Pa-Unit Board Kit Reassembly; Figure 6-62. Location For Thermal Compound; Figure 6-63. Placing Pa-Unit Board Kit Into Chassis - Motorola PM1200 Basic Service Manual

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6.2.3.4.2 PA-Unit Board Kit Reassembly

1. Use a soft cloth to remove any remaining residue. Put the thermal compound to the chassis
as shown in
NOTE: Refer 6.3: "Chassis Thermal Compound Replacement Procedure" on page
2. Hold the PA-unit board kit [20] by its edges only, and take it out from an antistatic bag. Check
the replacement PA unit. There should not be any transistor fins vent shape and crack at the
solder joint points
3. Place the PA-unit board kit [20] into place by gently pushing down the PCB to fully seat it as
shown in
both surfaces. Ensure that the PA-unit board kit alignment holes are positioned over the
chassis alignment bosses and that the Main-unit board kit is fully seated.
4. Using a CR-V PH2 torque driver, fasten the 5 SEMS screws ASM3x8 NI [22] following the
sequence as shown in
October 26, 2007
Disassembly/Reassembly Procedures: Replacement Procedures
Figure 6-62.

Figure 6-62. Location for Thermal Compound.

Figure 6-63. Move the PCB gently, 2 or 3 times to exclude any air gaps between

Figure 6-63. Placing PA-Unit Board Kit into Chassis.

Figure 6-64. (Torqued to 4.6–5.8 kgf*cm/ 4–5 in. lbs)
6-47.
6880309U09-A