Environmental And Thermal Requirements; Table 2-1 Environmental And Thermal Requirements - SMART PCIE-6002 Installation And Use Manual

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2.3.1

Environmental and Thermal Requirements

Operating temperatures refer to the temperature of the incoming air passing across
the card and out of the faceplate and not the temperature of the components.
Card Damage
High humidity and condensation on the card surface causes short circuits.
Do not operate the card outside the specified environmental limits. Make sure that
the card is completely dry and there is no moisture on its surface before applying
power.
The following table provides the environmental and the thermal requirements for the
PCIE-6002 card.
Table 2-1
Requirement
Cooling Method
Temperature
Forced air flow, air
volume, pressure loss
(reference to sea level)
Temperature Change
Relative Humidity
Vibration (vertical)
Vibration (transverse)
Vibration (longitudinal)
Freefall
Altitude
PCIE-6002 Installation and Use (6806800U70B)
Environmental and Thermal Requirements
Operating
Forced air
+5°C to +40°C (normal operation),
+5°C to +55°C (exceptional operation),
according to NEBS Standard GR-63-
CORE
5CFM @ 20°C host system ambient,
12.5CFM @ 35°C host system ambient,
and 20CFM @ 55°C host system
ambient
±0.5°C/min
5% to 95% non-condensing at +40°C
10 Min 0.01G (sinusoidal) 5 – 200Hz
10 Min. 0.01G (sinusoidal) 5 – 200Hz
10 Min. 0.01G (sinusoidal) 5 – 200Hz
-
Sea level
Hardware Preparation and Installation
NOTICE
Non-Operating
-
-40°C to +70°C
-
±1°C/min
5% to 95% non-condensing at
+40°C
-
-
-
1200mm/all edges and corners
(packed state) 100mm/3 axis
(unpacked)
29

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