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TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2
Multiplexer/Demultiplexer Switch Evaluation Module
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2
Introduction
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4
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2
3
4
5
6
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8
9
10
Bottom Silkscreen/Assembly
1
2
3
4
SCDU001A - July 2009 - Revised October 2009
Submit Documentation Feedback
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TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer
Copyright © 2009, Texas Instruments Incorporated
SCDU001A - July 2009 - Revised October 2009
Contents
List of Figures
List of Tables
User's Guide
2
3
5
14
3
4
5
7
9
10
11
12
13
13
5
5
6
14
1
Switch Evaluation Module
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Related Manuals for Texas Instruments TS3USB221
Summary of Contents for Texas Instruments TS3USB221
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Page 1: Table Of Contents
SCDU001A – July 2009 – Revised October 2009 Submit Documentation Feedback SCDU001A – July 2009 – Revised October 2009 Contents List of Figures List of Tables TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Copyright © 2009, Texas Instruments Incorporated User's Guide Switch Evaluation Module... -
Page 2: Scdu001A – July 2009 – Revised October
Preface Preface About This Manual This user’s guide describes the TS3USB221/A/E Evaluation Module (EVM). This guide contains the EVM schematics, bill of materials, assembly drawings, and top and bottom board layouts. How to Use This Manual This document contains the following chapters: •... -
Page 3: Ts3Usb221/A/E Evm Block Diagram
This evaluation module is designed to demonstrate the small printed circuit board (PCB) areas that can be achieved when designing with the TS3USB221/A/E USB switches. It is powered from the 5-V rail of the USB input. Additionally, the TS3USB221/A/E provides an output enable input and an output select input for flexible configuration of the USB. -
Page 4: Quick Start Evaluation
2. Make sure the 3.3-V LDO output is enabled by opening J8 without a jumper. 3. Make sure the TS3USB221/A/E IC is enabled by shunting J7 with a jumper. 4. Connect two USB downstream devices (for example, mouse, keyboard, USB memory stick, etc) to J4 and J5 on the EVM. -
Page 5: Jumpers J6, J7, And J8 Configuration
90-Ω differential. The trace length of the through-path and the trace length through the TS3USB221/A/E switch are also matched for comparison purpose. The PCB is a simple four-layer top-side populated board (see the schematic and PCB layout in features of the hardware design are detailed in the following sections. -
Page 6: Board Stack-Up
Subclass Type Name SURFACE CONDUCTOR DIELECTRIC PLANE DIELECTRIC PLANE DIELECTRIC BOTTOM CONDUCTOR SURFACE TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Table 3. Board Stack-Up Thickness Dielectric Loss Shield (mils) Constant Tangent 0.035 0.035 0.035 Copyright © 2009, Texas Instruments Incorporated www.ti.com... -
Page 7: Evm Schematic
EVM Configuration and Description www.ti.com Schematics Figure 4. EVM Schematic SCDU001A – July 2009 – Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated... -
Page 8: Pcb Layout
EVM Configuration and Description PCB Layout TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Figure 5. Top Silkscreen/Assembly Copyright © 2009, Texas Instruments Incorporated www.ti.com SCDU001A – July 2009 – Revised October 2009 Submit Documentation Feedback... -
Page 9: Top Metal (High-Speed Differential)
EVM Configuration and Description www.ti.com Figure 6. Top Metal (High-Speed Differential) SCDU001A – July 2009 – Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated... -
Page 10: Internal Ground Plane
EVM Configuration and Description TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Figure 7. Internal Ground Plane Copyright © 2009, Texas Instruments Incorporated www.ti.com SCDU001A – July 2009 – Revised October 2009 Submit Documentation Feedback... -
Page 11: Internal Power Plane
EVM Configuration and Description www.ti.com Figure 8. Internal Power Plane SCDU001A – July 2009 – Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated... -
Page 12: Bottom Metal (Low-Speed Single-Ended)
EVM Configuration and Description Figure 9. Bottom Metal (Low-Speed Single-Ended) TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Copyright © 2009, Texas Instruments Incorporated www.ti.com SCDU001A – July 2009 – Revised October 2009 Submit Documentation Feedback... - Page 13 EVM Configuration and Description www.ti.com Figure 10. Bottom Silkscreen/Assembly SCDU001A – July 2009 – Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated...
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Page 14: Related Documentation
100 kΩ TS3USB221/A/ LP2985-33 Related Documentation TS3USB221 High-Speed USB 2.0 (480Mbps) 1:2 Multiplexer/Demultiplexer Switch with Single Enable data sheet (SCDS220F) TS3USB221A ESD Protected, High-Speed USB 2.0 (480Mbps) 1:2 Multiplexer/Demultiplexer Switch with Single Enable data sheet (SCDS277) TS3USB221E High-Speed USB 2.0 (480Mbps) 1:2 Multiplexer/Demultiplexer Switch with Single Enable and IEC Level 3 ESD Protection data sheet (SCDS263) USB 2.0 Board Design and Layout Guidelines application report (SPRAAR7) -
Page 15: Important Notice
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
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