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TDK 73M2901/5V User Manual

Advanced single chip modem
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TDK SEMICONDUCTOR CORP.
DESCRIPTION
The 73M2901/5V is a single-chip modem that
combines all the controller (DTE) and data pump
functions necessary to implement an intelligent
V.22bis data modem. This device is based on TDK
Semiconductor's implementation of the industry
standard 8032 microcontroller core with a proprietary
multiply and accumulate (MAC) coprocessor; Sigma-
Delta A/D and D/A converters; and an analog front
end. The ROM and RAM necessary to operate the
modem are contained on the device. Additionally,
the 73M2901/5V provides an on-chip oscillator and
Hybrid driver.
The 73M2901/5V is a high performance, low
voltage, low power, single chip modem capable of
data transmission and reception through 2400bps.
The
73M2901/5V
is
applications and battery operation. This device
offers options for a low power conventional 5 volt
design with optional internal hybrid and country
specific call progress support.
ASRCH
®
intended
for
embedded
RING
DTR
TxCLK
TxD
RxD
RxCLK
RI
CTS
DCD
DSR
RTS
FEATURES
·
Low overall system chip count. True one
chip solution for embedded systems
·
Low operating power (~250mW @ 5V,
automatic low power standby and power
down options available)
·
Internal ROM and RAM for normal operation
·
On chip optional hybrid driver
·
Designed for +5 volts (+/-10%)
·
Data speeds:
·
Dynamic Range: -9dBm to –43 dBm
·
"AT" command set
·
Host access to modem port pins via AT
commands for custom I/O expansion
·
DTMF tone generation and detection
·
Call progress support with multinational
options (FCC68, CTR21, JATE...)
·
Caller ID capability
·
Blacklisting capability
·
Packaging: 32 pin PLCC or 44 pin TQFP
BLOCK DIAGRAM
ROM
RAM
CPU
AFE
USR10
USR11
RELAY
Advanced Single
V.22bis – 2400bps
V.22, Bell 212 – 1200bps
V.21, Bell 103 – 300bps
V.23 – 1200/75bps (w/ turnaround (PAVI))
Bell 202 – 1200bps
Bell 202 and V23 4-wire operations
MAC
RxA
Hybrid
TxAP
TxAP
HBDEN
73M2901/5V
Chip Modem
August 2001

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  Summary of Contents for TDK 73M2901/5V

  • Page 1 The 73M2901/5V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor’s implementation of the industry standard 8032 microcontroller core with a proprietary multiply and accumulate (MAC) coprocessor;...
  • Page 2: Hardware Description

    · Autobaud capability from 300bps to 9600bps POWER SUPPLY Power is supplied to the 73M2901/5V via the VPD and VPA pins. The 73M2901/5V is designed for a single +5 (+/-10%) volt supply and for low power consumption (~250mW @ 5 volts). Ground Reference is provided at the VND and VNA pins.
  • Page 3: Pin Descriptions

    Analog Band Gap voltage reference pin (0.1m F to VNA) Analog reference voltage pin (0.1m F to VNA) TYPE DESCRIPTION External interrupt – Line interface ring detection circuitry input External interrupt – Autobaud detection, connected to TXD External interrupt – DTE DTR signal input 73M2901/5V Advanced Single Chip Modem...
  • Page 4 Crystal input for internal oscillator, also input for external source. Crystal oscillator output. TYPE DESCRIPTION Resets 73M2901/5V Receive Data Synchronous Clock Serial output to DTE. Transmit Data Synchronous Clock Serial data input from DTE. This pin can optionally be configured as an active low detect pin.
  • Page 5: Electrical Specifications

    Answer Tone Power DTMF Transmit Power dBm0 refers to the TDK recommended DAA ( 8dB loss from Transmit pins to the line and 5dB loss from the line to the Receive pin). Results may vary depending on selected DAA. 0dBm = 0.775V...
  • Page 6 DTMF (low tone) DTMF (total) Note: The recommended DAA (see the TDK 73M2901 Reference Manual) will result in approximately 8dB loss from the transmit pins to the phone line. This includes the loss through the line matching impedance (475W (continued)
  • Page 7 Receive Level Idle Channel Noise (continued) and 3 harmonic. CONDITIONS Tip and Ring Tip and Ring Tip and Ring Tip and Ring 0.2kHz - 4.0kHz 73M2901/5V Advanced Single Chip Modem UNIT -0.3 each unwanted frequency component sum of unwanted below...
  • Page 8 73M2901/5V Advanced Single Chip Modem ELECTRICAL SPECIFICATIONS RECEIVER (continued) PARAMETER TEST CONDITION Input Impedance Receive Gain SFR 96h bit 2 (Rxgain) = 1 Boost Maximum Input VREF=1.25V Level at RXA VREF=2.25V Total Harmonic 1kHz 450mV-pk on RXA Distortion (THD) THD = 2...
  • Page 9 IDD1 30pF/pin IDD1 30pF/pin IDDd 30pF/pin IDDah1 30pF/pin IDDah0 30pF/pin IDD2 30pF/pin IDD3 30pF/pin CONDITION Vcc=5V Vcc=5V – no boost Vcc=5V + internal boost 73M2901/5V Advanced Single Chip Modem 1.19 1.25 1.31 1.19 1.25 1.31 2.14 2.25 2.36 UNIT UNIT...
  • Page 10: Firmware Description

    “AT” command. The host can also program the modem to power down via external pin (DTR) or via a firmware command. For a detailed description of the firmware consult the TDK 73M2901 User’s Manual. FIRMWARE FEATURES ·...
  • Page 11: Design Considerations

    VBG and VNA. Use of ground planes and large traces on power is recommended. The 73M2901/5V is the first of a series of parts with different and/or additional features. In order to insure full lay out compatibility for all the series, it is...
  • Page 12 73M2901/5V Advanced Single Chip Modem TXAP TXAN TTL V24 signals interface --> RS232 level shifter --> Host microprocessor HEADER 10 Recommended Schematics Arrangement 0.033m Recommended Line Interface 27PF 10uF 11.0592 MHZ 33PF 2901_P32 VREF HBDEN ASRCH TXAP TXAN 5.1K Telephone...
  • Page 13 73M2901/5V Advanced Single Chip Modem TYPICAL USA APPLICATION SCHEMATICS...
  • Page 14 73M2901/5V Advanced Single Chip Modem BER VS SNR V.22bis 3002A Line, 5.0V, 25C 1.00E+00 1.00E-01 1.00E-02 1.00E-03 1.00E-04 1.00E-05 1.00E-06 10 11 12 13 14 15 16 17 18 19 SNR (Rx Signal/3k Hz) (dB) Answer Originate BER VS RECEIVE LEVEL V.22bis...
  • Page 15 TXAN 44 PIN TQFP PIN-OUT PIN NAME USR11 USR10 RESET PIN NAME TXAP VREF OSCOUT OSCIN TXCLK RXCLK PIN NAME PIN NAME OSCOUT HBDEN OSCIN TXAN TXAP VREF TXCLK 73M2901/5V Advanced Single Chip Modem PIN NAME RXCLK ASRCH RING RELAY...
  • Page 16: Mechanical Drawings

    73M2901/5V Advanced Single Chip Modem MECHANICAL DRAWINGS 32-Pin PLCC...
  • Page 17 73M2901/5V Advanced Single Chip Modem MECHANICAL DRAWINGS (continued) 44-Pin TQFP (JEDEC LQFP)
  • Page 18: Ordering Information

    44-Pin Thin Quad Flat Pack No responsibility is assumed by TDK Semiconductor Corporation for use of this product nor for any infringements of patents and trademarks or other rights of third parties resulting from its use. No license is granted under any patents, patent rights or trademarks of TDK Semiconductor Corporation, and the company reserves the right to make changes in specifications at any time without notice.
  • Page 19 73M2901/5V Advanced Single Chip Modem August 22, 2001 Removed 5V pin callouts from package drawing. August 30, 2001 Updated Mechanical Drawing...