Panasonic B01 Operation Manual page 10

(2)FPC board specifications
Control the thicknesses of the coverlay and adhesive to prevent poor
soldering.
This connector has no stand-off.
Therefore, minimize the thickness of the coverlay, etc. so as to prevent the
occurrence of poor soldering.
If poor soldering occurs frequently, check the actual thickness of each insulation
layer. Generally, the coverlay thickness is set to about 30 μm, including the
adhesive. If the thickness exceeds 30 μm, design the board so as to remove the
coverlay under the connector.
Solder
(3)This connector is often used for connecting the motherboard and FPC board. In
this case, if the FPC board is too short, a load that causes deviation will be applied
to the connector.
Make sure to create a design that provides some allowance in the FPC board.
Connector
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
Operation manual for "High Current connectors B01/B02"
Connector
terminal
Part where FPC board
NG: Too short
is fixed
Positional deviation
Molded part of the connector
Coverlay (polyimide)
Adhesive (epoxy adhesive recommended)
Copper foil
Adhesive (epoxy adhesive recommended)
Base material (polyimide)
Reinforcing plate + Adhesive
(epoxy adhesive recommended)
NG: Too long
Motherboard
©
Panasonic Corporation 2017
9
Fixed
ACCTF34E 201710