A P T E R 2 S A F E T Y INTRODUCTION The safe operation of the Integra is the responsibility of the user. Lam provides safety information regarding the design of the system and its proper use. This includes hazards which affect the cleaning process, the machinery, and the operator.

  • Page 26: Safety Notations

    SAFETY NOTATIONS Safety is always a major concern when maintaining a piece of equipment. In order to ensure that the safety messages presented in this volume are visible and immediately recognizable, the following symbols will accompany the various warnings and cautions. NOTE: Symbol identifies a safety issue that could result in a process failure.

  • Page 27: Safety Precautions

    C h a p t e r 2 S A F E T Y SAFETY PRECAUTIONS (PPE) K ERSONAL ROTECTIVE QUIPMENT Customers should create their own Personal Protective Equipment or purchase a commercially available PPE kit. Wear all required protective clothes and equipment when performing maintenance procedures that expose you to HF.

  • Page 28: General Safety Provisions

    GENERAL SAFETY PROVISIONS The Integra system is designed with safety in mind. The system contains numerous safety provisions including the following: Electrical Shields (guards) are provided in each location where a Electrical Shields potential exists for accidental contact with a component that could cause electrical shock if its protective shield was removed.
  • Page 29 EMO button. Also, the Integra system EMO will shut down the ULPA filter, if installed. For more information, see Ontrak Safety Alert #2 and Installation manual. High voltage warning tags have been placed on all electrical...

  • Page 30: Safety Precautions

    SAFETY PRECAUTIONS LECTRICAL AFETY Safety Shields Electrical safety shields isolate the high-voltage components to prevent accidental contact by technicians. Use extreme caution when working around the shielded components. If it is necessary to remove the safety shield from a component in order to work on it, first turn the system OFF and disconnect the power.

  • Page 31: Electrical Hazard Rating

    C h a p t e r 2 S A F E T Y 4 Disconnect the power cord. 5 Get the lockout block (p/n 71-0002-017) and the padlock (p/n 71- 0002-016). The system ships with the lockout block and padlock sealed in a plastic bag inside the electrical enclosure.

  • Page 32: Integra Type 3 And Type 4 Task Hazards

    Integra Type 3 and Type 4 Task Hazards WARNING! ELECTRICAL HAZARD: The following procedures are Integra system Type 3 and Type 4 task hazards. These procedures should be performed by qualified electrical technicians only. Below is a list of all Integra system electrical tasks that are classified as type 3 or higher hazards as defined by SEMI S2-93.

  • Page 33: Electrical Enclosure

    C h a p t e r 2 S A F E T Y Brush Station Lid A pneumatic latch prevents the lid from being opened when the system is processing wafers. Use the Lid Unlock and Lid Open functions of the screen to open the Brush BRUSH LID OPERATION Station lid.

  • Page 34: Emergency Machine Off

    Perform the lockout/tagout procedure prior to opening the Electrical Enclosure unless it is absolutely necessary that the circuits be activated for the required maintenance. (See “Electrical Lockout/ Tagout” on page 2-6.) A key lock on the side of the cabinet is provided for overriding the safety interlock on the Spin Station door, thereby allowing activation of the Spin Station components when the Spin Station door is open.

  • Page 35: Maintenance Issues

    C h a p t e r 2 S A F E T Y ULPA FILTER BUTTON BUTTON CIRCUIT BREAKER EMO LOCATIONS CAUTION: Pressing an Integra EMO button powers off the integrated system of cleaner and polisher. AINTENANCE SSUES Chemical Exposure Typical chemical exposure levels during maintenance activities should not exceed 3 ppm (using a pH test strip) if the system is flushed prior to starting the maintenance procedure.

  • Page 36: Pneumatics System

    Pneumatics System When maintenance on the pneumatic system is going to require any lines to be detached or a pneumatic component to be disconnected, the pneumatic supply must be turned OFF and detached. ULPA Filter Always keep the ULPA filter operating at all times. However, when maintenance is required on the ULPA filter, the tunnel between the Spin Station and clean room must be properly sealed in order to maintain the integrity of the clean room environment.

  • Page 37: Ergonomic Issues

    C h a p t e r 2 S A F E T Y The operating frequency of the Megasonic ultrasonic generator is 1.5 MHz (± 0.3 MHz). Input power is 100 VAC, 1 phase, 60Hz, 1 AMP, 48 Watts Maximum. Ergonomic Issues The only known ergonomic hazard in wafer cleaners is the hand loading and unloading of the wafer cassettes.

  • Page 38: 7/26/00 Integra Operations Revision A Ix

    2-14 INTEGRA Operations Revision A 7/26/00 20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)

  • Page 39: System Configuration

    C H A P T E R 3 S Y S T E M C O N F I G U R A T I O N INTRODUCTION The Integra cleaner is designed to clean wafers after various wafer polishing procedures. System software is at the 2.2.3 level or higher. Although the Integra is designed for eight inch (200 mm) wafers, six inch (150 mm) wafers can be run as an option.

  • Page 40: Light Tower Options

    The following conditions are necessary for this process to be activated: The INPUT Station is indexing, i.e., looking for a wafer. The BRUSH, SPIN, UNLOAD HANDLER and OUTPUT Stations are idle, i.e., ready for a wafer. The system is not in wafer recovery mode. The period that ammonia is delivered to the Brush Station brushes is user programmable between 1 and 60 seconds and can be found in screen.

  • Page 41: Input Station

    C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N INPUT STATION The Integra Input Station begins the individual wafer cleaning process. Wafers are sequentially transferred (one at a time) from the Input Robot into the Input Station.

  • Page 42: Sensor Definitions

    ENSOR EFINITIONS SENSOR NAME TYPE AND LOCATION FUNCTION EXHAUST SENSOR Differential Pressure Switch: Icon is green when the exhaust rate is (Option) In the Input Station exhaust sufficiently high for processing manifold. requirements. The switch is set so that it signals when the exhaust pressure drops below the minimum allowable level for the Input Station.
  • Page 43 C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N SENSOR NAME TYPE AND LOCATION FUNCTION UPPER LIMIT SENSOR Not used. May display on screen, but not functional on Integra cleaner.

  • Page 44: Brush Station Common Components

    BRUSH STATION COMMON COMPONENTS OUBLE ONTAINMENT TATION There is one lid for the dual Brush Station box. The lid is designed as a double containment barrier between the operator and the processing chamber. The first containment is accomplished by an inner lid which is designed to isolate the individual processing Brush Station chambers from each other.

  • Page 45: Hf Dispense Drawer

    C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N A DI HI FLOW valve is available to release a higher volume of DI water during chemical processing.

  • Page 46: Brush Station #1

    BRUSH STATION #1 NTRANCE PRAY Brush Station #1 is the first of two cleaning stations contained in the brush box. A preliminary rinse of the wafer is required before the brushes contact the wafer. DI water is sprayed from a manifold, just before the wafer enters Brush Station #1.

  • Page 47: Process Solution Injection : Hf (Optional Configuration )

    C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N Optional edge cleaning rollers have preprogrammed positions which accommodate 6 and 8 inch wafers. To set the roller position for the desired wafer size, use the screen from SELECT DIAMETER...

  • Page 48: Sensors

    ENSORS Fifteen sensors and fifteen solenoids/switches monitor and/or control Brush Station #1’s activity. Sensors are described in the following table and are listed in the order that they are displayed on the FIRST screen. Solenoid/switch descriptions follow sensor BRUSH I/O descriptions.
  • Page 49 C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N SENSOR NAME TYPE AND LOCATION FUNCTION WAFER SENSOR Fiber Optic Emitter Receiver Icon is green when a wafer is present (wafer transferring between the Input Station and Sensor.
  • Page 50 SENSOR NAME TYPE AND LOCATION FUNCTION BACK LIFTER Optical Interrupt, Flag Sensor. Icon is green when the back lifter is in the EXTEND SENSOR Located in the micro stepper EXTEND position and red when the lifter is (Lowers back end driver assembly (inside the not.
  • Page 51 C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N SENSOR NAME TYPE AND LOCATION FUNCTION LID CLOSED Hall Effect Sensor: Located on Icon is green when the lid is completely SENSOR the pneumatic cylinder which CLOSED.
  • Page 52 OUTPUT NAMES DESCRIPTION TEACH ROLLERS Teach Screen Access. The roller setting determines the Rollers At Ready and the Rollers At Process positions. On the FIRST BRUSH STATION I/O screen, the TEACH ROLLERS button provides access to a sub roller positions screen on which the (teach rollers) may be adjusted.
  • Page 53 C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N OUTPUT NAMES DESCRIPTION REDUNDANT Solenoid. OPENS and CLOSES a second valve that controls the NH SOLENOID (or optional HF) delivery to Brush Station #1 brushes.

  • Page 54: Brush Station #2

    BRUSH STATION #2 ENERAL ESCRIPTION Brush Station #2 operates similarly to Brush Station #1. The same type of conveyor operates to transport the wafers into and out of the station. Brush Station #2 has the same brush configuration and the same roller operation.

  • Page 55: Flat Finder ( Option )

    C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N INDER OPTION In systems that process wafers with flats, the wafer flat must face the exit end of the machine when it enters the Spin Station.
  • Page 56 SENSOR NAME TYPE AND LOCATION FUNCTION EXHAUST SENSOR Differential Pressure Switch. Icon is green when exhaust rate is sufficiently Switch is set so that it high for processing requirements. The signals when the exhaust exhaust pressure must remain at a safe level pressure drops below the for the system to process wafers.
  • Page 57 C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N SENSOR NAME TYPE AND LOCATION FUNCTION BACK LIFTER Optical Interrupt, Flag Icon is green when the back lifter is in the HOME SENSOR Sensor.
  • Page 58 SENSOR NAME TYPE AND LOCATION FUNCTION FRONT LIFTER Optical Interrupt, Flag Icon is green when the front lifter is in the EXTEND SENSOR Sensor. Located in the EXTEND position and red when the lifter is (Lowers front end of micro stepper driver not in the EXTEND position.
  • Page 59 C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N SENSOR NAME TYPE AND LOCATION FUNCTION BRUSH LID Hall Effect Sensor. Located Icon is green when the lock is disengaged UNLOCKED on the pneumatic cylinder (unlocked) and red when the lock is engaged...
  • Page 60 OUTPUT NAMES DESCRIPTION FLAT FINDER DELAY Timer. Touch to display the NUMBER PAD screen so that the Flat Finder Delay time can be set. Enter the time, then touch ENTER. LID OPERATIONS Interactive Button. Touch this button to display the BRUSH LID OPERATIONS screen.
  • Page 61 C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N OUTPUT NAMES DESCRIPTION DI HI FLOW Solenoid. OPENS and CLOSES the valve which provides a higher flow rate of DI water through the Brush Station #2 upper brush (after HF or HF processing) in order to neutralize the wafer.

  • Page 62: Spin Station

    SPIN STATION The Spin Station is designed to dry the cleaned wafer. The Spin Station is composed of: a cover a retractable carriage conveyor platform an edge handling spin assembly a vertical spindle assembly with power loss safety lock a drying lamp a sensors a megasonic assembly (option) a spin exit tunnel (Output Robot) sensor...

  • Page 63: Spin Assembly

    C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N SSEMBLY The spin assembly is located directly beneath the retractable conveyor platform. It is composed of: a catch cup; the spindle assembly containing various pneumatic cylinders, sensors and the spindle fingers (wafer gripping assembly);...

  • Page 64: Spin Motor

    The spindle fingers are in the a wafer orientation at the HOLDING position when the wafer is being transferred to the Unload Handler. As soon as the handler fingers close on the wafer the spindle fingers release it, and move to the orientation.

  • Page 65: Megasonic Assembly ( Option )

    C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N There is a “V” cut in the collar that surrounds the spindle shaft. A pneumatic cylinder releases a bearing which rides the collar edge until it drops into the “V.”...

  • Page 66: Megasonic Sweep Timing

    Megasonic Sweep Timing The total processing time in the Spin Station is tied to the megasonic process activity if the megasonic is used. (If the megasonic process is not used, the process time is set by the TIME button in the Spin Station Recipe Events column.) The megasonic sweep time is composed of two elements, the and the...

  • Page 67: Sensors

    C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N ENSORS Twenty one sensors and twenty four solenoids/switches monitor and/ or control Spin Station activity. Sensors are described in the following table and are listed in the order that they are displayed on the SPIN screen.

  • Page 68: Sensor Definitions

    ENSOR EFINITIONS SPIN STATION INPUTS (Sensors) SENSOR NAME TYPE AND LOCATION FUNCTION DOOR SENSOR Magnetic Sensor: On the door, with Icon is green when the Spin the magnet on the inside frame Station door is physically open. and the sensor on the door. When the door is open, the computer shuts down the Spin Station.
  • Page 69 C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N SENSOR NAME TYPE AND LOCATION FUNCTION EXHAUST SENSOR Differential Pressure Switch: In the Icon is green when the exhaust Spin Station exhaust manifold.
  • Page 70 SENSOR NAME TYPE AND LOCATION FUNCTION MEGASONIC HI FLOW Flow Sensor (same sensor as Low Icon is green when the DI water (second or right icon Flow): On the floor, bottom level of flow to the megasonic arm is too position) the machine, next to the regulator high to sustain proper cleaning.
  • Page 71 C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N SENSOR NAME TYPE AND LOCATION FUNCTION CARRIAGE EXTEND Optical Interrupt, Flag Sensor: On the Icon is green when the carriage is SENSOR swing arm assembly attached to the...
  • Page 72 SENSOR NAME TYPE AND LOCATION FUNCTION Z_LOCK LOCKED Magnetic Reed Switch Sensor: On Icon is green when the Z_Lock SENSOR the pneumatic cylinder operating is locked (engaged) holding up the lock. The sensor is at the push the spindle and red when the rod end of the pneumatic cylinder.
  • Page 73 C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N OUTPUT NAME TYPE/DESCRIPTION MEGASONIC ARM Solenoid. Operates a pneumatic valve which moves the Megasonic SOLENOID Arm out to the edge of the wafer so that it can begin its sweep.
  • Page 74 OUTPUT NAME TYPE/DESCRIPTION SPINDLE MOTOR Interactive Button. Displays a NUMBER PAD screen where the spindle motor speed is set. Enter the RPM number on the NUMBER PAD and touch ENTER. When ENTER is touched, the spindle lock disengages, the Spin Inhibit Relay energizes, and the new speed activates for the spindle motor.
  • Page 75 C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N OUTPUT NAME TYPE/DESCRIPTION LOWER RINSE Solenoid. Operates a valve which sends DI water to a spray manifold SOLENOID that sprays the bottom of the wafer.
  • Page 76 OUTPUT NAME TYPE/DESCRIPTION SPINDLE S2 SOLENOID Solenoid. S2 solenoid operates a pneumatic cylinder which works in conjunction with the S1 solenoid to control the positioning of the spindle shaft. The following are solenoid activity combinations and the resulting spindle position. S1 and S2 OFF - Spindle is at the BOTTOM.
  • Page 77 C h a p t e r 3 S Y S T E M C O N F I G U R AT I O N OUTPUT NAME TYPE/DESCRIPTION SPINDLE DOWN Interactive Button. Moves the Spin Station spindle to the BOTTOM SOLENOID position.

  • Page 78: Electrical Enclosure

    ELECTRICAL ENCLOSURE The Electrical Enclosure is the module which contains all the power and control circuitry along with the computer which operates the system. A Remote Electrical Enclosure is available as an Integra option. There are no standard operator control devices inside the enclosure. The only operator level controls associated with the Remote Electrical Enclosure are the process buttons on the exterior top side of the enclosure, and the main circuit breaker on the front of the Electrical Enclosure.

  • Page 79: Process Description

    C H A P T E R 4 P R O C E S S D E S C R I P T I O N INTRODUCTION This chapter describes the step by step process of cleaning a wafer. Each major functional component in the Integra is examined as the wafer travels through the system.

  • Page 80: Spray Rinse

    WARNING! PINCH POINT: The Integra’s Input Station Door (not lid) can be a pinch point. The total pressure used to open and close the door is 5 psi. NOTE: The Input Station operation is deactivated when the Brush Station lid is opened (i.e., if the LID CLOSED SWITCH icon [magnetic reed switch on the Input Station lid] does not indicate that the lid is close, the Input Station will not operate).

  • Page 81: Brush Station #1

    C h a p t e r 4 P R O C E S S D E S C R I P T I O N BRUSH STATION #1 AFER RANSPORT As the wafer transfers from the Input Station to Brush Station #1, it is sprayed with DI water as an initial rinse.
  • Page 82 In order to maintain optimum cleaning efficiency, the brushes are periodically cleaned and/or conditioned through processes defined in three sets of variables provided on the BRUSH STATION DEFINE . See “Modify Brush Cleaning Options” on page CLEANING SCREEN 9-23, and “Process Idle Time” on page 4-6. 2% NH OH Application (Standard) The 2% NH...

  • Page 83: Edge Clean ( Option )

    C h a p t e r 4 P R O C E S S D E S C R I P T I O N When DI HIGH FLOW activates in an EVENT, a high volume of DI water injects into the brush core and out through the permeable brush material.

  • Page 84: Process Idle Time

    ROCESS The Integra system is designed to operate 24 hours a day, 7 days a week. However, occasional process delays may occur (e.g., no wafers to process) which can leave the Integra system operating in the processing mode, but idle for a period of time. When idle for extended periods of time, the brushes must be protected from developing contamination and properly reconditioned before resuming wafer processing.

  • Page 85: First Wafer Effect

    C h a p t e r 4 P R O C E S S D E S C R I P T I O N First Wafer Effect The second set of idle time variables configure the parameters of the FIRST WAFER EFFECT process used to condition the brushes after an idle .

  • Page 86: Brush Station #2

    BRUSH STATION #2 AFER RANSFER As the wafer transfers from Brush Station #1 to Brush Station #2, it is rinsed with DI water. A fiber optic emitter/receiver sensor, located between Brush Station #1 and Brush Station #2, detects the wafer. (See “WAFER SENSOR”...
  • Page 87 C h a p t e r 4 P R O C E S S D E S C R I P T I O N In order to maintain optimum cleaning efficiency, the brushes are periodically cleaned and/or conditioned through processes defined in three sets of variables provided on the BRUSH STATION DEFINE .

  • Page 88: Edge Clean ( Option )

    *Options: NH OH Application The HF configuration is standard for Brush Station #2 in the Integra system. Brush Station #2 can also be configured for 2% NH OH drip, 2% NH OH through the brush (TTB), or 29% NH OH through the brush (TTB) mix solutions by changing and replumbing the chemical dispense drawer(s).

  • Page 89: Wafer Transfer Out (N O Flat Finder )

    C h a p t e r 4 P R O C E S S D E S C R I P T I O N AFER RANSFER INDER When the Spin Station is ready for a wafer, the top brush slows to idle speed and lifts off of the wafer in Brush Station #2, the rollers retract, and the conveyor activates to transport the wafer into the Spin Station.

  • Page 90: Spin Station

    SPIN STATION AFER RANSFER The wafer enters the Spin Station on the retractable conveyor located above the Spin Station catch cup. Three sensors, working alone or in conjunction with each other, detect and stop the wafer in the proper position over the spindle fingers. Three emitters are located, one in each of three arms which extend over the track, with their corresponding sensors beneath the track.

  • Page 91: Wafer T O Spindle Transfer

    C h a p t e r 4 P R O C E S S D E S C R I P T I O N AFER PINDLE RANSFER When the wafer transfers, the spindle is at the MID position and the spin fingers are open.

  • Page 92: Process Timing

    ROCESS IMING For each individual EVENT in the Process Recipe, the spindle can be set to a specific drying speed (rpm) and/or duration (time). The specified spindle speed (rpm) and duration can be adjusted in the Process Recipe by the Process Engineer for the initial rinse, megasonic cleaning (optional), megasonic rinse (optional), low speed and high speed drying cycles to provide maximum process efficiency.

  • Page 93: Wafer/Output Robot (Arm)

    C h a p t e r 4 P R O C E S S D E S C R I P T I O N WAFER/OUTPUT ROBOT (ARM) GEM I NTERFACE GEM messages/instructions control the Output Robot interface (wafer/arm movement) between the Spin Station and clean room. The Integra cleaner does not directly communicate with the Output Robot.

  • Page 94: Electrical Enclosure

    ELECTRICAL ENCLOSURE The Electrical Enclosure is the module which contains all the power and control circuitry along with the computer which operates the system. There are no standard operator control devices inside the enclosure. The only operator level controls associated with the electrical enclosure are the process buttons on the exterior top side of the cabinet, and the main circuit breaker on the opposite side of the cabinet.

  • Page 95: Signal Light Tower

    C h a p t e r 4 P R O C E S S D E S C R I P T I O N SIGNAL LIGHT TOWER The signal light tower is mounted on either the attached electrical enclosures (standard) or on the system itself if the remote electrical enclosure option is used.
  • Page 96 Light Tower Option 2 COLOR PURPOSE STATUS DESCRIPTION System Manual lamp test (Initialization only). Status Alarm NOT present. FLASH Alarm present. Yellow Move In Move Out Request (input cassette empty or output Request/ cassette complete). Move Out MIR or MOR NOT present. Request FLASH Move In Request (waiting for input or output cassette)
  • Page 97 C h a p t e r 4 P R O C E S S D E S C R I P T I O N Light Tower Option 4 COLOR PURPOSE STATUS DESCRIPTION User User defined via GEM. defined via User defined via GEM.
  • Page 98 Light Tower Option 6 COLOR PURPOSE STATUS DESCRIPTION Alarm Alarm present. Alarm NOT present. FLASH Yellow Process System in Standby, waiting to process wafers. Status Lot in progress. FLASH Process (lot) completes, remove output cassette. Green Running Processing wafers. NOT processing wafers. FLASH Light Tower Option 7 COLOR...
  • Page 99 C h a p t e r 4 P R O C E S S D E S C R I P T I O N Light Tower Option 8 COLOR PURPOSE STATUS DESCRIPTION Alarm HOST turned light ON. Alarm NOT present and HOST turned light OFF. FLASH Alarm present.
  • Page 100 Light Tower Option 10 COLOR PURPOSE STATUS DESCRIPTION White System System Down - Machine in PAUSED/CLEARING mode. State Machine in START/RUNNING (after initialization). FLASH Yellow Alarm Alarm present Status Alarm not present. FLASH Green Running Processing wafers - wafers in Brush #1, Brush #2 or Spin. Not processing wafers.
  • Page 101 C h a p t e r 4 P R O C E S S D E S C R I P T I O N Light Tower Option 12 (not used on Integra) COLOR PURPOSE STATUS DESCRIPTION Alarm Alarm present; Stop or Clearing. Status Normal operation.
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  • Page 103: Normal Operation

    C H A P T E R 5 N O R M A L O P E R A T I O N INTRODUCTION The Integra has been designed for simple operation. Under normal operating conditions the system can be set up to process wafers with minimal operator intervention.
  • Page 104 ITEM NAME DESCRIPTION OF ACTIVITY DI Water Valve Check that the facilities DI water valve to the machine has been turned ON. Set regulator to 50 psi (3.45 bar). Megasonic Flow Control If the megasonic process is to be used, ensure that the flow Valve (option) valve for the Megasonic DI water supply is opened to the proper flow setting.

  • Page 105: Start-Up Procedure

    C h a p t e r 5 N O R M A L O P E R AT I O N START-UP PROCEDURE The Start-up procedure assumes that the system has been OFF, without power, for a long period of time (hours). The Pre Start-up Checklist activities must precede the actual start-up procedure.

  • Page 106: Tart Up Rocedure Or Hf2 Configuration

    HF2 C TART ROCEDURE ONFIGURATION Start-up Procedure STEP PROCEDURE COMMENT Turn ON the computer monitor. The system may have the monitor activation tied to the ON button located on the Operator Control Panel. Turn the HF key to HF2 (to the right) if Assuming that the system has been processing the system is to use the HF processing in the HF2 key setting, changing to the HF1...
  • Page 107 C h a p t e r 5 N O R M A L O P E R AT I O N STEP PROCEDURE COMMENT Check that the optional Flat Finder is Use the following procedure to check the status enabled if processing wafers with flats.

  • Page 108: Initialization Sequence

    NITIALIZATION EQUENCE During the first few moments after beginning the Start-up procedure, the CPU runs a systematic check of the system. This is called “Initialization.” During the initialization process the CPU tests memory, loads software into RAM, and begins the component testing phase. (following illustration) displays INITIALIZATION SCREEN messages during “Initialization”...
  • Page 109 C h a p t e r 5 N O R M A L O P E R AT I O N Input Station and Robot Initialization Positions Checklist STATION COMPONENT FLAG LOCATION HOME POSITION INPUT ROBOT External to ARM (Paddle) Integra INPUT Input Station...

  • Page 110: Post Start-Up Checklist

    POST START-UP CHECKLIST After start-up, perform a check of the major system components and processes to verify that the system is operating properly. The following tests may be conducted by manually activating various components or while the system is processing wafers. To check the status of the items in the following check list, the system must at least be fully operational.
  • Page 111 C h a p t e r 5 N O R M A L O P E R AT I O N ITEM NAME DESCRIPTION OF ACTIVITIES Ammonium With the system ON and operating the solenoid valves from the Hydroxide Flow Input/Outputs screen (MANUAL MODE) - Verify that NH OH is flowing by checking the FIRST BRUSH STATION I/O screen,...
  • Page 112 ITEM NAME DESCRIPTION OF ACTIVITIES Wafer Flow With system ON and processing wafer - Verify: Through the Wafers travel through the machine in a straight line, centered on Cleaner the track, and between the two Brush Station brushes. (USE THE Spin Station gripper fingers close uniformly on the wafer, causing SMOOTH no more than 3 mm movement in any direction.

  • Page 113: Clearing Procedure

    C h a p t e r 5 N O R M A L O P E R AT I O N CLEARING PROCEDURE Use the CLEARING procedure to remove processing wafers from the system stations. The CLEARING procedure is only used on processing wafers in the Input Station, Brush Station #1, Brush Station #2, and Spin Station.

  • Page 114: System Idle Signal

    SYSTEM IDLE SIGNAL When each wafer has completed its course through the cleaning process, it is removed from the spin fingers by the Output Robot arm (paddle) and moved into a clean room. When all of the wafers in the system have been cleaned and there are no wafers in any station, the yellow light in the signal light tower is activated.

  • Page 115: Shutdown Procedure

    C h a p t e r 5 N O R M A L O P E R AT I O N SHUTDOWN PROCEDURE EMPORARY ROCESSING Less Than An Hour There are two ways to temporarily halt processing so that it can be continued from the place it was stopped;...

  • Page 116: Several Hours

    Several Hours When normal processing will be stopped for several hours, the system should be left in the current processing mode, waiting for the next cassette. This way, the system remains fully operational, the processing environment remains clean as the spray nozzles continue to drip to help prevent bacterial growth, and DI water continues to run through the brushes to purge them, prevent dryness, and to help prevent bacterial growth.
  • Page 117 C h a p t e r 5 N O R M A L O P E R AT I O N STEP PROCEDURE COMMENTS Turn OFF the DI Water supply to the Only turn this OFF if working on related system.
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  • Page 119: Start-Up After Emo & Wafer Recovery

    C H A P T E R 6 START-UP AFTER EMO & WAFER RECOVERY INTRODUCTION This chapter presents the general procedures associated with Start- up following a premature termination (EMO) of wafer processing. The messages and screens displayed in this chapter are based on software revision 2.2.3 or higher.

  • Page 120: Pre Processing Checklist

    PRE PROCESSING CHECKLIST After an emergency shutdown or wafer processing was terminated in mid process (e.g., power failure or computer malfunction), the system requires corrective action before it can be restarted. Complete the following preprocessing inspection before attempting start-up. NOTE: The Integra uses a locked EMO button.

  • Page 121: Start-Up Procedure After Emo

    C h a p t e r 6 S T A R T - U P A F T E R E M O & WA F E R R E C O V E R Y START-UP PROCEDURE AFTER EMO After an emergency or premature shutdown of the system, it is extremely important that the person responsible for bringing the system back up performs all the tasks in the Pre Start-Up Check List.

  • Page 122: Start-Up After Opening Brush Box Lid

    STEP PROCEDURE COMMENT Verify that the CURRENT PROCESS box, at TO CHANGE CURRENT PROCESS: the bottom of the SYSTEM STATUS screen System Status screen: Touch EXIT. displays the correct Process Recipe name. MAIN MENU: Touch SELECT PROCESS. Select Process Screen: Touch the SELECT button next to the correct process.

  • Page 123: Wafer Recovery

    C h a p t e r 6 S T A R T - U P A F T E R E M O & WA F E R R E C O V E R Y WAFER RECOVERY Introduction The purpose of the wafer recovery procedure is to complete the processing of all wafers left in Integra processing stations after the system is prematurely shut down or detects a “Lost Wafer.”...

  • Page 124: Recovery Procedure For Process Failure

    3 If a wafer passes into the next station and the sensor in the receiving station fails to detect the wafer after the proper transfer time has elapsed, a “waiting for wafer” alarm is posted. The system will continue waiting to detect the wafer until the system is manually halted.
  • Page 125 C h a p t e r 6 S T A R T - U P A F T E R E M O & WA F E R R E C O V E R Y STEP PROCEDURE COMMENTS If the question reappears or if another This initiates the Wafer Recovery process.

  • Page 126: Equence Of Vents Uring Afer Ecovery

    STEP PROCEDURE COMMENTS Perform Steps 1-8 of the “Start-Up Procedure See associated comments. After EMO” on page 6-3 and 6-4. If the SYSTEM STATUS screen displays first, This displays the MAIN MENU. touch the EXIT button at the lower right corner of the screen.
  • Page 127 C h a p t e r 6 S T A R T - U P A F T E R E M O & WA F E R R E C O V E R Y NOTE: Throughout the procedure, whenever the system is working on a recovery or station reset, the system displays the following message at the bottom of the Wafer Recover window: “Abort Wafer Recovery?”...
  • Page 128 Wafer Confirmation Request Message Is a wafer in Brush 2 ? STEP PROCEDURE COMMENTS Wafer recovery continues with Brush Station #1. There may be an inquiry in the message box as to whether or not a wafer is present in NOTE: If Brush Station #1 the station.
  • Page 129 C h a p t e r 6 S T A R T - U P A F T E R E M O & WA F E R R E C O V E R Y Wafer Recovery Complete Message Recovery Complete ! 7/26/00 INTEGRA Operations Revision A...

  • Page 130: Four Wafer Recovery Scenarios After Emo

    FOUR WAFER RECOVERY SCENARIOS AFTER EMO Only use the following four wafer recovery scenarios when an EMO (power OFF) event has occurred. After inserting and turning the EMO recovery key to unlock the EMO button, power up the system. The four wafer recovery scenarios are: Wafer Recovery from Brush Station #2 after EMO;...
  • Page 131 C h a p t e r 6 S T A R T - U P A F T E R E M O & WA F E R R E C O V E R Y Wafer Recovery from Use this scenario to recover a wafer in Brush Station #1.
  • Page 132 Wafer Recovery Use this scenario to recover wafers in Brush Station #2 and Brush from Brush Station Station #1. In this scenario, there is no wafer in the Spin Station. 1 & 2 After EMO To begin, display the , then touch WAFER RECOVERY. MAIN MENU Respond to the following prompts as required.
  • Page 133 C h a p t e r 6 S T A R T - U P A F T E R E M O & WA F E R R E C O V E R Y Wafer Recovery Use this scenario to recover wafers in Brush Station #2, Brush Station from Brush Station #1 and Spin Station.

  • Page 134: Wafer Recovery With Power On (No Emo)

    WAFER RECOVERY WITH POWER ON (NO EMO) Three Wafer Recovery Scenarios - Power ON The following three wafer recovery scenarios are different from the preceding Wafer Recovery after EMO scenarios. These scenarios are performed with system power ON and represent ”lost” wafer conditions.
  • Page 135 C h a p t e r 6 S T A R T - U P A F T E R E M O & WA F E R R E C O V E R Y Wafer Recovery from Use this scenario to recover a wafer in Brush Station #2.
  • Page 136 Wafer Recovery from Use this scenario to recover a wafer in Brush Station #1. In this Brush Station #1 scenario, there is not a wafer in Brush Station #2. To begin, display the , then touch WAFER RECOVERY. MAIN MENU Respond to the following prompts as required.
  • Page 137 C h a p t e r 6 S T A R T - U P A F T E R E M O & WA F E R R E C O V E R Y Wafer Recovery Use this scenario to recover wafers in Brush Station #1, Brush Station from #2 and the Spin Station.

  • Page 138: Lost Wafer Recovery - Input Robot

    AFER ECOVERY NPUT OBOT The Input Robot wafer recovery procedure is independent from all Integra wafer recovery procedures. The Integra cleaner does NOT directly communicate with the Input Robot (from CMP). Only the CMP host computer communicates or “talks” to the Input Robot using GEM messages.

  • Page 139: Lost Wafer Recovery - Output Robot

    C h a p t e r 6 S T A R T - U P A F T E R E M O & WA F E R R E C O V E R Y AFER ECOVERY UTPUT OBOT The Output Robot wafer recovery procedure is independent from all Integra wafer recovery procedures.
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  • Page 141: Optional Process Settings

    C H A P T E R 7 O P T I O N A L P R O C E S S S E T T I N G S INTRODUCTION Screens in this chapter are based on Lam’s proprietary operating system software, ver.

  • Page 142: Select Wafer Diameter

    SELECT WAFER DIAMETER The Integra has two wafer diameter settings 150 mm, and 200 mm. The Integra predominantly uses the 200 mm wafer diameter (standard), with 150 mm the next most frequently used diameter. Use the following procedure to select the wafer diameter. 1 From the , touch SELECT OPTIONS to MAIN MENU screen...
  • Page 143 8 When the screen displays, touch EXIT to return SYSTEM OPTIONS to the ) screen. ONTRAK SYSTEMS INC. (MAIN MENU NOTE: Only changing the wafer diameter setting in the screen does SELECT DIAMETER not automatically setup the Integra to process the new wafer size. Specific Spin Station hardware must also be changed to accommodate the new wafer size.

  • Page 144: Activate/Deactivate Flat Finder

    ACTIVATE/DEACTIVATE FLAT FINDER Use the BRUSH #2 PROCESS RECIPE screen to activate/deactivate the flat finder. PASSWORD OR If the Integra is processing wafers that do not have a flat (i.e., 8 inch - KEY REQUIRED 200 mm), the flat finder speed must be set to “0.” If the flat finder speed is not set to “0,”...
  • Page 145 C h a p t e r 7 O P T I O N A L P R O C E S S S E T T I N G S 3 Touch EDIT RECIPE to deactivate all buttons except the EDIT RECIPE button.
  • Page 146 6 Touch MODIFY BRUSH #2 RECIPE. STANDARD TEST SHORT TEST2 7 Touch FLAT FINDER SPEED to display the screen. NUMBER PAD Choose the Flat Finder Speed button. Ensure that the correct Process Recipe name displays in this box. STANDARD INTEGRA Operations Revision A 7/26/00 20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
  • Page 147 C h a p t e r 7 O P T I O N A L P R O C E S S S E T T I N G S 8 When the displays, enter the new speed. NUMBER PAD STANDARD To DEACTIVATE the flat finder: If there is a number other than “0”...

  • Page 148: Select Process Recipe

    SELECT PROCESS RECIPE Variable settings and adjustments allow the Integra to process a variety of different types and sizes of wafers. Each wafer (type and size) has a Process Recipe specifically designed to meet its processing requirements. Use the to select SELECT PROCESS SCREEN a specific Process Recipe name.
  • Page 149 C h a p t e r 7 O P T I O N A L P R O C E S S S E T T I N G S 2 Touch the Process Recipe name (e.g., TEMP) in the Process Recipe list to select it.

  • Page 150: Envoy (Chemical Distribution Unit - Cdu) Status

    ENVOY (CHEMICAL DISTRIBUTION UNIT - CDU) STATUS Use the ENVOY STATUS button to establish a communications link between the chemical delivery system and the Integra system, for the delivery of NH OH. If the ENVOY STATUS button is Enabled, the communications link between the Integra system and the chemical delivery system is established.

  • Page 151: Maintenance Alarms

    C h a p t e r 7 O P T I O N A L P R O C E S S S E T T I N G S MAINTENANCE ALARMS Numerous maintenance requirements exist for the Integra. Some of these requirements, such as the replacement of edge cleaning roller pads, correlate to the number of wafers processed through the system.
  • Page 152 2 When the displays, touch the SYSTEMS OPTION SCREEN MAINTENANCE ALARMS button to display the screen. MAINTENANCE ALARMS 3 Touch the box in the column next to Maintenance SETPOINT Alarm 1 to enter the alarm’s setpoint or “trigger point” (number of wafers).
  • Page 153 C h a p t e r 7 O P T I O N A L P R O C E S S S E T T I N G S 4 When the screen displays, enter the number of wafers NUMBER PAD (setpoint) to be processed between alarms, then touch the ENTER button to record the number and close the...

  • Page 154: Brush Motor Alarms

    BRUSH MOTOR ALARMS Use the BRUSH MOTOR ALARMS button to enable the reporting of Brush Station brush motor failure alarms. The BRUSH MOTOR ALARMS button is a toggle switch which changes between Enabled and Disabled. When the feature is Enabled and a brush motor alarm (failure) is posted, a light bulb icon displays in the Warning section of screen and an audible alarm sounds.

  • Page 155: First Wafer Dose

    C h a p t e r 7 O P T I O N A L P R O C E S S S E T T I N G S FIRST WAFER DOSE Use the FIRST WAFER DOSE button to enable/disable the first wafer effect processing used to clean the brushes before the first wafer in a cassette or batch.
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  • Page 157: Smooth Wafer Travel Checklist

    C H A P T E R 8 SMOOTH WAFER TRAVEL CHECKLIST INTRODUCTION The smooth travel of wafers is essential for maximum cleaning effectiveness. Low particle count depends upon the precise handling of wafers while they are in the system. Use the START and STOP buttons on the control panel to facilitate closer inspection if necessary.
  • Page 158 Smooth Wafer Travel Checklist VISUAL INSPECTION AREA In Brush Station #1, measure to ensure that the wafer is centered, front to back, between the brushes. Measure from the box wall to the outside of roller hub. Both measurements should be identical. Remove the roller and measure from the truck assembly...
  • Page 159 C h a p t e r 8 S M O O T H W A F E R T R AV E L C H E C K L I S T Smooth Wafer Travel Checklist VISUAL INSPECTION AREA Visually inspect the alignment of the spindle fingers with the edges of the wafer on the carriage.
  • Page 160 Smooth Wafer Travel Checklist VISUAL INSPECTION AREA Check the alignment of the spindle fingers with the spindle in the locked position. Fingers should always be perpendicular to the back of the carriage. (The spindle finger arms should be parallel with the carriage transport rollers.) When the spindle is at its TOP position and ready to pass the wafer to the Output Robot, ensure that the Output Robot arm (paddle) is properly aligned.

  • Page 161: Process Recipe

    C H A P T E R 9 P R O C E S S R E C I P E Multiple Process Recipes can be defined for the Integra. Each Process PASSWORD OR KEY Recipe has numerous variables which can be set or changed to REQUIRED accommodate different processing specifications, including High Productivity Dispense (HPD).
  • Page 162 2 When the screen displays, touch DEFINE ENGINEERING MENU PROCESS RECIPE to access the PROCESS PROGRAM to select and edit a Process Recipe. MANAGEMENT SCREEN 3 Touch EDIT RECIPE to deactivate all buttons except EDIT RECIPE. When EDIT RECIPE is active, the button changes to CANCEL EDIT.
  • Page 163 C h a p t e r 9 P R O C E S S R E C I P E 4 The list of Process Recipe names is located on the right side of the screen. Touch the Process Recipe name to select it. The name briefly highlights and the EDIT SELECTED RECIPE button starts blinking.
  • Page 164 To create a complete Process Recipe each of the six processes: MODIFY BRUSH #1 RECIPE, MODIFY BRUSH #2 RECIPE, MODIFYBRUSH CLEANING, MODIFY SPIN EVENTS 1-3, MODIFY SPIN EVENTS 4-6, and MODIFY SPIN EVENTS 7-9 (circled buttons in previous illustration) must be accessed and their variables assigned.

  • Page 165: Modify Brush #1 Recipe

    C h a p t e r 9 P R O C E S S R E C I P E MODIFY BRUSH #1 RECIPE Use the following procedure to configure Brush Station #1 (Brush #1) EVENT parameters. 1 With the screen displayed, touch MODIFY STATION RECIPE MODIFY BRUSH #1 RECIPE.

  • Page 166: Set Or Change Event Parameters

    Three separate EVENTS, each with definable parameters. STANDARD Set or Change EVENT Parameters The following table defines switch, button, and setting information for the screen. BRUSH STATION DEFINE PROCESS BUTTON NAME & TYPE DESCRIPTION COMMENTS OH-1: Toggles ON and OFF the Current status of the switch ammonium hydroxide drip for the appears on the right side of...
  • Page 167 C h a p t e r 9 P R O C E S S R E C I P E BUTTON NAME & TYPE DESCRIPTION COMMENTS TIME: Set EVENT 1 first, EVENT 2 Sets the total time (10 of seconds) Displays the second and EVENT 3 last.

  • Page 168: Change Event Time

    Change EVENT TIME 3 Touch TIME in the appropriate EVENT column to display the NUMBER PAD screen. TIME buttons for the three EVENTS. STANDARD First complete the TIME operation for EVENT 1. If additional EVENTs are used, complete them in consecutive order; EVENT 1, EVENT 2, and EVENT 3.

  • Page 169: Change Event Roller Speed

    C h a p t e r 9 P R O C E S S R E C I P E STANDARD Change EVENT ROLLER SPEED 5 Touch ROLLER SPEED to display the NUMBER PAD 6 Enter the required ROLLER SPEED (RPM) in the NUMBER PAD screen (not shown), and touch ENTER.

  • Page 170: Change Event Brush Speed

    Change EVENT BRUSH SPEED 7 Touch BRUSH SPEED to display the NUMBER PAD 8 Enter the desired speed (RPM) in the (not shown), NUMBER PAD and touch the ENTER button. The BRUSH SPEED sets the speed (RPM) of both brushes in the Brush Station.

  • Page 171: Change Event Application Of Di High Flow

    C h a p t e r 9 P R O C E S S R E C I P E OH or HF toggle switches for each EVENT. STANDARD Change EVENT Application Of DI HIGH FLOW 10 Touch DI HIGH FLOW to activate (ON) or deactivate (OFF) the higher flow of DI water to the upper brushes or upper and lower for a specific EVENT.

  • Page 172: Change Event Application Of Di Low Flow

    Change EVENT Application Of DI LOW FLOW 11 Touch DI LOW FLOW to activate (ON) or deactivate (OFF) the low flow of DI water to the upper brushes or upper and lower brushes for a specific EVENT. DI (depending on hardware configuration) water LOW FLOW is typically OFF when the dispense chemical is already at the concentration required for process.

  • Page 173: Set Or Change Brush Station #1 General (Other) Parameters

    C h a p t e r 9 P R O C E S S R E C I P E Edge Clean toggle switches for each EVENT. STANDARD Set Or Change Brush Station #1 General (Other) Parameters The processes circled in the illustration below are not EVENT dependent. They are set to operate according to their own individual parameters.
  • Page 174 The following table defines Brush Station #1 parameter buttons. BUTTON NAME & TYPE DESCRIPTION COMMENTS EXIT SPRAY: Controls the DI water rinsing spray Current status is displayed on ON/OFF toggle switch. at the exit of Brush Station #1 and the right side of the button. the entrance to Brush Station #2.

  • Page 175: Change Entrance And Exit Spray

    C h a p t e r 9 P R O C E S S R E C I P E BUTTON NAME & TYPE DESCRIPTION COMMENTS ALARM BRUSH MODE: PROCESS ALARM TIMEOUT, Current status is displayed on UP/DOWN brush toggle FLUSH DURATION, and ALARM the right side of the button.

  • Page 176: Change Di Low Flow Mode

    STANDARD Change DI LOW FLOW MODE 14 Touch DI LOW FLOW MODE to toggle ON or OFF DI water after the last EVENT in Brush Station #1. If DI Low Flow Mode is ON, the low flow of DI will be turned on and remain on after the last processing EVENT in Brush Station #1 has ended.

  • Page 177: Change Process Alarm Timeout, Flush Duration And Flush Duration

    C h a p t e r 9 P R O C E S S R E C I P E STANDARD Change PROCESS ALARM TIMEOUT, FLUSH DURATION And FLUSH DURATION 15 PROCESS ALARM TIMEOUT, FLUSH DURATION, and ALARM BRUSH MODE work together. Touch PROCESS ALARM TIMEOUT to display the screen (not NUMBER PAD...
  • Page 178 STANDARD FLUSH When Alarm #158 timeout value is exceeded, and the DURATION, and ALARM BRUSH MODE values are set to their default values, then DI High Flow (default = 0) does not flow DI water the brushes onto the wafer, the brushes remains down (default), and and rollers continue to turn.

  • Page 179: Change Brush Idle Speed

    C h a p t e r 9 P R O C E S S R E C I P E 17 ALARM BRUSH MODE, PROCESS ALARM TIMEOUT, and FLUSH DURATION, work together. Touch ALARM BRUSH MODE to set the position of the brushes on the wafer (UP or DOWN) once Alarm #158 signals.

  • Page 180: Change Brush Height

    The BRUSH IDLE SPEED (RPM) sets the brush speed when the cleaner is idle (not processing wafers) but is still ON (START button pressed). Brushes must be kept wet and clean to be effective. DI water must remain ON during idle periods and the brushes must continue to rotate to maintain uniform wetness.

  • Page 181: Modify Brush #2 Recipe

    C h a p t e r 9 P R O C E S S R E C I P E MODIFY BRUSH #2 RECIPE 1 In the screen, touch MODIFY BRUSH MODIFY STATION RECIPE #2 RECIPE to display the SECOND BRUSH STATION PROCESS DEFINE screen.

  • Page 182: Change Flat Finder

    STANDARD Additional buttons are available in the BRUSH STATION #2 screen buttons when processing with the Flat Finder and/or HF. These are discussed in the following sections. For information on common buttons, see the preceding Brush Station #1 section. Change FLAT FINDER 2 Touch FLAT FINDER SPEED (previous illustration) to display (not shown) and set the speed.

  • Page 183: Brush Station #2 Screen Hf2 Key Setting

    C h a p t e r 9 P R O C E S S R E C I P E Brush Station #2 Screen HF2 Key Setting These buttons are ONLY visible on the screen if the Process Key on the control panel is turned to HF2.
  • Page 184 STANDARD TEST SHORT TEST2 There are three functional groupings of buttons on the BRUSH . The first two groupings STATION DEFINE CLEANING SCREEN are brush cleaning options that purge the brushes and edge cleaning rollers under two different conditions, Drip Wafer Count Brush Cleaning and Idle Time Brush Cleaning.

  • Page 185: Drip Wafer Count Brush Cleaning

    C h a p t e r 9 P R O C E S S R E C I P E BUTTON NAME & TYPE DESCRIPTION COMMENTS DRIP WAFER COUNT BRUSH CLEANING DRIP TIME: Defines the length of time that Works with the DRIP WAFER Displays the processing is halted for the brush...
  • Page 186 BUTTON NAME & TYPE DESCRIPTION COMMENTS IDLE TIME BRUSH CLEANING BRUSH IDLE TIMER: Sets the idle time that elapses Works with the CLEAN ON Displays the before the brush cleaning cycle TIME and the CLEAN OFF NUMBER PAD screen to set/change the begins.
  • Page 187 C h a p t e r 9 P R O C E S S R E C I P E BUTTON NAME & TYPE DESCRIPTION COMMENTS IDLE CHEM: When IDLE CHEM is set to ON If the IDLE CHEM, and/or the Toggle ON/OFF (default: and once the system is in IDLE, IDLE LOW FLOW DI, and/or...
  • Page 188 BUTTON NAME & TYPE DESCRIPTION COMMENTS FIRST WAFER EFFECT (BRUSH CONDITIONING) WAFER IDLE TIME: Defines the system idle time Time is only set in Brush Displays the NUMBER PAD allowed before the Brush Station Station #1. The Brush Station screen to set/change the 1st brushes require an initial dose of #2 dose is initiated using the wafer idle time.
  • Page 189 C h a p t e r 9 P R O C E S S R E C I P E BUTTON NAME & TYPE DESCRIPTION COMMENTS DOSE LOW FLOW DI: When DOSE LOW FLOW DI is set to When DOSE MODE is selected, Toggle ON/OFF (default: ON).

  • Page 190: Change Drip Time

    STANDARD Change DRIP TIME 2 Touch DRIP TIME for Brush Station #1 Cleaning to display the brush cleaning time. NUMBER PAD screen and set the 3 Enter the desired DRIP TIME(s) in of seconds that ammonium hydroxide will flow through (or drip onto) the brushes on the (not shown), and touch ENTER.

  • Page 191: Change Drip Wafer Count

    C h a p t e r 9 P R O C E S S R E C I P E STANDARD NOTE: If the Brush Station is set up to process chemical, then chemical will be dispensed to the brush, even if the DRIP CHEM button (operational during the coinciding ) is toggled to the OFF position.

  • Page 192: Change Drip Chem

    STANDARD Change DRIP CHEM 10 Toggle the DRIP CHEM ON or OFF (default: OFF) for Brush Station #1 or Brush Station #2. Once the number of wafers in the DRIP WAFER COUNT occurs, processing halts, and the DRIP CHEM flow turns ON so that the brushes can be cleaned.

  • Page 193: Change Drip Low Flow Di

    C h a p t e r 9 P R O C E S S R E C I P E STANDARD Change DRIP LOW FLOW DI 11 Toggle the DRIP LOW FLOW DI ON or OFF (default: ON) for Brush Station #1 or Brush Station #2.

  • Page 194: Change Drip Hi Flow Di

    STANDARD Change DRIP HI FLOW DI 12 Toggle the DRIP HI FLOW DI ON or OFF (default: OFF) for Brush Station #1 or Brush Station #2. Once the number of wafers in the DRIP WAFER COUNT occurs, processing halts, and the DRIP LOW FLOW DI turns ON so that the brushes can be cleaned.

  • Page 195: Change Idle Time Brush Cleaning Interval

    C h a p t e r 9 P R O C E S S R E C I P E STANDARD Change Idle Time Brush Cleaning Interval Use the second set of three buttons to set the timers used in the brush(s) cleaning process during an extended system idle time.

  • Page 196: Change Brush Idle Time

    STANDARD Change BRUSH IDLE TIME 13 Touch BRUSH IDLE TIMER for Brush Station #1 Cleaning to display the set the time delay. NUMBER PAD and 14 Enter the desired time in of seconds on the (not NUMBER PAD shown), and touch ENTER. Use the BRUSH IDLE TIMER button to set the time delay between the machine becoming idle and the start of the first brush cleaning cycle.

  • Page 197: Change Brush Idle On Time

    C h a p t e r 9 P R O C E S S R E C I P E STANDARD Change BRUSH IDLE ON TIME 17 Touch BRUSH IDLE ON TIME (a.k.a. BRUSH CLEAN ON TIME) for Brush Station #1 Cleaning to display the NUMBER PAD set the brush cleaning (clean on) duration time.

  • Page 198: Change Brush Idle Off Time

    STANDARD Change BRUSH IDLE OFF TIME 21 Touch BRUSH IDLE OFF TIME (a.k.a. BRUSH CLEAN OFF TIME) for Brush Station #1 Cleaning to display the NUMBER and set the length (duration) of the time delay between brush cleaning cycles. 22 Enter the desired time in of seconds on the (not NUMBER PAD...

  • Page 199: Change Edge Clean On Time

    C h a p t e r 9 P R O C E S S R E C I P E STANDARD Change EDGE CLEAN ON TIME 25 Touch EDGE CLN ON TIME for Brush Station #1 Cleaning to display the and set the edge cleaning (clean on) NUMBER PAD duration time.

  • Page 200: Change Edge Clean Off Time

    STANDARD Change EDGE CLEAN OFF TIME 29 Touch EDGE CLN OFF TIME for Brush Station #1 Cleaning to display the and set the length (duration) of the time NUMBER PAD delay between edge cleaning cycles. 30 Enter the desired time in of seconds on the (not NUMBER PAD...

  • Page 201: Change Idle Chem

    C h a p t e r 9 P R O C E S S R E C I P E STANDARD Change IDLE CHEM 33 Toggle the IDLE CHEM ON or OFF (default: OFF) for Brush Station #1 or Brush Station #2. The Idle Chem icon only displays when Lo Toxic chemicals such as NH OH, DI, etc.

  • Page 202: Change Idle Low Flow Di

    Icon only displays when a Lo Toxic chemical such as OH is used. STANDARD NOTE: IDLE CHEM is not typically enabled (ON) for Lo Toxic chemicals unless the system is processing wafers 100% of the time. If IDLE CHEM is ON during the brush idle time, the consistency (dosing) of the process chemistry pH is affected, and the associated dose mode parameters must be adjusted accordingly.

  • Page 203: Change Idle Hi Flow Di

    C h a p t e r 9 P R O C E S S R E C I P E STANDARD Change IDLE HI FLOW DI 35 Toggle the IDLE HI FLOW DI ON (default: ) for Brush Station #1 or Brush Station #2. Once the system is in IDLE, and the idle time elapses (BRUSH IDLE TIMER), the IDLE HI FLOW DI will turn ON to clean the brushes.

  • Page 204: Wafer Effect (Brush Conditioning)

    STANDARD Wafer EFFECT (Brush Conditioning) The third set of buttons (see illustration on following page) are specifically designed to prepare (chemically dose) the brushes in both Brush Stations either: 1) before processing the first wafer after having sat idle (1 WAFER) 2) before processing all (every) wafer (ALL WAFERS).
  • Page 205 C h a p t e r 9 P R O C E S S R E C I P E Except for systems configured with DI Low Flow air controll valves, DI water flows through the continuously turning brushes. During the Wafer (Effect) Brush Conditioning process, the brushes in both stations are flooded (either through the brushes or onto the brushes) with process chemical to correctly balance the chemical saturation and pH...

  • Page 206: Dose Mode - 1St Wafer Or All Wafers

    DOSE MODE - 1ST WAFER or ALL WAFERS 37 Touch DOSE MODE for Brush Station #1 Cleaning to select either 1 WAFER or ALL WAFERS. After the Wafer Idle Time (next page) has elapsed, DOSE MODE turns on to precondition the brushes prior to processing. Brush dosing or conditioning is done by flowing process chemical and/or Low Flow DI water to saturate the brushes to the required processing pH.

  • Page 207: Change Wafer Dose Time

    C h a p t e r 9 P R O C E S S R E C I P E 41 Enter the desired time in of seconds on the (not NUMBER PAD shown), and touch ENTER. WAFER IDLE TIME value displays on the screen in seconds.
  • Page 208 44 Enter the desired time in of seconds on the (not NUMBER PAD shown), and touch ENTER. WAFER DOSE TIME value displays on the screen in seconds. Use WAFER DOSE TIME to set the time during which the chemical flows into (TTB) or onto the Brush Station(s) top brushes before a wafer can enter the Brush Station.

  • Page 209: Change Dose Chem

    C h a p t e r 9 P R O C E S S R E C I P E Change DOSE CHEM 47 Toggle the DOSE CHEM ON or OFF (default: OFF) for Brush Station #1 or Brush Station #2. When DOSE CHEM is set to ON, process chemical is used to dose the brushes.

  • Page 210: Change Dose Hi Flow Di

    STANDARD Change DOSE HI FLOW DI 49 Toggle the DOSE HI FLOW DI ON or OFF (default: OFF) for Brush Station #1 or Brush Station #2. When DOSE HI FLOW DI is set to ON, high flow DI water is used to dose the brushes.

  • Page 211: Modify Spin Events

    C h a p t e r 9 P R O C E S S R E C I P E STANDARD MODIFY SPIN EVENTS If the is displayed, touch PROCESS PROGRAM MANAGEMENT SCREEN CHANGE PROCESS to display the screen. MODIFY STATION RECIPE If the screen is displayed, touch the first...
  • Page 212 Time 0-1800 of seconds (3 min max) Spindle Speed 0, or 30-2500 (Never run above 2000 rpm with wafer present.) Megasonic Sweeps 0-25 sweeps Seconds/Sweep 0, or 5-15 seconds/sweep Spin Station recipe access buttons used to set the 9 EVENTS STANDARD that control the total TEST...

  • Page 213: Choose Spin Station Event

    C h a p t e r 9 P R O C E S S R E C I P E Each of the three screens have three EVENTS. The EVENTS are numbered at the top of each screen (e.g., EVENT 1, EVENT 2, and EVENT 3).

  • Page 214: Change Lower Rinse

    STANDARD Change LOWER RINSE 3 Touch LOWER RINSE to activate (ON) or deactivate (OFF) the bottom spray rinse. The current status displays on the right side of the button. The LOWER RINSE button is an ON/OFF toggle switch for the DI water spray applied to the bottom of the wafer throughout the spin EVENT.

  • Page 215: Megasonic Generator Buttons

    C h a p t e r 9 P R O C E S S R E C I P E The HEAT LAMP button is a toggle switch which turns ON/ OFF the heat lamp during the entire time that the spin EVENT is operating. STANDARD The heat lamp is used to aid the drying procedure during the spin cycle.

  • Page 216: Change Meg Event Time

    STANDARD Change Meg Event TIME 6 Touch TIME to display the screen (not shown) and NUMBER PAD set the Meg spin EVENT time in 10 of seconds. TIME displays on the screen in seconds. STANDARD NOTE: For the Megasonic Event only, set the time to 0 seconds. The event time is the actual time it takes to complete the programmed number of sweeps at the sweep per seconds programmed during the event.

  • Page 217: Change Megasonic Sweep

    C h a p t e r 9 P R O C E S S R E C I P E 8 Enter the speed in RPM on the and touch ENTER. NUMBER PAD, The SPINDLE SPEED setting regulates the revolutions per minute (RPM) at which the spindle turns the wafer in the Spin Station during this EVENT.

  • Page 218: View Process Recipe

    The MEGASONIC SWEEPS button is used to display the and set the number of sweeps that will take place NUMBER PAD during the EVENT. In this setting, a sweep is defined as the travel cycle of the megasonic arm from the wafer edge to the wafer center, and back to the wafer edge.
  • Page 219 C h a p t e r 9 P R O C E S S R E C I P E 1 If the is displayed, PROCESS PROGRAM MANAGEMENT SCREEN touch CHANGE PROCESS to display the MODIFY STATION screen. When the screen displays, touch the VIEW RECIPE RECIPE button to display the VIEW PROCESS PROGRAM SCREEN...
  • Page 220 STANDARD Currently the Process Recipe file viewed in the VIEW PROCESS can be copied to an OS-9 or DOS floppy disk. PROGRAM SCREEN Integra software runs on the OS9 operating system (not DOS) and Process Recipes files are stored in a binary OS9 format. Unless a special 3 party screen capture application is used (not provided by Lam), screen settings must be manually transferred from the...
  • Page 221 C h a p t e r 9 P R O C E S S R E C I P E Integra Process Of Record (POR) Program - _________________________ Diameter: 200 mm Application: _______________________ Recipe: _____________ 1st Brush Station Event 1 Event 2 Event 3 Other BB1 Params...
  • Page 222 9-62 INTEGRA Operations Revision A 7/26/00 20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
  • Page 223 C h a p t e r 9 P R O C E S S R E C I P E SUMMARY OF SYSTEM RANGES Parameter Range Units Brush #1 and #2 Stations Entrance Spray (Brush #1 only) On/Off Binary (1 or 0) Process Chemistry On/Off Binary (1 or 0)
  • Page 224 Flowmeters Use the following Futurestar Pathfinder flowmeter rate charts to set integra DI water and chemical flowmeters to optomize customer process chemistries. The 20 cc/mm flow meter’s Actual Flow Rate is for a 29% ammonium hydroxide solution. All other flow meter Actual Flow Rates are for DI water or a very dilute chemical solution (i.e., >...
  • Page 225 C h a p t e r 9 P R O C E S S R E C I P E LAM P/N 35-0005-014 250 CC/MIN FLOWMETER - Low Flow Series CC/MIN 0.06 0.05 0.04 0.03 0.02 ACCURACY + 5% FS 0.01 MARK 1 - 10 FLOW RATE 5-250 CC/MIN in H20 w/Solid Teflon Float...
  • Page 226 FUTURESTAR PATHFINDER LAM P/N 35-0005-012 1000 CC/MIN FLOWMETER CC/MIN 1000 0.25 0.15 ACCURACY + 5% FS 0.05 MARK 1 - 10 FLOW RATE 90-1000 CC/MIN in H20 LAM P/N 35-0005-024 1500 CC/MIN FLOWMETER CC/MIN 1600 1350 0.326 1100 0.226 ACCURACY + 5% FS 0.126 0.026 MARK 1 - 10...

  • Page 227: Recipe Transfer Procedure (Copy Disk)

    C h a p t e r 9 P R O C E S S R E C I P E LAM P/N 35-0005-011 4000 CC/MIN FLOWMETER CC/MIN 4500 4000 3500 3000 2500 2000 1500 ACCURACY + 5% FS 1000 MARK 1 - 10 FLOW RATE 1000-4000 CC/MIN in H20 RECIPE TRANSFER PROCEDURE (COPY DISK)
  • Page 228 CURRENT RECIPE: “STANDARD”, Please select an operation STANDARD TEST SHORT TEST2 3 Touch YES to begin the format procedure, or NO if no disk is to be formatted. In the following illustration notice that the FORMAT FLOPPY button changes to the CANCEL FORMAT button. If a floppy is not inserted in the drive, a message displays on the screen asking if a floppy disk is in the drive.
  • Page 229 C h a p t e r 9 P R O C E S S R E C I P E CURRENT RECIPE: “STANDARD”, Please select an operation STANDARD TEST SHORT TEST2 5 Select the Process Recipe(s) to be copied by touching one or more Process Recipe name(s) in the Recipe Column.

  • Page 230: Define Default Process

    Recipe(s) Selected ALL RECIPES STANDARD TEST SHORT TEST2 CANCEL WRITE Copy Selected Recipe(s) To Floppy 7 Touch CANCEL WRITE (flashing yellow) if there is a need to stop the copy process before it is complete. 8 When the copy process is complete, touch EXIT to exit the screen. DEFINE DEFAULT PROCESS The Define Default Process feature is intended to prevent processing with an incorrect process recipe after field service maintenance or...
  • Page 231 C h a p t e r 9 P R O C E S S R E C I P E STANDARD Current Process Status Box 7/26/00 INTEGRA Operations Revision A 9-71 20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
  • Page 232 2 When the screen displays, touch DEFINE ENGINEERING MENU DEFAULT PROCESS to access the DEFAULT PROCESS PROGRAM screen STANDARD 3 When the DEFAULT PROCESS PROGRAM screen displays, the message “DEFAULT RECIPE is DISABLED, please select an operation.” flashes on the screen. Touch SELECT NEW DEFAULT to start the selection process.
  • Page 233 C h a p t e r 9 P R O C E S S R E C I P E 4 The SELECT NEW DEFAULT button changes color to indicate it is selected and the text changes to CANCEL NEW DEFAULT. Also, the message at the top of the screen changes to “Select Recipe for Default.”...
  • Page 234 RECIPE: “STANDARD” is DEFAULT, please select an operation. STANDARD TEST SHORT The currently running TEST2 procedure “TEST” must match the selected default procedure “STANDARD.” If the recipes are different, an operator message displays on the console. TEST Important: The parameters in the default recipe cannot be change while the recipe is designated the “default recipe.”...
  • Page 235 C h a p t e r 9 P R O C E S S R E C I P E 7 The DISABLE DEFAULT RECIPE button changes color to indicate it is selected and the text changes to CANCEL DEFAULT RECIPE.The message “Default will be disabled! Are you sure?”...
  • Page 236 9 Touch SUSPEND DEFAULT RECIPE to suspend the currently selected default recipe. RECIPE: “STANDARD” is DEFAULT, please select an operation. STANDARD TEST SHORT TEST2 10 The SUSPEND DEFAULT button momentarily changes color to indicate it is selected and the text changes to CANCEL SUSPEND DEFAULT.
  • Page 237 C h a p t e r 9 P R O C E S S R E C I P E 11 Touch RESTORE DEFAULT RECIPE to restore or the currently selected default recipe. RECIPE: “STANDARD” is SUSPENDED, please select an operation. STANDARD TEST SHORT...
  • Page 238 (This page intentionally left blank.) 9-78 INTEGRA Operations Revision A 7/26/00 20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)

  • Page 239: Alarms

    C H A P T E R 10 A L A R M S INTRODUCTION The Integra is designed with numerous sensors which monitor the various system activities. If there is a failure in the system, an alarm is generated. Each alarm generates a system response. There are several types of responses which accompany the alarms.

  • Page 240: Alarm Types

    ALARM TYPES When an alarm is generated it may take any combination of forms. The alarm forms for the Integra are listed below: There is a light bulb icon generated in the lower right corner of screen. This signifies that there is a warning SYSTEM STATUS of some sort.

  • Page 241: Alarms On The Screen

    C h a p t e r 1 0 A L A R M S ALARMS ON THE SCREEN It is the operator’s responsibility to immediately record and resolve each alarm that displays on the screen before touching the light bulb to erase it.
  • Page 242 In order to view past alarms, displayed in chronological order, touch ALARMS on the ) screen. ONTRAK SYSTEMS INC. MAIN MENU STANDARD 100 BRUSH STATION 2 ROLLER MOTOR SPEED 200 MM screen displays. ALARM MESSAGES screen (see illustration above) has two ALARM MESSAGES columns.

  • Page 243: Gem Alarms (Error Messages )

    C h a p t e r 1 0 A L A R M S GEM A LARMS RROR ESSAGES GEM alarms display in the box on the Integra CURRENT ALARM cleaner’s screen. GEM alarms can also be reviewed SYSTEM STATUS in the Alarm logs of both the CMP host system and Integra cleaner.

  • Page 244: Alarm Configuration Screen

    ALARM CONFIGURATION SCREEN The majority of alarms are initiated by a sensor. In many cases, an increment of time or an operating range (%) is connected to the sensor signal in order to ensure the accurate performance of a particular component. In order to offer more flexibility to the Integra, an alarm configuration system is available for modifying selected alarms.

  • Page 245: Selectable Alarms

    C h a p t e r 1 0 A L A R M S ELECTABLE LARMS Accessing Selectable Alarms 1 From the screen touch SELECT OPTIONS. MAIN MENU 200 MM STANDARD 100 BRUSH STATION 2 ROLLER MOTOR SPEED 2 Touch the BRUSH MOTOR ALARMS button to enable or disable the following four alarms: Alarm 19, Alarm 20, Alarm 98, Alarm 99.

  • Page 246: Programmable Alarms

    ROGRAMMABLE LARMS Accessing Alarm Configuration Menu 1 From the screen touch ALARM ENGINEERING MENU CONFIGURATION. STANDARD 100 BRUSH STATION 2 ROLLER MOTOR SPEED 200 MM Alarm Configuration Menu Screen Description ALARM CONFIGURATION MENU Screen 100 BRUSH STATION 2 ROLLER MOTOR SPEED 200 MM STANDARD 10-8...

  • Page 247: Alarm Description

    C h a p t e r 1 0 A L A R M S Alarm Description The fields (boxes) circled at the top of the illustration above, display the identifying information for the alarm being configured. The Alarm ID Number and Description also display in the CURRENT ALARM box (bottom right) of the screen when an SYSTEM STATUS...

  • Page 248: Choosing An Alarm For Configuration

    3 “Press EDIT to change configuration.” This message signifies that the alarm has configurable parameters. 4 “Press SAVE or UNDO after changes are complete.” Instructs the user to save or undo configuration changes. Choosing an Alarm for Configuration The Alarm List window has a scroll bar on its right side (see following illustration).
  • Page 249 C h a p t e r 1 0 A L A R M S 1 RESPONSE: Use the section at the top left of the ALARM window to define the system response to the CONFIGURATION alarm. Their are four buttons which are toggle switches that can be set to Enabled, Disabled or Not Configurable (N/C).
  • Page 250 STANDARD 200 MM 100 BRUSH STATION 2 ROLLER MOTOR SPEED SAVE: Saves and sets the alarm parameters in the Configuration box. This includes any changes that were made during the configuration procedure. CLEAR: Clears all configured alarm parameters and resets them to DISABLED.

  • Page 251: Handling Alarms

    C h a p t e r 1 0 A L A R M S HANDLING ALARMS Each alarm must be handled individually. Some are resolved simply by waiting until the situation creating the alarm has completed its cycle. (e.g., ALARM 1, System Initialization.) Others require operator or technician intervention.

  • Page 252: Alarm Id: 12

    Reason: The operator can set two programmable alarms in the system when a set number of wafers have been processed. These alarms are typically used for the notification of a preventative maintenance event such as a brush change. The alarms can also be used for any other reasons the operator may want to know when a certain wafer count is reached (e.g.

  • Page 253: Alarm Id: 18

    C h a p t e r 1 0 A L A R M S Reason: This alarm is only valid on systems that support the exhaust sensor option. Exhaust sensors are typically installed on systems with HF capability. The alarm is posted anytime the exhaust sensor shows no exhaust.

  • Page 254: Alarm Id: 24

    Reason: This alarm is posted whenever a leak is detected on a system equipped with the DI shutoff option. Disposition: System is put into CLEAR mode. GEM Alarm. GEM ALID: 8 ALCD ALTX ON CEID OFF CEID 8 Leak detected in machine floor. ID: 9 LARM Description: Leak Detected In System Floor...

  • Page 255: Alarm Id: 30

    C h a p t e r 1 0 A L A R M S Reason: This alarm is only valid on systems with the optional Rippey Water Heater Interface. The alarm is posted if there is a major failure of the water heater. A typical failure message would be “no water available to the cleaner.”...

  • Page 256: Alarm Id: 36

    Posting Program: Brush 1 Station Alarm Type: Alarm & Sonalert Reason: This alarm indicates that the Brush Station #1 has been told to receive a wafer but after 10 seconds, the leading edge of the wafer has still not been detected. Disposition: If the system uses a standard wet spray Input Station, the Brush 1 Station program will not continue until the leading edge of the wafer is seen.
  • Page 257 C h a p t e r 1 0 A L A R M S GEM Alarm GEM ALID: 16 ALCD ALTX ON CEID OFF CEID 16 Brush Station 1 error trying to open roller. ID: 17 LARM Description: Brush Station 1 Error Trying To Close Rollers To 6 Inch Posting Program: Brush 1 Station Alarm Type: Alarm &...
  • Page 258 Alarm Type: Alarm & Sonalert Reason: At the end of every Brush Station #1 process event the actual speed is compared to the program recipe speed. This alarm condition is posted whenever the actual speed varies from the programmed speed by more than 10%. Disposition: System is put into CLEAR mode.
  • Page 259 C h a p t e r 1 0 A L A R M S Posting Program: Brush 2 Station Alarm Type: Alarm & Sonalert Reason: This alarm indicates that a wafer has left Brush Station #1 but after 10 seconds the leading edge of the wafer has still not been detected.
  • Page 260 24 Brush #2 can’t move wafer off flat. ID: 25 LARM Description: Brush Station #2 Can’t Locate Wafer Flat Posting Program: Brush 2 Station Alarm Type: Alarm & Sonalert Reason: This alarm indicates that the flat cannot be detected. Disposition: The Brush 2 Station program will not continue until the flat is detected.
  • Page 261 C h a p t e r 1 0 A L A R M S 27 Spin Station Wafer Sensor doesn’t see wafer. ID: 28 LARM Description: Brush Station #2 Error Trying To Open Rollers Posting Program: Brush 2 Station Alarm Type: Alarm &...
  • Page 262 Disposition: The Brush 2 Station program will not continue until all roller position sensors report that the rollers are closed to the 8 inch position. GEM Alarm. GEM ALID: 30 ALCD ALTX ON CEID OFF CEID 30 Brush #2 Error trying to close rollers to 8 inch. ID: 31 LARM Description: Brush Station #2 Error Looking For Spin Spindle Lock...
  • Page 263 C h a p t e r 1 0 A L A R M S ID: 33 LARM Description: Brush #2 Error Looking For Spin Carriage Extend Sensor Posting Program: Brush 2 Station Alarm Type: Alarm & Sonalert Reason: If the Spin Carriage is not in the extend position when it is time to release the wafer into the Spin Station, an attempt is made by the Brush 2 Station program to extend it.
  • Page 264 Disposition: The Brush 2 Station program will not continue until the Z_Lock locked sensor detects that the Z_Lock is locked. GEM Alarm. GEM ALID: 35 ALCD ALTX ON CEID OFF CEID 35 Brush #2 Error looking for Z_Lock Locked Sensor. ID: 36 LARM Description: Brush Station #2 Error Looking For Z_Lock Unlocked...
  • Page 265 C h a p t e r 1 0 A L A R M S Disposition: The system is put into STOP mode and the spin process terminates and readies itself for the next wafer. GEM Alarm. GEM ALID: 38 ALCD ALTX ON CEID OFF CEID...
  • Page 266 Reason: Before the Megasonic Generator is turned on, the flow sensors must indicate adequate water flow. This alarm is generated if the high flow sensor reports high flow. Disposition: The system is put into STOP mode and the Spin Station readies itself for the next wafer. Wafer recovery needs to be executed in order to re-process the wafer.
  • Page 267 C h a p t e r 1 0 A L A R M S Posting Program: Spin Station Alarm Type: Alarm & Sonalert Reason: This alarm is only valid on systems that have the spin stepper option. When the stepper moves the spindle to the 90 degree position, the 90 degree position sensor is checked to make sure the move was made correctly.
  • Page 268 Troubleshoot: To aid in troubleshooting the failure, record the station states on the screen, before clearing the SYSTEM STATUS alarm. Series II CE and Synergy systems using output robot (e.g., SMIF, PRI, etc.) in CONTINUOUS mode can generate Alarm 91, 90, and 46 (in that order) if the output robot’s cycle time and operator pod (cassette) handling time exceeds the three minute delay time.
  • Page 269 C h a p t e r 1 0 A L A R M S Disposition: The Spin Station program will not continue until the operation is complete. GEM Alarm. GEM ALID: 48 ALCD ALTX ON CEID OFF CEID 48 Spin Time-out waiting for Rotation Arm to complete.
  • Page 270 Posting Program: Spin Station Alarm Type: Alarm & Sonalert Reason: An attempt to lock the Z_Lock mechanism has failed. This alarm is only valid on systems with the Z_Lock option. Disposition: The Spin Station program will not continue until the Z_Lock locked sensor detects that the Z_Lock is locked.
  • Page 271 C h a p t e r 1 0 A L A R M S Reason: This alarm is only valid on systems with the Spin Door Lock option. This alarm indicates a failure to unlock the door. Disposition: The Spin Station program will not continue until the spin door latch sensor detects that the spin door is in the unlock position.
  • Page 272 Reason: This alarm indicates that the sensor does not report the Megasonic arm as being retracted. Disposition: Spin Station program will not continue until megasonic arm home retract sensor reports the arm in the retract position. GEM Alarm. GEM ALID: 57 ALCD ALTX ON CEID OFF CEID...
  • Page 273 C h a p t e r 1 0 A L A R M S Reason: When the N arm is told to extend, the N arm sensor is monitored. If after 10 seconds, the sensor does not report the extend position, this alarm is posted.
  • Page 274 ID: 63 LARM Description: Time-out Looking For Carriage Retract Sensor Posting Program: Spin Station Alarm Type: Alarm & Sonalert Reason: The carriage is driven by a DC motor. The motor first runs at a high speed, then after a calculated time, runs at a slower speed.
  • Page 275 C h a p t e r 1 0 A L A R M S Disposition: The Spin Station program will not continue as long as the spin finger open sensor detects the spin fingers in the open position. GEM Alarm. GEM ALID: 65 ALCD ALTX...
  • Page 276 Reason: If an E-stop (EMO) condition occurs while the Spin Station is processing, all motions and flows are halted. When the E-stop (EMO) condition no longer exists, everything is restored back to it’s original state and processing continues. If Megasonic processing was taking place when the E-stop (EMO) occurred and is re-started without first verifying proper water flow, an error will occur.
  • Page 277 C h a p t e r 1 0 A L A R M S Reason: After the rotation arm is told to make the last move down into the Spin Station to remove the wafer, the rotation at spin position sensor is monitored. If after 10 seconds, the sensor does not report this position, the alarm is posted.
  • Page 278 Disposition: The system is put into STOP mode. The assumption is that the wafer has been dropped into the Spin Station. If the wafer is still in the Unload Handler fingers, then the wafer recovery procedure should be used to save the wafer. When the START button is pressed, the Unload Handler fingers will open, so that a wafer can be removed.
  • Page 279 C h a p t e r 1 0 A L A R M S 74 Failure in Unload Handler, can’t find wafer in Lifter (blade). ID: 75 LARM Description: Time-out In Unload, Wrist Not In Output Position Posting Program: Unload Handler Alarm Type: Alarm &...
  • Page 280 Reason: After the Unload Handler fingers are opened to release the wafer onto the blade lifter, the wrist is told to go to the “clear” position. The wrist at output sensor is checked to make sure that the move has taken place. If the wrist at output sensor reports that the wrist is still in the “output”...
  • Page 281 C h a p t e r 1 0 A L A R M S Disposition: The Unload Handler process will not continue until the spin carriage retract sensor reports the carriage in the “retract” position. GEM Alarm. GEM ALID: 79 ALCD ALTX ON CEID OFF CEID...
  • Page 282 ID: 82 LARM Description: Invalid Output Cassette Mode, Cannot Maintain Slot/Slot Posting Program: Output station Alarm Type: Alarm & Sonalert Reason: The Output Station can only support Slot-to-Slot modes that put wafer #1 from the input cassette into slot #1 in the output cassette.
  • Page 283 C h a p t e r 1 0 A L A R M S Disposition: None. All operations continue. Output cassette mode is changed to “continuous.” GEM Alarm. GEM ALID: 84 ALCD ALTX ON CEID OFF CEID 84 Output Cassette Mode set to CONTINUOUS. ID: 85 LARM Description: Slot Integrity Lost.
  • Page 284 Disposition: System is put into CLEARING mode. GEM Alarm. GEM ALID: 87 ALCD ALTX ON CEID OFF CEID 87 Chemical Delivery System (CDU) reports an Alarm condition. ID: 88 LARM Description: Megasonic Low Flow Detected During Meg Processing Posting Program: Spin Station Alarm Type: Alarm &...
  • Page 285 C h a p t e r 1 0 A L A R M S Posting Program: Spin Station Alarm Type: Alarm & Sonalert Reason: When the spin process is complete, the spindle is sent to the TOP position and the Unload Handler is instructed to remove the wafer.
  • Page 286 Reason: After failing to see the spindle lock, an assumption is made that the locking mechanism is hung in the detent. The spindle lock is retracted, allowing the spindle to rotate and then re-engaged in an attempt to re-lock the spindle rotation position. Disposition: The Spin Station process will not continue until the spindle is properly locked.
  • Page 287 C h a p t e r 1 0 A L A R M S Reason: This alarm is posted whenever the Envoy reports an alarm and the Envoy interface is enabled. This alarm is currently for a leak in the Envoy. Disposition: The system is put into CLEARING mode.
  • Page 288 Alarm Type: Alarm & Sonalert Reason: This alarm is posted whenever the Brush2 upper brush speed tolerance is out of specifications by more than 10%. The actual test is made at the end of the last process event. The process event must be at least 4 seconds for the test to take place. Disposition: System is put into CLEARING mode.
  • Page 289 C h a p t e r 1 0 A L A R M S Alarm Type: Alarm & Sonalert Reason: This alarm is only valid on systems with the Multiple Spin Station Wafer Sensor option. It is posted if the middle sensor sees the wafer but the 8 inch wafer (downstream) sensor doesn’t see the wafer.
  • Page 290 GEM Alarm. GEM ALID: 103 ALCD ALTX ON CEID OFF CEID 103 Spin Station’s 6 Inch Wafer Sensor did not detect wafer. ID: 104 LARM Description: Timeout Waiting For Megasonic Start-up Posting Program: Spin Station Alarm Type: Alarm & Sonalert Reason: This alarm is posted when the Megasonic arm doesn’t move when it is time to run the Megasonic operation.
  • Page 291 C h a p t e r 1 0 A L A R M S Disposition: The Input Station process will not continue until the lid open sensor detects a lid open condition. GEM Alarm. GEM ALID: 106 ALCD ALTX ON CEID OFF CEID 106 Open Lid timeout waiting for Lid Open Sensor.
  • Page 292 Reason: This alarm is posted when the PRI interface is waiting for the Input Station lid to close and the lid open sensor indicates that the lid is in the open position. Disposition: The Input Station process will not continue until the lid open sensor is not detecting a lid open condition.
  • Page 293 C h a p t e r 1 0 A L A R M S 111 Open Door timeout waiting for Door Open Sensor. ID: 112 LARM Description: Open Door Timeout Waiting For Door Closed Sensor Posting Program: Input Station Alarm Type: Alarm &...
  • Page 294 Reason: This alarm is only valid on systems that support the Bulkhead or Input Station Door Wafer Interface option. This alarm is posted when the Bulkhead Door interface (Input Station door) is waiting for the door to close and the door open sensor indicates that the door is in the open position.
  • Page 295 C h a p t e r 1 0 A L A R M S Disposition: The Input Station will not continue until the lid lock and lid unlocked sensors indicate that the Input Station lid is properly locked. The lid lock sensor should indicate a true condition and the lid unlocked sensor should indicate a false condition.
  • Page 296 ID: 119 LARM Description: Stop Caused By Wafer Out Of Position In Spin Station Posting Program: Spin Station Alarm Type: Alarm & Sonalert Reason: The spin fingers have closed on a wafer and the system detects that the left or right wafer sensor can see the wafer, indicating that the wafer is out of position in the Spin Station fingers.
  • Page 297 C h a p t e r 1 0 A L A R M S Reason: This alarm is only posted on Series IIc, Synergy, and Integra systems that use an HF Brush Station. The exhaust baffle is open when the system expected it to be closed. The exhaust baffle must be closed when processing wafers in the Brush Station.
  • Page 298 Reason: This alarm is only posted on Series II (Series IIi) systems that use a CMP host with GEM interface. The DSS-200 or Integra has “timed out” waiting for the CMP host system to issue the GEM Close Door remote command. The GEM Close Door remote command instructs the DSS-200 or Integra to close the Input Door (not Input Station lid).
  • Page 299 C h a p t e r 1 0 A L A R M S Disposition: The GEM Close Door remote command is not executed, the Input Door (not Input Station lid) remains open and the Input Station continues to wait for a valid (Take Wafer or Close Door) GEM remote command.
  • Page 300 Disposition: The GEM Wafer Accepted remote command is not executed and the Spin Station continues to wait for a valid GEM remote command. GEM Alarm. GEM ALID: 127 ALCD ALTX ON CEID OFF CEID 127 Output Robot Arm still detected in Spin Station Tunnel.
  • Page 301 C h a p t e r 1 0 A L A R M S Reason: This alarm is only posted on Series IIc, Synergy, and Integra systems that use an HF Brush Station. The Monitor program has detected a “mismatch” between the hardware switch setting and the software configuration.
  • Page 302 Disposition: The system will remain in STOP mode until DI water is available. GEM Alarm. GEM ALID: 132 ALCD ALTX ON CEID OFF CEID 132 Failure detected at DI Water Flow Sensor. ID: 133 LARM Description: Brush Station Exhaust Failure Posting Program: Monitor Alarm Type: Alarm &...
  • Page 303 C h a p t e r 1 0 A L A R M S Reason: The Brush2 program has detected the absence of chemical flow after requesting a chemical. The delay time for the alarm is 10 seconds. Disposition: The system is put into CLEARING mode and the current wafer is processed but may not be processed with chemicals in the Brush Station.
  • Page 304 ID: 138 LARM Description: Failure Detected: CDA Pressure Sensor (Programmable) Posting Program: Monitor Alarm Type: Alarm & Sonalert Reason: The monitor has detected a CDA (clean dry air) pressure failure in the system. Disposition: The system is put into Stop mode and must be repaired immediately because wafers cannot be processed through the system without air.
  • Page 305 C h a p t e r 1 0 A L A R M S ID: 141 LARM Description: Remove Input Cassette - Press Start Posting Program: Input Alarm Type: Alarm & Sonalert Reason: This alarm is only valid on systems shipped with the SMIF Input Station option.
  • Page 306 GEM Alarm. GEM ALID: 143 ALCD ALTX ON CEID OFF CEID 143 Input found cassette with Polisher Interface Enabled. ID: 144 LARM Description: Timeout Waiting For Wafer Set Signal Posting Program: Input Alarm Type: Alarm & Sonalert Reason: This alarm is only valid on systems configured with a polisher that uses a parallel interface.
  • Page 307 C h a p t e r 1 0 A L A R M S Reason: This alarm is only valid on systems with the Panel Door Sensors and associated software installed. The alarm is posted if the system detects that one of the system Panel Door has been opened.
  • Page 308 Reason: This alarm is only valid on systems with the System Exhaust Sensor and associated software installed. The Cabinet (System) Exhaust Sensor detects when no exhaust is present. Disposition: The system is put into CLEARING mode. GEM Alarm. GEM ALID: 149 ALCD ALTX ON CEID OFF CEID...
  • Page 309 C h a p t e r 1 0 A L A R M S Posting Program: Output Alarm Type: Alarm & Sonalert Reason: This alarm indicates that a wafer is not expected at the Output Station. It can occur if the slot number that the wafer is destined to go to, is out of range.
  • Page 310 Disposition: Alarm can be configured by the user to set the system into CLEARING (default), STOP or DISABLED mode. GEM Alarm. GEM ALID: 154 ALCD ALTX ON CEID OFF CEID 154 Low Chem Flow in Line 2. ID: 155 LARM Description: DIW Booster Pump Failure Posting Program: Monitor Alarm Type: Alarm &...
  • Page 311 C h a p t e r 1 0 A L A R M S Disposition: The system will go into CLEARING mode and the alarm will be posted, however, the heat lamp may stay on depending on the cause of the problem. GEM Alarm.
  • Page 312 Alarm Type: Alarm & Sonalert Reason: This alarm indicates that a process recipe has not been selected. This can occur when software is installed or upgraded. Select a process recipe to continue. Disposition: Alarm can be configured by the user to set the system into CLEARING and/or STOP mode.
  • Page 313 C h a p t e r 1 0 A L A R M S GEM MESSAGES The SEMI Generic Equipment Model (GEM) standard defines useful conventions for designing the communication interface on a unit of factory equipment (i.e., Integra) to improve operations with a host (CMP) computer connected via the SECS GEM interface.
  • Page 314 10-76 INTEGRA Operations Revision A 7/26/00 20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
  • Page 315 C h a p t e r 1 0 A L A R M S GEM I NTEGRA UTPUT TATION NTERFACE EQUENCE Use the following chart to identify the CEID and RCMD commands sent between the Integra cleaner, the CMP Host and Output Robot (FABS).
  • Page 316 GEM A LARMS RROR ESSAGES GEM alarms display in the box on the Integra CURRENT ALARM cleaner’s screen (next page). GEM alarms can also SYSTEM STATUS be reviewed in the Alarm logs of both the CMP host system and Integra cleaner. CLEARING 31 Spin Station Waiting on Wafer from Brush Station 200MM CURRENT PROCESS NAME...
  • Page 317 The following GEM message are exclusively used for the Integra cleaner. These messages are used in addition to the messages in the OnTrak DSS-200 (Integra) SECS/GEM Interface Manual (20-0200- 055/056). GEM manuals are shipped as part of the standard documentation package with each cleaner using a GEM interface.
  • Page 318 RUNCLEAR 0 = not 1 = clearing WAFERRECOVERY 0 = not 1 = recovering INPUTWAITFORSTART 0 = no intervention 1 = waiting for a start command GEM collection events or CEIDs are relevant to process program Appendix B -- management and identify wafer movement or imply wafer Collection Events movement has taken place.
  • Page 319 C h a p t e r 1 0 A L A R M S The following alarms are only used on the Integra cleaner. These GEM alarms should be added to or replace Spare Alarm signals in Appendix C -- Alarms. ALCD ALTX (Alarm Description) CEID...
  • Page 320 Setup and processing at the DSS -00 Series IIi CMP can be guided Remote Commands by either a local operator or by a host computer (e.g., Integra, Input Robot, Output Robot, etc.) through Remote Commands (messages) available to the host computer. The general format for Remote GEM Commands using the S2F41 message is: S2F41 [W]...
  • Page 321 C h a p t e r 1 0 A L A R M S OPEN INPUT STATION DOOR The Open Input Station Door message (command) opens the Input Station door (exterior), allowing the Input Robot arm with wafer to enter the Input Station. The Input Station (wafer) Door is not the Input Station lid.
  • Page 322 CLOSE INPUT STATION DOOR The Close Input Station Door message (command) closes the exterior Input Station door after the Input Robot arm exits the Input Station. Once the door is closed, wafer processing starts. The Input Station door is not the Input Station lid. S2F41 [W] <L [2] <A...
  • Page 323 C h a p t e r 1 0 A L A R M S WAFER ACCEPTED FROM SPIN STATION message The Wafer Accepted From Spin Station command) is issued by the CMP Host after the following: • Output Robot has removed the wafer from the Spin Station After the Wafer Accepted From Spin Station message is received by the CMP cleaner, the Spin Station is reinitialized (reset) to accepts a new wafer.
  • Page 324 (This page intentionally left blank.) 10-86 INTEGRA Operations Revision A 7/26/00 20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
  • Page 325 Integra system. Information regarding the GEM specific messages and interface requirements are included in this manual. The Integra Input Station GEM Interface Sequence flow diagrams and OnTrak DSS-200, Series IIi, Synergy, and Integra specific error messages are identified in Chapter 10, “ALARMS.” 7/26/00...
  • Page 326 GEM CONFIGURATION CONTROL The following section describes the use of the Integra’s screen. CONFIGURATION ANUAL ONTROL UTTONS STANDARD 37 SPIN STATION WAITING ON WAFER FROM Three buttons provide the technician or engineer with the ability to use GEM to manually establish the link with the factory host system. It requires the input from all three buttons to establish a functional link with the factory host.
  • Page 327 C h a p t e r 1 1 G E M C O N F I G U R AT I O N & M E S S A G E S STANDARD 37 SPIN STATION WAITING ON WAFER FROM ENABLE Button The ENABLE button is a switch that toggles between ENABLE and DISABLED.
  • Page 328 If the communication link is established, the COMMUNICATIONS : box displays “Communicating.” If no link occurs in the set STATUS time limit, the box (circled in the illustration above) displays “Disabled.” The ENABLE status does not automatically place the system online with the host system, it simply establishes that both systems are ON (active) and able to communicate.
  • Page 329 C h a p t e r 1 1 G E M C O N F I G U R AT I O N & M E S S A G E S The current status is displayed in the CONTROL STATUS box at the bottom right of the screen (circled in the GEM CONFIGURATION...
  • Page 330 AUTOMATIC CONNECTION: CONTROL STATE DEFAULT PARAMETERS STANDARD 37 SPIN STATION WAITING ON WAFER FROM Introduction The GEM interface in the Integra system can be set to connect with the factory host system during the cleaner’s boot sequence. The parameters for the connection are established in the CONTROL STATE DEFAULT PARAMETERS section of the Integra’s screen.
  • Page 331 C h a p t e r 1 1 G E M C O N F I G U R AT I O N & M E S S A G E S HEARTBEAT TIMER: The HEARTBEAT TIMER parameter sets the interval between the “message - response”...
  • Page 332 OFFLINE SUBSTATE: The OFFLINE SUBSTATE button is a switch that toggles between Attempt Online, Host Offline and Equipment Offline. The Attempt Online option can be set so that if the Initial Control State link fails, the Integra can continue to attempt completing the link as long as the INITIAL COMM STATE remains Enabled.
  • Page 333 C h a p t e r 1 1 G E M C O N F I G U R AT I O N & M E S S A G E S T1 - T4 TIMEOUTS: The T1 - T4 TIMEOUTS, or delays, are defined in the SECS-I Parameters section of the GEM manual.
  • Page 334 COLLECTION EVENTS (CEIDS) The following collection events are sent by the cleaner and can be received by the GEM system host. Cleaner collection events must be enabled by the host to be functional. The following table is also included in the SECS/GEM Manual (20-0200-055/056) as Appendix B. The following GWGEM collection events exist at the Equipment.
  • Page 335 C h a p t e r 1 1 G E M C O N F I G U R AT I O N & M E S S A G E S InputLoadComplete SMIF Load sequence has completed at the Input Station. InputUnloadComplete SMIF Unload sequence has completed at the Input Station.
  • Page 336 DEPENDENT ON SYSTEM CONFIGURATION 37 SPIN STATION WAITING ON WAFER FROM STANDARD The following troubleshooting procedures only apply to the OnTrak cleaner, not the GEM host. 1 GEM Control Signals - If GEM fails to initialize during system GEM Control...
  • Page 337 C h a p t e r 1 1 G E M C O N F I G U R AT I O N & M E S S A G E S NOTE: Although confusing, the large buttons below the GEM CONFIGURATION screen title will display the opposite of the CONTROL STATE DEFAULT PARAMETERS.
  • Page 338 9 Verify Test Equipment - If step 5, 6, and/or 7 does not establish Verify Test the GEM communication, then individually test the laptop PC, Equipment connecting RS232 modem cable, and RS232 Tester on a “known good” cleaner. 11-14 INTEGRA Operations Revision A 7/26/00 20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
  • Page 339 The Maintenance screen may be accessed through the ENGINEERING ( MAINTENANCE) MENU button in the screen. The ONTRAK SYSTEMS INC. (MAIN MENU) functional screens associated with the screen are MAINTENANCE protected from unauthorized access. The security required to enter...
  • Page 340 To complete the logon process with a password, use the following Logon w/ Password procedure. 1 If logging on with a password, go to the ONTRAK SYSTEMS INC. (MAIN MENU) and touch LOGON. 12-2 INTEGRA Operations Revision A...
  • Page 341 C h a p t e r 1 2 S Y S T E M S E C U R I T Y 2 The SYSTEM MESSAGE DISPLAY appears with a message requesting that the 1-6 character logon ID be entered. Touch CONTINUE (top right of the screen) to bring up the keyboard screen.
  • Page 342 6 Enter the 1-6 character PASSWORD and touch ENTER. 7 If the password is accepted, the screen returns to the function it was performing prior to the request for password verification. If the password is not accepted, the SYSTEM MESSAGE DISPLAY presents the message, “Password Not Accepted.
  • Page 343 C h a p t e r 1 2 S Y S T E M S E C U R I T Y SECURITY SCREEN In order to protect the processing integrity of the Integra system against accidental damage by untrained personnel, the system administrator has a key which grants access to the screen.
  • Page 344 4 From the ENGINEERING MENU screen, touch SECURITY CONFIGURATION. STANDARD 5 From the SECURITY screen touch the button next to an empty USER ID space in the CREATE USER column. 12-6 INTEGRA Operations Revision A 7/26/00 20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
  • Page 345 C h a p t e r 1 2 S Y S T E M S E C U R I T Y 6 The SYSTEM MESSAGE DISPLAY asks if you want to create a new user. Touch YES (upper right corner). 7 The SYSTEM MESSAGE DISPLAY (not shown) requests a 1-6 character ID.
  • Page 346 9 The SYSTEM MESSAGE DISPLAY asks if a password is desired. Touch YES (upper right corner). Touch NO if you do not require a password for a new user. 10 The keyboard (not shown) comes up again. The SYSTEM MESSAGE DISPLAY requests a 1-6 character password. Enter the 1-6 character password and touch ENTER.
  • Page 347 C h a p t e r 1 2 S Y S T E M S E C U R I T Y DELETING A USER FROM THE SYSTEM If it becomes necessary to delete a user from the system, turn ON the Security key, then use the following procedure.
  • Page 348 (This page intentionally left blank.) 12-10 INTEGRA Operations Revision A 7/26/00 20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
  • Page 349 Lam Customer Service representative or the FACSplus CD-ROM. Historical OnTrak OnTrak Technical Support Bulletins (TSBs 001- 108) are archived on (TSBs) the Lam intranet in the “historical” directory. To access them, use the following address: http://lamweb.lamrc.com/tic/index.htm.
  • Page 350 Technical Service Bulletin (TSR) Receipt Log Recd. Received Technical Bulletin Description and/or Comments Date Number 13-2 INTEGRA Operations Revision A 7/26/00 20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)

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