Preparing For Mounting - Siemens SIMATIC KP8 Operating Instructions Manual

Planning the use

3.5 Preparing for Mounting

3.5 Preparing for Mounting
Select the HMI device mounting location
Points to observe when selecting the mounting location:
● Position the HMI device so that it is not subjected to direct sunlight.
● Position the HMI device such that it is ergonomically accessible for the user.
● Ensure that the air vents are not covered as a result of the mounting.
● Observe the permissible mounting positions for the HMI device.
Configuration of the mounting cut-out
In order to guarantee the protective type corresponding with chapter "Insulation resistance,
protection class and degree of protection (Page 36)", the following must be complied with:
● The material at the mounting cut-out must be distortion-resistant.
● Thickness of material at the installation cut-out for protection class IP65: 2 mm up to
● Permitted deviation from plane at the mounting cut-out: ≤ 0.5 mm
● Permissible surface roughness in the area of the seal: ≤ 120 µm (R
34
Choose a suitable mounting height.
6 mm
This condition must be fulfilled for the mounted HMI device.
120)
z
Operating Instructions, 10/2010, A5E03284305-01
KP8, KP8F