MEIG SLM750 Series Product Manual
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MEIG SLM750 Series Product Manual

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MeiG Product Manual of SLM750 Module
MeiG Product
Manual of SLM750
Version Number: V1.1 
Company: MeiG Smart Technology Co., Ltd 
Released Date: 2018/8/13 
Page 1, total 84 pages
SLM750 Module Hardware Design 

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  • Page 1 MeiG Product Manual of SLM750 Module MeiG Product Manual of SLM750 Version Number: V1.1  Company: MeiG Smart Technology Co., Ltd  Released Date: 2018/8/13  Page 1, total 84 pages SLM750 Module Hardware Design ...
  • Page 2 MeiG  Smart.  Those  who  violated  will  be  investigated  by  corresponding  legal  liability  in  accordance with the law.    NO GUARANTEE  MeiG  Smart  makes  no  representation  or  warranty,  either  express  or  implied,  for  any  content  in  this  document, and will not be liable for any specific merchantability and applicable or any indirect,particular  and collateral damage.  CONFIDENTIALITY ...
  • Page 3 MeiG Product Manual of SLM750 Module Revising History Table 1: Revising records REVISION  DATE  DESCRIPTION  V1.0  2018‐04‐01  Initial  Modify power consumption, RF, packaging 2018‐12‐14    V1.1  Page 3, total 84 pages SLM750 Module Hardware Design ...

  • Page 4: Table Of Contents

    MeiG Product Manual of SLM750 Module Contents 1 Introduction ................................8  1.1 Safety Information ............................9  1.1 Safety Information ............................9  1.2 Purpose ..............................10  1.3 Content list ..............................10  2 Product Overview ..............................11  2.1 Basic Description ............................11  2.2 Main performance ............................11  2.3 Functional diagram ............................ 14 ...
  • Page 5 MeiG Product Manual of SLM750 Module 3.13 Network Status Indication ........................48  3.14 Status ............................... 49  3.15 ADC Function ............................50  3.16 SGMII Interface ............................50  3.17 Wireless Connectivity Interfaces ......................52  3.17.1 WLAN Interface ........................... 54  3.17.2 BT Interface ..........................55  3.18 SD Card Interface ............................ 55 ...
  • Page 6 MeiG Product Manual of SLM750 Module Table 1: R ABLE EVISING RECORDS  ............................ 3  2: S SLM750V ...................... 11  ABLE UPPORTED BAND OF 3: L  .................... 12  ABLE IST OF MAIN FEATURES OF THE MODULE 4: IO P   ........................ 17  ABLE ARAMETERS EFINITION 5: P  ............................ 18  ABLE IN DESCRIPTION 6: O  ...................... 28 ...
  • Page 7 MeiG Product Manual of SLM750 Module Figure IGURE UNCTIONAL IAGRAM   .......................... 15  IGURE SSIGNMENT   ............................ 17   ............ 31  IGURE LEEP MODE APPLICATION WITH REMOTE WAKING UP FUNCTION  ................. 34  IGURE OWER REQUIREMENTS FOR BURST TRANSMISSION  ...................... 34  IGURE TAR STRUCTURE OF POWER SUPPLY 6 DC   ........................ 35 ...

  • Page 8: Introduction

    MeiG Product Manual of SLM750 Module 1 Introduction This document defines SLM750 modules and describes its air interface and hardware interface which are connected with your application. The document can help you quickly understand SLM750 interface specifications, electrical and mechanical details and other related product information. Associated with application notes and user guide, you can apply SLM750 in wireless applications easily.

  • Page 9: Safety Information

    MeiG Product Manual of SLM750 Module 1.1 Safety Information Observing the following safety information can keep you safe and protect the product and its working environment from potential damage. Full attention must be given to driving at all times in order to reduce the risk of an accident.

  • Page 10: Purpose

    MeiG Product Manual of SLM750 Module 1.2 Purpose This document describes basic functions and main features of SLM750 wireless module, as well as hardware interface and its application, features of structure and electronics, and power index, in order to guide you to embed SLM750 in various application terminals.

  • Page 11: Product Overview

    MeiG Product Manual of SLM750 Module 2 Product Overview 2.1 Basic Description SLM750 is a wireless communication module of TD-LTE/FDD LTE/TD-SCDMA/WCDMA/ EVDO/CDMA/GSM with diversity receiving function. It supports TD-LTE and FDD LTE, and downwards compatible with DC-HSPA+ of WCDMA, TD-HSPA of TD-SCDMA, network data connection of EVDO RevB, which provides functions of voice, analog voice, SMS, and communication for your applications.
  • Page 12 MeiG Product Manual of SLM750 Module Table 3: List of main features of the module Parameter Description Power supply  VBAT supply voltage range: 3.3V～4.2V  Typical supply voltage: 3.8V Transmit power  Class 4 (33dBm±2dB) for GSM850  Class 4 (33dBm±2dB) for GSM900  Class 1 (30dBm±2dB) for DCS1800 ...
  • Page 13  Baud rate is 115200bps  Support LTE/WCDMA/CDMA RX-diversity RX-diversity AT command  Confirm to 3GPP TS 27.007, 27.005 and added new MeiG AT commands Network indication  The two pins NET_STATUS,NET_MODE indicate the network status Page 13, total 84 pages...

  • Page 14: Functional Diagram

    MeiG Product Manual of SLM750 Module Antenna interface  Include main antenna(ANT_MAIN),RX-D diversity antenna(ANT_DIV) and GNSS antenna(ANT_GNSS) Physical features  Size: 32.0×29.0×2.4mm  Weight: <5 g Temperature range  Normal operating temperature: -30℃～+75℃  Limited operating temperature: -40℃～+85℃  Storage temperature: -45℃～+90℃ Software upgrade  USB interface RoHS ...

  • Page 15: Evaluation Board

    Figure 1 Functional Diagram 2.4 Evaluation Board In order to help you develop applications with SLM750, MeiG supplies an evaluation board, Which contains USB data cable, antenna and other peripherals to control or test the module. See MeiG_U_EVB User Guide for specific usage of evaluation board.

  • Page 16: Application Interface

    MeiG Product Manual of SLM750 Module 3 Application Interface 3.1 General Description SLM750 uses LCC+LGA interface with a total of 144 PIN among which there are 80 LCC pins and 64 LGA pins, providing the following function interface:  Power interface  USIM/SIM interface  USB interface ...

  • Page 17: Lcc Card Interface Definition

    MeiG Product Manual of SLM750 Module 3.2 LCC Card Interface Definition Reserved ANT_DIV VBAT_RF VDD_SDIO VBAT_RF SD_CMD VBAT_BB SD_CLK VBAT_BB SD_DATA0 SD_DATA1 STATUS SD_DATA2 SD_DATA3 PCM_CLK PCM_SYNC PCM_OUT PCM_IN SD_INS_DET USB_DP USB_DM PWRKEY USB_VBUS RESET_N Reserved USB_BOOT Reserved Reserved Reserved POWER WLAN&BT SGMII Signals Figure 2 Pin Assignment 3.3 Pin Description...
  • Page 18 MeiG Product Manual of SLM750 Module Input output Digital input Digital output Power input Power output Analog input Analog output Open drain Table 5: Pin description Power Supply Pin name Description DC features Note number VBAT_BB 59,60 Power supply for Vmax=4.2V It must be able to module baseband Vmin=3.3V...
  • Page 19 MeiG Product Manual of SLM750 Module STATUS Indicate the Driving current Require external module operating should be less pull-up. If unused, status than 0.9mA keep it open NET_MODE Indicate the VOHmin=1.35V 1.8V power module network VOLmax=0.45V domain, require registration status external pull-up. If unused, keep it...
  • Page 20 MeiG Product Manual of SLM750 Module min=2.55V USIM_RST USIM card reset 1.8V USIM: line max=0.45V min=1.35V 3.0V USIM: max=0.45V min=2.55V USIM_PRESE USIM card min=-0.3V 1.8Vpower detection max=0.6V domain, require min=1.2V external pull-up to max=2.0V 1.8V USIM_VDD USIM card 1.8V USIM: Either 1.8V or supply voltage Vmax=1.9V...
  • Page 21 MeiG Product Manual of SLM750 Module VOHmin=1.35V domain. If unused, keep it open. DTE requires to VILmin=-0.3V 1.8V power transmit data VILmax=0.6V domain. VIHmin=1.2V If unused, keep VIHmax=2.0V it open. Debug serial port Pin name Description DC features Note number DBG_TXD Transmit data max=0.45V 1.8V power min=1.35V...
  • Page 22 MeiG Product Manual of SLM750 Module min=1.2V If unused, keep max=2.0V it open. PCM_OUT PCM data output max=0.45V 1.8V power min=1.35V domain. If unused, keep it open. PCM_CLK PCM clock max=0.45V 1.8V power min=1.35V domain. In master min=-0.3V mode, it is an max=0.6V output signal. In min=1.2V...
  • Page 23 MeiG Product Manual of SLM750 Module impedance ANT_GNSS GNSS antenna 50 ohm If unused, keep it impedance open. GPIO Pin Pin name Description DC features Note number WAKEUP_IN Sleep mode input min=-0.3V 1.8V power control max=0.6V domain. min=1.2V High level wakes max=2.0V up the module; in...
  • Page 24 MeiG Product Manual of SLM750 Module VIHmin=1.2V If unused, keep it VIHmax=2.0V open. Bluetooth serial VOLmax =0.45V 1.8V power BT_CTS* sending clearance VOHmin =1.35V domain. If unused, keep it open. Bluetooth enables VOLmax =0.45V 1.8V power BT_EN* VOHmin =1.35V domain. If unused, keep it open.
  • Page 25 MeiG Product Manual of SLM750 Module instruction signal VOHmin=1.35V domain. If unused, keep it open. WAKE_ON_ WLAN wakes the V ILmin=-0.3V 1.8V power WIRELESS module VILmax=0.6V domain. Active VIHmin=1.2V low level. VIHmax =2.0V If unused, keep it open. WLAN_EN WLAN enables VOLmax=0.45 1.8V power VOHmin=1.35V domain.
  • Page 26 MeiG Product Manual of SLM750 Module unused, keep it VOHmin =1.4V open. 3.0V SD card: VOLmax=0.38V VOHmin=2.01V Refer to SD3.0 SD_DATA3 SD card SDIO 1.8V SD card: protocol. If signal data line 3 VOLmax=0.45 unused, keep it VOHmin=1.4V open. V ILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax =2.0V 3.0V SD card:...
  • Page 27 MeiG Product Manual of SLM750 Module VIHmax=3.34V Refer to SD3.0 SD_DATA0 SD card SDIO 1.8V SD card: protocol. If signal data line 0 VOLmax=0.45 unused, keep it VOHmin=1.4V open. V ILmin=-0.3V VILmax=0.58V VIHmin=1.27V VIHmax =2.0V 3.0V SD card: VOLmax=0.38V VOHmin=2.01V V ILmin=-0.3V VILmax=0.76V VIHmin=1.72V VIHmax=3.34V...

  • Page 28: Operating Mode

    MeiG Product Manual of SLM750 Module power supply domain, require external pull-up level for SGMII SDIO Pin SGMII_TX_ SGMII data If unused, keep it transmit negative open. signals SGMII_TX_P SGMII data If unused, keep it transmit positive open. signals SGMII_RX_P SGMII data If unused, keep it receive positive open.
  • Page 29 MeiG Product Manual of SLM750 Module consumption is decided by net setting and related settings of EDGE. (For example, multi slot Class level settings) EDGE DATA In EDGE data sending and receiving, the power consumption is decided by net setting (eg. Power control level), data uplink and downlink rat and related settings of EDGE.

  • Page 30: Power Saving

    MeiG Product Manual of SLM750 Module DATA consumption is decided by net settings(eg. Power control level), data uplink and downlink rate and related settings of TD-HSPA. TD-LTE Mode TD-LTE IDLE The module is ready for TD-LTE data transfer. No data sending or receiving at this time. The power consumption is decided by net setting.

  • Page 31: Usb Application (Without Usb Suspend Function)

    MeiG Product Manual of SLM750 Module preconditions can let the module enter into sleep mode.  Execute AT+SLEEPEN=1 command to enable sleep mode.  Keep WAKEUP_IN to high level.  Host USB interface connecting to the module enters into suspend state.  Sending data to SLM750 from USB will wake up the module.

  • Page 32: Flight Mode

    MeiG Product Manual of SLM750 Module or at + sleepen=0 to enable or disable sleep function of the module. When the module sleep function is disabled, the module sleep related pin will be invalid, USB PHY will not enter the low power (LPM) when the USB bus is suspended.

  • Page 33: Decrease Voltage Drop

    MeiG Product Manual of SLM750 Module  Two VBAT_RF pins are used to supply RF power.  Two VBAT_BB pins are used to supply Baseband power. Below table shows the assignment of power and ground pins: Table 7: Related power supply interfaces Pin name Pin No.

  • Page 34: Reference Design For Power Supply

    MeiG Product Manual of SLM750 Module Figure 4 Power requirements for burst transmission In order to reduce voltage drop, a low ESR 100uF filter capacitor is needed. The multilayer ceramic capacitor (MLCC) has the best ESR, suggestion to add three ceramic capacitors (100nF, 33pF, 10pF) to VBAT_BB and VBAT_RF pins, and the capacitors should be placed close to the VBAT pin.

  • Page 35: Vdd_Ext Voltage Output

    MeiG Product Manual of SLM750 Module Figure 6 DC power supply circuit 3.6.4 VDD_EXT voltage output If SLM750 module turns on normally, there is a voltage output of 1.8V, current load 80mA in PIN7. You can use the output voltage as external power supply, for example level reference, and judge if the module is turned on by reading pin level status.
  • Page 36 MeiG Product Manual of SLM750 Module Figure 7 Turn on the module using driving circuit The other way to control the PWRKEY is using a button directly. A TVS component is indispensable to be placed nearby the button for ESD protection. A reference circuit is shown in the...

  • Page 37: Turn Off Module Using The Pwrkey Pin

    MeiG Product Manual of SLM750 Module Figure 9 Timing of turning on module Note: 1. Tnote > 30ms. 2. If the external pull up design of PWRKEY pin is added, it is recommended that the pull-up level range is 1.3V~2.1V 3.7.2 Turn off module using the PWRKEY pin Modules can be shut down in the following ways: ...

  • Page 38: At Command Shutdown

    MeiG Product Manual of SLM750 Module then the module will perform the shutdown process. The shutdown sequence is shown in the following figure: Figure 10 Timing of turning off module 3.7.2.2 AT command shutdown The AT + Poweroff command can be used to control the shutdown of module. This shutdown process is equivalent to a pulled-down PWRKEY pin shutdown process.

  • Page 39: Hardware Reset

    MeiG Product Manual of SLM750 Module 3.8.1 Hardware reset When the module is in operation, puling down 150~460ms of the RESET_N pin to reset module. The RESET_N signal is sensitive to interference. Table 8: RESET_N pin description Pin name Pin number Function DC features Description...

  • Page 40: At Command Reset

    MeiG Product Manual of SLM750 Module Figure 13Reset timing of RESET_N 3.8.2 AT command reset Enter AT+RESET command in SLM750VUART or USB AT interface to reset and restart SLM750. 3.9 USIM/SIM Card Interface USIM card interface meets ETSI and IMT-2000 SIM interface requirements. Both 1.8V and 3.0V USIM cards are supported by SLM750...
  • Page 41 MeiG Product Manual of SLM750 Module SLM750 supports USIM card hot plugging and hot plugging function is turned off by default. The following figure shows USIM_PRESENCE pin high level, no card, USIM_PRESENCE pin ground after inserting card on SIM card connector. SLM750 supports USIM hot plugging function through the USIM_PRESENCE pin, support high-level detection, and the default hot-plugging function is turned off by default.

  • Page 42: Usb Interface

    MeiG Product Manual of SLM750 Module In order to enhance the reliability and availability of the USIM card in your application, please follow the criteria below in the USIM circuit design:  USIM_DATA requires a pull-up resistor of 15kΩ to USIM_VCC; the pull-up resistor helps to increase SIM card's anti-interference ability.

  • Page 43: Usb Pin Description

    MeiG Product Manual of SLM750 Module 3.10.1 USB pin description SLM750 module provides a USB2.0 High-Speed interface. Table 10: USB interface description Name Pin name Description Note USB_DM differential data Require 90Ω signal- differential impedance USB_DP differential data Require 90Ω signal+ differential impedance Ground USB_VBUS...

  • Page 44: Usb Driver

    MeiG Product Manual of SLM750 Module  The module USB_VBUS is not used to power the module, but is used to detect the insertion and pull-out of the USB.  In order to reduce the signal interference of USB high speed data transmission, connect R1 and R2 between USB_DM and USB_DP interface circuit to improve the data transmission rate.
  • Page 45 MeiG Product Manual of SLM750 Module  Debug UART interface supports 115200bps baud rate. It can be used for Linux console, log print. Table 11: Main UART pin description Pin name Pin number Description Note Receive data 1.8V power domain Transmit data 1.8V power domain Clear to send 1.8V...

  • Page 46: Pcm And I2C Interface

    MeiG Product Manual of SLM750 Module Parameter Unit -0.3 0.45 1.35 SLM750 provides 1.8V serial port. If your application serial port is 3.3V, you need to add level converter. It is recommended that you use TXB0104PWR from TI Company. Reference design is shown as follows: Figure 17 Reference circuit of level conversion chip 3.12 PCM and I2C Interface...
  • Page 47 MeiG Product Manual of SLM750 Module on the rising edge; the PCM_SYNC rising edge represents the more significant bit. The mode only supports 128 kHz PCM_CLK and 8kHz, 50% duty cycle PCM_SYNC. SLM750 supports 8-bit A-law, u-law and 16-bit linear encoding formats. The following figures...

  • Page 48: Network Status Indication

    MeiG Product Manual of SLM750 Module Table 14: Pin description for PCM interface Pin name Description Note number PCM_CLK PCM clock 1.8V power supply domain PCM_OUT PCM data output 1.8V power supply domain PCM_IN PCM data input 1.8V power supply domain PCM_SYNC data 1.8V power...

  • Page 49: Status

    MeiG Product Manual of SLM750 Module 1.8V power NET_STATUS Indicate the module network supply domain activity status. 1.8V power NET_MODE Indicate the module network supply domain registration mode. Table 16: Working State of the Network Indicator Mode Status Description Register LTE network status NET_MODE High level...

  • Page 50: Adc Function

    MeiG Product Manual of SLM750 Module Figure 21 Reference circuit of STATUS 3.15 ADC Function SLM750 provides two analogy- to-digital converters. Using AT+ADCREAD=1 to read the voltage value of ADC0. Using AT+ADCREAD=6 read the voltage value of ADC1. Table 18: ADC pin description Pin name Pin no.
  • Page 51 MeiG Product Manual of SLM750 Module EPHY_INT_N Ethernet PHY 1.8V /2.85V power domain. interruption SGMII_MDATA SGMII MDIO 1.8V/2.85V power domain. data SGMII_MCLK SGMII MDIO clock USIM2_VDD SGMII MDIO 1.8V/2.85V power domain, power supply require external pull-up level for SGMII SDIO Pin SGMII_TX_M SGMII data Connect with a 0.1uF capacitor, transmit close to the PHY side.

  • Page 52: Wireless Connectivity Interfaces

    MeiG Product Manual of SLM750 Module Figure 23 Reference Circuit of SGMII Interface with PHY AR8033 Application In order to enhance the reliability and availability in your application, please follow the criteria below in the Ethernet PHY circuit design:  Keep SGMII data and control signals away from RF and VBAT trace.
  • Page 53 MeiG Product Manual of SLM750 Module WLAN part Pin name Pin number I/O Description Note SDC1_DATA3 WLAN SDIO signal 1.8V power domain. data line 3 SDC1_DATA2 WLAN SDIO signal 1.8V power domain. data line 2 SDC1_DATA1 WLAN SDIO signal 1.8V power domain. data line 1...

  • Page 54: Wlan Interface

    MeiG Product Manual of SLM750 Module signal. The following figure shows a reference design of Wireless Connectivity interfaces with SLM158 module. Module SLM158Module DCDC/LDO VDD_3V3 PM_EMBLE POWER VDD_EXT SDC1_DATA3 SDC1_DATA3 SDC1_DATA2 SDC1_DATA2 SDC1_DATA1 SDC1_DATA1 WLAN SDC1_DATA0 SDC1_DATA0 SDC1_CLK SDC1_CLK SDC1_CMD SDC1_CMD WLAN_EN WLAN_EN WLAN_SLP_CLK WLAN_SLP_CLK...

  • Page 55: Bt Interface

    MeiG Product Manual of SLM750 Module signal trace is 50 ohm (±10%).  Protect other sensitive signals/circuits (RF, analog signals, etc.) from SDIO corruption and protect SDIO signals from noisy signals (clocks, DCDCs, etc.).  It is recommended to keep matching length between CLK and DATA/CMD less than 1mm and total routing length less than 50mm.
  • Page 56 MeiG Product Manual of SLM750 Module SD_DATA1 SD card SDIO SDIO signal level can be selected signal data line according to the signal level supported by SD card. Please refer to SD3.0 protocol for details. suspend it when no used SD_DATA0 SD card SDIO SDIO signal level can be selected...

  • Page 57: Usb_Boot Interface

    MeiG Product Manual of SLM750 Module between the module and the SD card. The bypass capacitors C1~C6 are reserved with no mounting by default. All resistors and bypass capacitors should be placed close to the module.  In order to offer good ESD protection, it is recommended to add TVS on SD card pins.

  • Page 58: Gnss

    MeiG Product Manual of SLM750 Module The following figure shows reference Circuit of USB_ROOT Interface: Figure 26 Circuit of USB_ROOT Interface 4 GNSS 4.1 General Description SLM750 includes an integrated embedded GNSS solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou). SLM750 supports standard NMEA-01830183 protocol, and outputs NMEA sentences with 1Hz via USB interface by default.

  • Page 59: Layout Guideline

    MeiG Product Manual of SLM750 Module (open) Altitude <4m (50%); <8m (90%) Speed accuracy Speed <0.2m/s First positioning time Cold start TTFF Warm start Hot start Sensitivity Capturing -154dBm Tracking -156dBm Serial output baud rate 300bit/s~230400bit/s GPS receiving 12 channel,GPS L1(1575.42MHz),C/A code Data update rate...

  • Page 60: Rf Reference Circuit

    MeiG Product Manual of SLM750 Module diversity antenna to improve WCDMA/TDD-LTE/FDD-LTE receiving performance of the product. It is recommended that you use a 50Ω impedance antenna that matches the RF connector of the module. Special note: In order to ensure the communication ability of all frequency bands, connect both the main and the auxiliary antennas.
  • Page 61 MeiG Product Manual of SLM750 Module Figure 27 RF reference circuit GNSS antenna reference design is shown as below: Figure 28 GNSS antenna reference circuit Page 61, total 84 pages SLM750 Module Hardware Design ...

  • Page 62: Antenna Installation

    MeiG Product Manual of SLM750 Module Note: 1. You can choose external LDO power supply according to active antenna. 2. You can choose passive antenna design so you do not need to design VDD circuit. 5.3 Antenna Installation 5.3.1 Antenna requirements The main antenna, diversity antenna and GNSS antenna requirements are as follows:...

  • Page 63: Rf Receiving Sensitivity

    MeiG Product Manual of SLM750 Module Table 26: RF output power Network mode Band 900(GMSK) 33dBm ± 2dB 5dBm ± 5dB 1800(GMSK) 30dBm ± 2dB 0dBm ± 5dB 900(8-PSK) 27dBm ± 3dB 5dBm ± 5dB 1800(8-PSK) 26dBm +3/-4dB 0dBm ± 5dB CDMA 23-30dBm ≤-50 dBm/1.23MHz...

  • Page 64: Operating Frequency

    MeiG Product Manual of SLM750 Module 5.3.4 Operating frequency Table 28: Operating frequency Network mode Band Receive Transmit 869~894MHz 824~849MHz 925~960MHz 880~915MHz 1800(DCS) 1805~1880MHz 1710~1785MHz 1900(PCS) 1930~1990MHz 1850~1910MHz WCDMA Band1 2110~2170MHz 1920~1980MHz Band8 926~960MHz 880~915MHz TD-SCDMA Band34 2010~2025MHZ 2010~2025MHZ Band39 1880~1920MHz 1880~1920MHz TD-LTE Band38 2570~2620MHz...

  • Page 65: Electrical Characteristics

    MeiG Product Manual of SLM750 Module Band39 <-94 Band40 <-94 Band41 <-94 FDD LTE Band1 <-92 Band3 <-93 Band5 <-92 Band8 <-92 Band28 <-92 Table 30: Diversity antenna requirements Mode Band VSWR Gain /Avg. Efficiency ρ Isolation WCDMA Band1 <2.5: 1 >-7dBi >20% <0.5 <-8dB...

  • Page 66: Temperature Range

    MeiG Product Manual of SLM750 Module VBAT_RF maximum current Instantaneous voltage drop (GSM 900 Maximum transmission power level) USB_VBUS USB detection 5.25 GPIO Level power supply voltage of -0.3 digital IO Power supply voltage of shutdown -0.25 0.25 mode 6.2 Temperature range It is recommended that you use SLM750 at -30℃~+75℃ and take temperature control measures when applications are in the harsh environment conditions.

  • Page 67: Module Power Consumption Range

    MeiG Product Manual of SLM750 Module Table 34: Electrical characteristics in power supply status Parameter Type Unit VBAT USIM_VDD 1.7/2.75 1.8/2.85 1.9/2.95 6.4 Module Power Consumption Range The following table shows the consumption of SLM750 in various modes. Contact us if you need more information about the band.
  • Page 68 MeiG Product Manual of SLM750 Module LTE-TDD Band PF=128(USB disconnected) LTE-TDD Band 2.15 PF=128(USB disconnected) 2.26 LTE-TDD Band PF=128(USB disconnected) LTE-TDD Band PF=128(USB disconnected) LTE-TDD Band PF=256(USB disconnected) 2.12 LTE-TDD Band PF=256(USB disconnected) 2.34 LTE-TDD Band PF=256(USB disconnected) LTE-TDD Band PF=256(USB disconnected) LTE-FDD Band 2.02...
  • Page 69 MeiG Product Manual of SLM750 Module GSM 850 DRX=5 (USB 19.8 disconnected) 38.6 GSM 850 DRX=5 (USB connected) WCDMA Band 19.2 PF=64(USB disconnected) 39.2 WCDMA Band PF=64(USB connected) WCDMA Band 5 20.2 64(USB disconnected) 39.6 WCDMA Band 5 64(USB connected) WCDMA Band 8 18.6 64(USB disconnected) 38.7...
  • Page 70 MeiG Product Manual of SLM750 Module LTE-FDD Band PF=64(USB disconnected) 48.5 LTE-FDD Band PF=64(USB connected) LTE-FDD Band 27.6 PF=64(USB disconnected) 49.2 LTE-FDD Band PF=64(USB connected) LTE-FDD Band 24.9 PF=64(USB disconnected) 48.6 LTE-FDD Band PF=64(USB connected) LTE-FDD Band 22.7 PF=64(USB disconnected) 49.8 LTE-FDD Band PF=64(USB connected)
  • Page 71 MeiG Product Manual of SLM750 Module 3DL/2UL@28.8dBm DCS1800 295.5 2DL/3UL@24.63dBm 1800 363.2 1DL/4UL@23.6dBm 186.3 4DL/1UL@25.7dBm 282.3 3DL/2UL@25.3dBm 381.1 2DL/3UL@25.3dBm 482.7 1DL/4UL@25.3dBm WCDMA data WCDMA Band 434.7 transfer HSDPA@23.274dBm WCDMA Band HSUPA@23.273dBm WCDMA Band 529.6 HSDPA@23.197dBm WCDMA Band 512.9 HSUPA@23.197dBm WCDMA Band 508.2 HSDPA@23.374dBm WCDMA Band HSUPA@23.374dBm...

  • Page 72: Environmental Reliability Requirements

    MeiG Product Manual of SLM750 Module GSM voice call GSM900 PCL=5 @32.21dBm 237.1 DCS1800 PCL=0 @28.14dBm 200.7 GSM850 PCL=5 @32.12dBm 243.9 CDMA voice BC0 @20.31dBm call WCDMA voice WCDMA Band 1@23.1dBm 461.8 call WCDMA Band 5@22.0dBm 574.3 WCDMA Band 8@22.8dBm 6.5 Environmental Reliability Requirements Table 36: Environmental reliability requirements...

  • Page 73: Esd Characteristics

    MeiG Product Manual of SLM750 Module 1) Contact discharge shall pass ±4KV test grade 2) Air discharge shall pass ±8KV test grade 3、the module tests other interfaces, ESD meets: 1) Air discharge shall pass ±0.5KV test grade 2) Air discharge shall pass ±1KV test grade 6.6 ESD Characteristics...

  • Page 74: Mechanical Dimensions

    MeiG Product Manual of SLM750 Module 7 Mechanical Dimensions 7.1 Mechanical Dimensions of the Module Figure 29 Module top and side dimension (unit: mm) Page 74, total 84 pages SLM750 Module Hardware Design ...
  • Page 75 MeiG Product Manual of SLM750 Module Figure 30 Module bottom dimensions (unit: mm) Page 75, total 84 pages SLM750 Module Hardware Design ...

  • Page 76: Recommended Packaging

    MeiG Product Manual of SLM750 Module 7.2 Recommended Packaging Figure 31 Top view of recommended packaging (unit: mm) Page 76, total 84 pages SLM750 Module Hardware Design ...

  • Page 77: Top View Of The Module

    MeiG Product Manual of SLM750 Module 7.3 Top View of the Module Figure 32 Top view of the module 7.4 Bottom View of the Module Figure 33 Bottom view of the module Page 77, total 84 pages SLM750 Module Hardware Design ...

  • Page 78: Storage And Manufacturing

    MeiG Product Manual of SLM750 Module 8 Storage and Manufacturing 8.1 Storage SLM750 is stored in sealed vacuum bag. The restrictions of storage condition are shown as below: 1. Shelf life in sealed bag is 12 months at <40℃/90%RH. 2. After this bag is open, devices that will be subjected to reflow soldering or other high temperature processes must be: ...

  • Page 79: Manufacturing And Welding

    MeiG Product Manual of SLM750 Module 8.2 Manufacturing and Welding Figure 34 Reflow soldering temperature profile 8.3 Packing SLM750 uses pallet packaging. Specifications are as follows: Page 79, total 84 pages SLM750 Module Hardware Design ...
  • Page 80 MeiG Product Manual of SLM750 Module Figure 35 Pallet packaging(Unit: mm) Page 80, total 84 pages SLM750 Module Hardware Design ...

  • Page 81: Appendix A References

    MeiG Product Manual of SLM750 Module 9 Appendix A References 9.1 Related Documents  SLM750 specifications;  SLM750 AT command set;  SLM750 EVB user manual;  SLM750 reference design circuit;  SLM750 application service process manual. 9.2 Terms and Abbreviations Table 38: Terms and abbreviations...
  • Page 82 MeiG Product Manual of SLM750 Module International Electro-technical Commission IMEI International Mobile Equipment Identity MEID Mobile Equipment Identifier Input/Output International Standards Organization International Telecommunications Union bits per second Light Emitting Diode Machine to machine Mobile Originated Mobile Terminated Negative Temperature Coefficient Personal Computer Printed Circuit Board...

  • Page 83: Appendix B Gprs Coding Scheme

    MeiG Product Manual of SLM750 Module 10 Appendix B GPRS Coding Scheme Table 39: Description of coding schemes Mode CS-1 CS-2 CS-3 CS-4 Coding speed Pre-coded USF Radio Block excl.USF and BCS Tail Coded Bits Punctured Bits Data rate Kb/s 9.05 13.4 15.6 21.4 FCC Statement FCC Label: The FCC ID is on the front of the device.
  • Page 84 EU DECLARATION OF CONFORMITY Hereby, MeiG Smart Technology Co., Ltd declares that the radio equipment type SLM750 is in compliance with Directive 2014/53/EU. The most recent and valid version of the DoC (Declaration of Conformity) can be viewed at www.meigsmart.com/en/product-certification.

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