Bosch Sensortec Application Board 3.0 User Manual page 4

Bosch Sensortec"| Application Board 3.0 User Guide
List of figures
Figure 1 Application Board 3.0 Overview .......................................................................................................................... 7
Figure 2 Application Board 3.0 dimensions ....................................................................................................................... 7
Figure 3 Block Diagram ..................................................................................................................................................... 8
Figure 4 Debugger connector ............................................................................................................................................ 9
Figure 5 Shuttle Board 3.0 dimensions ........................................................................................................................... 11
Figure 6 Application Board 3.0 setup .............................................................................................................................. 15
Figure 7 Aligning the pins of the Shuttle Board 3.0 board ............................................................................................... 15
Figure 8 Connecting the Shuttle Board 3.0 ..................................................................................................................... 16
Figure 9 Connecting the USB cable ................................................................................................................................ 16
Figure 10 Switching ON the Application Board 3.0 ......................................................................................................... 17
Figure 11 Removing the Shuttle Board 3.0 ..................................................................................................................... 17
List of tables
Table 1 Shuttle pin description .......................................................................................................................................... 9
Table 2 Application Board 3.0 pin description ................................................................................................................. 10
Table 3 Shuttle Board 3.0 pin description........................................................................................................................ 12
Abbreviations
ESD : Electrostatic Discharge
FCC : Federal Communications Commission
USB 2.0 : Universal Serial Bus 2.0
LED : Light Emitting Diode
Li-ion : Lithium-Ion
KB : Kilobyte
MB : Megabyte
Gb : Gigabit
BLE : Bluetooth Low Energy
MTP : Media Transfer Protocol
RGB LED : Red Green Blue Light Emitting Diode
Modifications reserved | Data subject to change without notice
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Document number: BST-DHW-AN008-00