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HP BladeSystem Blade Enclosure Product End-Of-Life Disassembly Instructions

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Product End-of-Life Disassembly Instructions
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive
2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and
lithium coin or button style batteries
For example, mercury in lamps, display
backlights, scanner lamps, switches,
batteries
Includes background illuminated displays
with gas discharge lamps
Include the cartridges, print heads, tubes,
vent chambers, and service stations.
Quantity of items
included in product
9 total (2 on each of
the 2 power
supplies) (2
mid-plane PCA
assys) (1 fan quad
assy), 1 switch, 1
daughter card on
switch
1 (Switch assy)
2
6 (2 standard PSU
cables, 2 PDU
cables, Fan
assembly cable,
enclosure status
assembly cable)

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Summary of Contents for HP BladeSystem Blade Enclosure

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2: Power Supply

    Quantity of items Item Description Notes included in product Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
  • Page 3: Switch Assembly

    Pull the fan cage assembly out by its handle until it is stopped by the safety catch on the top of the fan assembly (see Figure 8 below). Press down on the safety catch that secures the fan cage assembly in the enclosure (see Figure 8 below).
  • Page 4 FIGURE 1: Removing the power supply FIGURE 2: Power supply screw locations FIGURE 3: Power supply screw locations FIGURE 4: Cut power supply cables FIGURE 5: Printed circuit board screw locations FIGURE 6: Clip cable and remove screws...
  • Page 5 FIGURE 7: Fan assembly lever FIGURE 8: Fan cage safety catch FIGURE 9: Fan assembly finger pulls FIGURE 10: Thumbscrew for printed circuit board FIGURE 11: Fan assembly printed circuit board FIGURE 12: Press release levers...
  • Page 6 FIGURE 13: Mid-plane assembly release levers FIGURE 14: Mid-plane thumbscrews FIGURE 16: Mid-plane printed circuit board with FIGURE 17: Mid-plane printed circuit board with cover and screw locations cover and screw locations FIGURE 18: Mid-plane printed circuit board screw FIGURE 19: Mid-plane printed circuit board screw locations locations...