Related Manuals for Zhone Copper-Based Ethernet
Summary of Contents for Zhone Copper-Based Ethernet
- Page 1 E F M P R O D U C T G U I D E Copper-Based Ethernet in the First Mile Zhone Technologies Zhone Technologies...
- Page 2 Ethernet Everywhere Need high-bandwidth Ethernet service over existing copper? Zhone’s EFM Solutions make it easy and cost-effective. Ethernet loop bonding delivers high-bandwidth services without the cost of fiber construction. Business service delivery to US commercial buildings with 20+ employees Fiber-connected 13.4% Copper-connected 86.6%...
- Page 3 Bonding copper circuits for increased Ethernet bandwidth The key innovation in EFM is the loop bonding of multiple copper circuits to provide increased bandwidth. By intelligently distributing traffic across multiple circuits, using very high-efficiency hardware processing, these multiple circuits appear to the network as a single, high-bandwidth link, overcoming the limitations of individual copper circuits.
- Page 4 • • • Ethernet Access Devices (EADs) Product Category 4 or 8 SHDSL.bis 5.7 Mbps WAN ports and 4 Ethernet LAN ports EtherXtend EtherXtend is a high capacity EAD capable of bonding up to 8 SHDSL.bis copper lines for up to 45.6 Mbps of bandwidth. EtherXtend supports both 802.3ah EFM interface and OAM standards, as well as existing HDLC-based Ethernet over copper bonding.
-
Page 5: Product Category
Product Category Ethernet Access Device Selection Guide EtherX tend Family EtherXtend EtherXtend LT SHDSL.bis Interface 5.7 Mbps 4 or 8 WAN Ports Up to Bandwidth 45 Mbps (at max ports) 802.3ah EFM / Loop Bonding HDLC LAN Interfaces 10 / 100 Base T 802.3ah Unmanaged inband... - Page 6 • • • EFM Aggregation Versatile multi-service access and aggregation over copper and fiber MALC-EFM 319, 719, 723 The MALC is a full featured Layer 2 and 3 multi-service access platform. Using a common chassis, uplink and commons, MALC-EFM serves as an Ethernet aggregation access platform supporting SHDSL.bis (5.7 Mbps) or T1 / E1 bonding from 24-port line cards.
- Page 7 Aggregation Platforms MALC-EFM MALC-EFM- MALC-EFM- Line Card SHDSL-24* T1 / E1-24 SHDSL.bis Access Interface 5.7 Mbps Loop Bonding 802.3ah, HDLC Ports per Card 319: 7 / 168 319: 7 / 168 Shelf Capacity 719: 15 / 360 719: 15 / 360 (card slots / ports) 723: 17 / 408 723: 17 / 408...
- Page 8 Zhone, the Zhone logo, and all Zhone product names are trademarks of Zhone Technologies, Inc. Other brand and product names are trademarks of their respective holders. Specifications, products, and/or product names are all subject to change without notice.