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SERVICE MANUAL
Ver 1.0 1998.10
US and foreign patents licensed from Dolby
Laboratories Licensing Corporation
MD Section
Audio playing system
Minidisc digital audio system
Laser diode properties
Material : GaAlAs
Wavelength : λ =790nm
Emission duration : continuous
Laser output : less than 44.6 µW*
* This output is the value measured at a distance of 200 mm from the
objective lens surface on the optical pick-up block with 7mm aperture.
Revolutions
400 rpm to 900 rpm (CLV)
Error correction
Advanced Cross Interleave Reed Solomon Code (ACIRC)
Sampling frequency
44.1kHz
Coding
Adaptive Transform Acoustic Coding (ATRAC)
Modulation system
EFM (Eight to Fourteen Modulation)
Number of channels
2 stereo channels
1 monaural channel
Frequency response
20 to 20,000 Hz ± 3 dB
Wow and Flutter
Below measurable limit
Outputs
Headphones : stereo mini-jack, maximum output level 5mW+5mW,
load impedance 16 ohm
MICROFILM
Model Name Using Similar Mechanism
MD Mechanism Type
Optical Pick-up Mechanism Type
SPECIFICATIONS
General
Power requirements
Rechageable battery (supplied)
Nickel metal hydride rechargeable battery NH-9WM (N)
One LR6 (size AA) alkaline battery (not supplied)
Sony AC Power Adaptor (not supplied) connected at the DC IN
1.5V jack
Battery operation time
Batteries
Nickel metal hydride
Rechargeable battery (NH-9WM (N))
One LR6 (size AA)
Sony alkaline dry batteries
Nickel metal hydride (NH-9WM (N)) +
One LR6 (size AA)
Dimensions
Approx. 79.7 x 14.9 x 71.9 mm (w/h/d)
1
19
(3
/
x
/
x 2
4
32
Mass
Approx. 80 g (2.9 oz.) the player only
Approx. 120 g (4.3 oz.) incl. a premastered MD and a nickel
metal hydride rechargeable battery NH-9WM (N)
Supplied accessories
Battery charger (1)
Rechargeable battery (1)
Rechargeable battery carrying case (1)
Headphones with a remote control (1)
Dry battery case (1)
Carrying pouch (1)
Plug adaptor (1) (Tourist model)
Design and specifications are subject to change without notice.
PORTABLE MINIDISC PLAYER
MZ-E55
Tourist Model
NEW
MT-MZE55-150
ODX-1A/1B
Playback
Approx.
7.5 hours
Approx.
10 hours
Approx.
20 hours
7
/
in) not including projecting parts and controls
8
E Model

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Summary of Contents for Sony MZ-E55

  • Page 1 Nickel metal hydride rechargeable battery NH-9WM (N) Material : GaAlAs One LR6 (size AA) alkaline battery (not supplied) Wavelength : λ =790nm Sony AC Power Adaptor (not supplied) connected at the DC IN Emission duration : continuous 1.5V jack Laser output : less than 44.6 µW*...
  • Page 2: Table Of Contents

    FROM ANY DEFECTIVE PRODUCT OR THE USE OF ANY PRODUCT. SAFETY-RELATED COMPONENT WARNING!! “MD WALKMAN” is a trademark of Sony COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH Corporation. MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
  • Page 3: General

    SECTION 2 GENERAL LOCATION AND FUNCTION OF CONTROLS Main Unit !º 1 OPERA TE lamp 7 MD operate b uttons 2 HOLD switch + ” ( FF • PLA Y ) 3 DIGITAL MEGA B ASS s witc h = (REW ) 4 AVLS s witc h p (STOP) 5 Battery compartment...
  • Page 4: Disassembly

    SECTION 3 DISASSEMBLY The equipment can be removed using the following procedure. Upper panel ASSY Main board, Audio board Switch board Mechanism deck section Optical pick-up block ASSY Note : Follow the disassembly procedure in the numerical order given. 3-1. UPPER PANEL ASSY Upper panel ASSY 5 Screws (M1.4) precision pan OPEN knob...
  • Page 5: Main Board, Audio Board

    3-3. MAIN BOARD, AUDIO BOARD Claw * Audio board Lid, Battery case Case, Battery Terminal (plus) ASSY, Battery 4 Screws (M1.4) step 5 Screws (M1.4) precision pan Main board Plate (R) ASSY, Fulcrum Panel, Buttom * NOTE : When removing the audio board, lift up on the board so that the connector separates vertically.
  • Page 6 3-5. OPTICAL PICK-UP BLOCK ASSY 2 Screw (M1.4) precision pan Optical pick-up block ASSY Flexible board Shaft (Main) Double sided adhesive tape Chassis ASSY Flexible board – 6 –...
  • Page 7: Test Mode

    SECTION 4 TEST MODE Outline Configuration of Test Mode • In this set, overall adjustment mode is made available by enter- The test mode has the configuration given below. ing test mode to perform automatic adjustment of CD and MO. In the overall adjustment mode, the disc is determined whether + key Overall...
  • Page 8 2. Description of Each Mode (See page 7.) 010 Offset adjustment Mode Description FE offset TE offset ” key p key MO adjustment All servo ON 0 3 0 020 Laser power adjustment 031 to 039 Mode Description p key MO power A ”...
  • Page 9 060 Sled movement Audio Mode • Enter the test mode and press the VOLUME – key. Then, press Mode Description the ( key and the VOLUME + key in this turn to enter audio Sled in mode. Sled out 5 •...
  • Page 10 Power Mode • Enter the test mode and press the VOLUME – key. Then, press the ( key and the VOLUME – key in this turn to enter power mode. • When entering another mode, refer to the configuration of test mode.
  • Page 11: Electrical Adjustments

    1. Enter the test mode and press the VOLUME + key to enter over- MO EF balance all adjustment mode. 2. Insert the CD test disc (TGYS-1) or SONY MO disc (recorded) MO EF gain commercially available. MO EF balance 3.
  • Page 12 * Remote commander display during automatic adjustment Adjustment value (flashing) Mode No. under adjustment 4. If result of automatic adjustment is OK, the following display appears. 0 4 7 End-OK 5. If result of automatic adjustment is NG, the following display appears.
  • Page 13: Diagrams

    SECTION 6 DIAGRAMS 6-1. EXPLANATION OF IC TERMINALS IC801 RU6815MF-0003 (FORMER TYPE), RU6815MF-0004 (NEW TYPE) (SYSTEM CONTROL) Pin No. Pin Name Pin Description – Not used (Fixed at “L” ). UREG MON Unreg voltage monitor input. – Not used (Fixed at “L” ). VREF Reference voltage for power supply voltage adjustlment.
  • Page 14 Pin No. Pin Name Pin Description – Not used (Open). – Not used (Open). – Digital power supply (+2.6V or +2.8V). – Power for on board light. – Digital ground. SLD 1R CON Sled motor control signal output. SLD 1F CON Sled motor control signal output.
  • Page 15: Block Diagram

    MZ-E55 6-2. BLOCK DIAGRAM • Signal path. : PLAY – 15 – – 16 – – 17 –...
  • Page 16: Schematic Diagram

    Refer to page 26 for IC Block Diagrams. 6-4. SCHEMATIC DIAGRAM MZ-E55 Waveform. 269 mVp-p 743 mVp-p 5.76 µ sec IC901 !∞ VOLT/DIV : 200 mV AC VOLT/DIV : 0.1 V AC IC501 @• TIME/DIV : 5 µsec TIME/DIV : 2 µsec 63 mVp-p 2.7 Vp-p...
  • Page 17 IC Block Diagrams IC301 BA3577FS-E2 IC552 TLC372CPW-E20 OUT2 IN-2 IN+2 RF IN RF OUT BIAS IN BIAS OUT OUT1 V IN1 OUT1 IN-1 IN+1 V IN2 OUT2 PWSTB PWSTB PWSTB T BEEP MUTE BEEP IN MUTE MUTE T IC601 UPD63731GC-9EU 97 96 ADIP ADIP...
  • Page 18 IC551 MPC17A55FTA PRE DRIVER PRE DRIVER PRE DRIVER PRE DRIVER HI–BRIDGE HI–BRIDGE HI–BRIDGE HI–BRIDGE CONTROL CONTROL CONTROL CONTROL 1ntOE 1ntSTB BIAS CONTROL VPS2 1ntSTB VREG VREG CONT RGND VPS1 CLPF DO or DI SLEEP UP/DOWN /POWER SW DECODER STEP UP/DOWN POWER SW STEP–UP PRE DRIVER...
  • Page 19 IC802 AK93C55AV-L VREF GENERATOR INSTRUCTION DECODE CONTROL DECODER BUFFERS CLOCK GENERATION EEPROM R/W AMPS 2048bit 128 X 16 INSTRUCTION AUTO ERASE REGISTER DATA REGISTER IC901 MPC1830ADTB VSTB VRMC XWK1 BAND GAP VREF REFERENCE XWK2 XWK3 XWK4 SYSTEM CONTROL FFCLR SLEEP VBSEL CRST RESET...
  • Page 20: Exploded Views

    SECTION 7 EXPLODED VIEWS NOTE : • -XX, -X mean standardized parts, so they • The mechanical parts with no reference The components identified by mark ! may have some difference from the original number in the exploded views are not or dotted line with mark ! are critical one.
  • Page 21: Mechanism Deck Section

    7-2. MECHANISM DECK SECTION (MT-MZE55-150) M902 M901 R1001 * NEW TYPE *Note: Use R1001 only with Ver.3 of microprocessor (IC801). Using R1001 with other microprocessor versions will The components identified by mark ! or dotted cause operating errors so be sure to remove it. line with mark ! are critical for safety.
  • Page 22: Electrical Parts List

    SECTION 8 AUDIO MAIN ELECTRICAL PARTS LIST NOTE : • Due to standardization, replacements in the • SEMICONDUCTORS In each case, u : µ , for example : The components identified by mark ! parts list may be different from the parts uA..
  • Page 23 MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C803 1-162-970-11 CERAMIC CHIP 0.01uF < COIL > C804 1-162-964-11 CERAMIC CHIP 0.001uF C805 1-164-156-11 CERAMIC CHIP 0.1uF L501 1-412-006-31 INDUCTOR CHIP 10uH C806 1-164-227-11 CERAMIC CHIP 0.022uF L551 1-412-031-11 INDUCTOR CHIP 47uH...
  • Page 24 MAIN SWITCH Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R911 1-216-864-11 METAL CHIP 1/16W ACCESSORIES & PACKING MATERIALS ******************************** R912 1-216-864-11 METAL CHIP 1/16W 1-475-831-21 REMOTE CONTROL UNIT (RM-MZE55) (GOLD) < COMPOSITION CIRCUIT BLOCK > 1-475-831-51 REMOTE CONTROL UNIT (RM-MZE55) (BLUE) (HK) RB551...
  • Page 25 MZ-E55 Sony Corporation 98J027017-1 Printed in Singapore © 1998.10 Personal A&V Products Company 9-924-958-11 Published by Quality Engineering Dept. – 34 – (Shibaura)
  • Page 26 MZ-E55 SERVICE MANUAL US Model AEP Model Ver 1.1 1999.1 UK Model E Model Tourist Model US and foreign patents licensed from Dolby Model Name Using Similar Mechanism Laboratories Licensing Corporation MD Mechanism Type MT-MZE55-150 Optical Pick-up Mechanism Type ODX-1A/1B SPECIFICATIONS Design and specifications are subject to change without notice.
  • Page 27 FROM ANY DEFECTIVE PRODUCT OR THE USE OF ANY PRODUCT. SAFETY-RELATED COMPONENT WARNING!! “MD WALKMAN” is a trademark of Sony COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH Corporation. MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
  • Page 28: General

    SECTION 2 GENERAL LOCATION AND FUNCTION OF CONTROLS Main Unit !º 1 OPERA TE lamp 7 MD operate b uttons 2 HOLD switch + ” ( FF • PLA Y ) 3 DIGITAL MEGA B ASS s witc h = (REW ) 4 AVLS s witc h p (STOP) 5 Battery compartment...
  • Page 29: Disassembly

    SECTION 3 DISASSEMBLY The equipment can be removed using the following procedure. Upper panel ASSY Main board, Audio board Switch board Mechanism deck section Optical pick-up block ASSY Note : Follow the disassembly procedure in the numerical order given. 3-1. UPPER PANEL ASSY Upper panel ASSY 5 Screws (M1.4) precision pan OPEN knob...
  • Page 30: Main Board, Audio Board

    3-3. MAIN BOARD, AUDIO BOARD Claw * Audio board Lid, Battery case Case, Battery Terminal (plus) ASSY, Battery 4 Screws (M1.4) step 5 Screws (M1.4) precision pan Main board Plate (R) ASSY, Fulcrum Panel, Buttom * NOTE : When removing the audio board, lift up on the board so that the connector separates vertically.
  • Page 31 3-5. OPTICAL PICK-UP BLOCK ASSY 2 Screw (M1.4) precision pan Optical pick-up block ASSY Flexible board Shaft (Main) Double sided adhesive tape Chassis ASSY Flexible board – 6 –...
  • Page 32: Test Mode

    SECTION 4 TEST MODE Outline Configuration of Test Mode • In this set, overall adjustment mode is made available by enter- The test mode has the configuration given below. ing test mode to perform automatic adjustment of CD and MO. In the overall adjustment mode, the disc is determined whether + key Overall...
  • Page 33 2. Description of Each Mode (See page 7.) 010 Offset adjustment Mode Description FE offset TE offset ” key p key MO adjustment All servo ON 0 3 0 020 Laser power adjustment 031 to 039 Mode Description p key MO power A ”...
  • Page 34 060 Sled movement Audio Mode • Enter the test mode and press the VOLUME – key. Then, press Mode Description the ( key and the VOLUME + key in this turn to enter audio Sled in mode. Sled out 5 •...
  • Page 35 Power Mode • Enter the test mode and press the VOLUME – key. Then, press the ( key and the VOLUME – key in this turn to enter power mode. • When entering another mode, refer to the configuration of test mode.
  • Page 36: Electrical Adjustments

    1. Enter the test mode and press the VOLUME + key to enter over- MO EF balance all adjustment mode. 2. Insert the CD test disc (TGYS-1) or SONY MO disc (recorded) MO EF gain commercially available. MO EF balance 3.
  • Page 37 * Remote commander display during automatic adjustment Adjustment value (flashing) Mode No. under adjustment 4. If result of automatic adjustment is OK, the following display appears. 0 4 7 End-OK 5. If result of automatic adjustment is NG, the following display appears.
  • Page 38: Diagrams

    SECTION 6 DIAGRAMS 6-1. EXPLANATION OF IC TERMINALS IC801 RU6815MF-0004 (Ver 3.0), RU6815MF-0005 (Ver 3.2), RU6815MF-0006 (Ver 3.3) (SYSTEM CONTROL) Pin No. Pin Name Pin Description – Not used (Fixed at “L” ). UREG MON Unreg voltage monitor input. – Not used (Fixed at “L”...
  • Page 39 Pin No. Pin Name Pin Description – Not used (Open). – Not used (Open). – Digital power supply (+2.6V or +2.8V). – Power for on board light. – Digital ground. SLD 1R CON Sled motor control signal output. SLD 1F CON Sled motor control signal output.
  • Page 40: Block Diagram

    MZ-E55 6-2. BLOCK DIAGRAM • Signal path. : PLAY – 15 – – 16 – – 17 –...
  • Page 41: Schematic Diagram

    Refer to page 26 for IC Block Diagrams. 6-4. SCHEMATIC DIAGRAM MZ-E55 Waveform. 269 mVp-p 743 mVp-p 5.76 µ sec IC901 !∞ VOLT/DIV : 200 mV AC VOLT/DIV : 0.1 V AC IC501 @• TIME/DIV : 5 µsec TIME/DIV : 2 µsec 63 mVp-p 2.7 Vp-p...
  • Page 42 SECTION 7 EXPLODED VIEWS IC Block Diagrams NOTE : IC301 BA3577FS-E2 IC552 TLC372CPW-E20 IC551 MPC17A55FTA IC802 AK93C55AV-L 7-2. MECHANISM DECK SECTION • -XX, -X mean standardized parts, so they • The mechanical parts with no reference (MT-MZE55-150) OUT2 IN-2 IN+2 may have some difference from the original number in the exploded views are not The components identified by mark !
  • Page 43: Electrical Parts List

    SECTION 8 AUDIO MAIN ELECTRICAL PARTS LIST NOTE : • Due to standardization, replacements in the • SEMICONDUCTORS In each case, u : µ , for example : The components identified by mark ! parts list may be different from the parts uA..
  • Page 44 MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C803 1-162-970-11 CERAMIC CHIP 0.01uF < JACK > C804 1-162-964-11 CERAMIC CHIP 0.001uF C805 1-164-156-11 CERAMIC CHIP 0.1uF J301 1-779-867-61 JACK (2/REMOTE) C806 1-164-227-11 CERAMIC CHIP 0.022uF C807 1-164-227-11 CERAMIC CHIP 0.022uF...
  • Page 45 MAIN SWITCH Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R841 1-216-809-11 METAL CHIP 1/16W MISCELLANEOUS R842 1-216-809-11 METAL CHIP 1/16W ************** R901 1-216-845-11 METAL CHIP 100K 1/16W 1-670-708-11 SWITCH FLEXIBLE BOARD R902 1-216-853-11 METAL CHIP 470K 1/16W 1-670-707-11 CLV FLEXIBLE BOARD...
  • Page 46 MZ-E55 Sony Corporation 99A0288-1 Printed in Japan © 1999.1 Personal A&V Products Company 9-924-958-12 Published by Quality Engineering Dept. – 34 – (Shibaura)

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