TDK SEMICONDUCTOR CORP.
DESCRIPTION
The 73M2901/5V is a single-chip modem that
combines all the controller (DTE) and data pump
functions necessary to implement an intelligent
V.22bis data modem. This device is based on TDK
Semiconductor's implementation of the industry
standard 8032 microcontroller core with a proprietary
multiply and accumulate (MAC) coprocessor; Sigma-
Delta A/D and D/A converters; and an analog front
end. The ROM and RAM necessary to operate the
modem are contained on the device. Additionally,
the 73M2901/5V provides an on-chip oscillator and
Hybrid driver.
The 73M2901/5V is a high performance, low
voltage, low power, single chip modem capable of
data transmission and reception through 2400bps.
The
73M2901/5V
is
applications and battery operation. This device
offers options for a low power conventional 5 volt
design with optional internal hybrid and country
specific call progress support.
ASRCH
®
intended
for
embedded
RING
DTR
TxCLK
TxD
RxD
RxCLK
RI
CTS
DCD
DSR
RTS
FEATURES
·
Low overall system chip count. True one
chip solution for embedded systems
·
Low operating power (~250mW @ 5V,
automatic low power standby and power
down options available)
·
Internal ROM and RAM for normal operation
·
On chip optional hybrid driver
·
Designed for +5 volts (+/-10%)
·
Data speeds:
·
Dynamic Range: -9dBm to –43 dBm
·
"AT" command set
·
Host access to modem port pins via AT
commands for custom I/O expansion
·
DTMF tone generation and detection
·
Call progress support with multinational
options (FCC68, CTR21, JATE...)
·
Caller ID capability
·
Blacklisting capability
·
Packaging: 32 pin PLCC or 44 pin TQFP
BLOCK DIAGRAM
ROM
RAM
CPU
AFE
USR10
USR11
RELAY
Advanced Single
V.22bis – 2400bps
V.22, Bell 212 – 1200bps
V.21, Bell 103 – 300bps
V.23 – 1200/75bps (w/ turnaround (PAVI))
Bell 202 – 1200bps
Bell 202 and V23 4-wire operations
MAC
RxA
Hybrid
TxAP
TxAP
HBDEN
73M2901/5V
Chip Modem
August 2001