Malfunctions due to polluted DRIVE-CLiQ interfaces
Malfunctions can occur in the system through the use of polluted DRIVE-CLiQ interfaces.
• Cover unused DRIVE-CLiQ interfaces with the supplied blanking covers.
Function equipotential bonding for distributed DRIVE-CLiQ nodes
Integrate all of the components that are connected via DRIVE-CLiQ into the function
equipotential bonding concept. The connection should be preferably established by mounting
on metallic bare machine and plant components that are connected with one another using
an equipotential bonding conductor.
Alternatively, you can establish equipotential bonding using a conductor (min. 6 mm²), which
as far as possible, is routed in parallel to the DRIVE-CLiQ cable. This applies to all
distributed DRIVE-CLiQ nodes such as DM20, SME2x, SME12x.
Terminal Module 150 (TM150)
Operating Instructions, 04/2014, A5E03758735A
2.1 Safety information