Contact Modules For Base Mounting (Enclosure Mounting); Contact Modules For Pcb Mounting - Siemens SIRIUS ACT 3SU1 System Manual

3SU14 modules
8.1 Overview
8.1.4

Contact modules for base mounting (enclosure mounting)

The contact modules for base mounting are installed in 3SU18 enclosures. On enclosures
with raised cover (Article No.: 3SU180(5)1-1AA00-0AA1), base mounting is not envisaged.
For further information refer to Chapter "3SU18 enclosures". (Page 219)
Number of NO contacts
Contact modules with silver contacts
Siemens Industry Mall (https://mall.industry.siemens.com/mall/en/WW/Catalog/Products/10251007)
1
0
Contact modules with gold contacts
1
0
x: 1 = screw terminals; 3 = spring-loaded terminals
8.1.5

Contact modules for PCB mounting

Number of NO contacts
1
0
Information on the soldering process
The following soldering processes are possible:
●
●
● Laser soldering
Recommended soldering parameters for selective soldering with liquid solder:
● Maximum soldering temperature: 285 °C
● Maximum soldering time per pin: 2 seconds
During each of the above-mentioned soldering processes, you must ensure that no liquid
solder gets on the plastic parts or parts of the enclosure.
Achievable quality of the soldering points: Class 2 according to IPC–A-610 F (electronic
products with higher demands).
174
Number of NC contacts
0
1
0
1
Number of NC contacts
0
1
Selective soldering process
Manual soldering
Product function
positive opening
No
Yes
No
Yes
Product function
positive opening
No
Yes
SIRIUS ACT 3SU1 pushbuttons and signaling devices
System Manual, 08/2018, A5E03457306020A/RS-AK/010
Article number
3SU1400-2AA10-xBA0
3SU1400-2AA10-xCA0
3SU1400-2AA10-xLA0
3SU1400-2AA10-xMA0
Article number
3SU1400-3AA10-5BA0
3SU1400-3AA10-5CA0