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Summary of Contents for NXP Semiconductors TDA1519C
- Page 1 DATA SHEET TDA1519C 22 W BTL or 2 11 W stereo power amplifier Product specification Supersedes data of 2001 Aug 24 INTEGRATED CIRCUITS 2004 Jan 28...
- Page 2 TDA1519CTH HSOP20 2004 Jan 28 GENERAL DESCRIPTION The TDA1519C is an integrated class-B dual output amplifier in a 9-lead plastic single in-line power package or 20-lead heatsink small outline package. For the TDA1519CTH (SOT418-3), the heatsink is positioned on top of the package, which allows an external heatsink to be mounted on top.
- Page 3 = 2 = 4 THD = 10 %; R = 0 = 100 Hz = 1 to 10 kHz Product specification TDA1519C MIN. TYP. MAX. UNIT 14.4 17.5 A ...
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Page 4: Block Diagram
22 W BTL or 2 11 W stereo power amplifier BLOCK DIAGRAM NINV The pin numbers refer to the TDA1519C and TDA1519CSP only, for TDA1519CTD and TDA1519CTH see Figs 3 and 4. 2004 Jan 28 mute switch 18.1 kW... - Page 5 2, 4, 6, 7, 9 and 13 to 18 2, 4, 6, 7, 9 and 13 to 18 not connected NINV GND1 OUT1 TDA1519C GND2 TDA1519CSP OUT2 M/SS mgr561 Fig.2 Pin configuration TDA1519C and TDA1519CSP. 2004 Jan 28 TDA1519CTD TDA1519CTH n.c. OUT1 n.c. GND2 TDA1519CTD n.c. n.c.
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Page 6: Functional Description
22 W BTL or 2 11 W stereo power amplifier FUNCTIONAL DESCRIPTION The TDA1519C contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB. A special feature of this device is the... - Page 7 THERMAL CHARACTERISTICS SYMBOL PARAMETER thermal resistance from junction to ambient; th(j-a) TDA1519C, TDA1519CTH and TDA1519CTD thermal resistance from junction to case; th(j-c) TDA1519C, TDA1519CTH and TDA1519CTD DC CHARACTERISTICS = 25 C; measured in circuit of Fig.6; unless otherwise specified.
- Page 8 THD = 0.5 % THD = 10 % = 1 W THD = 0.5 %; = 1 dB; with respect to 15 W 1 dB; note 2 1 dB Product specification TDA1519C MIN. TYP. MAX. ...
- Page 9 3 and 6 standby; notes 3 and 6 note 7 = 0 on; R on; R = 10 k mute; note 8 = 0 V). Product specification TDA1519C MIN. TYP. MAX. ...
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Page 10: Application Information
1/2 V TDA1519C 60 kW 40 dB signal power ground ground 1000 µF Fig.6 Stereo application diagram (TDA1519C). input reference internal voltage 1/2 V TDA1519C 60 kW 40 dB signal power R L = 4 W ground ground Fig.7 BTL application diagram (TDA1519C). - Page 11 Fig.8 Total quiescent current as a function of the supply voltage. BTL application. = 4 . = 1 kHz. 2004 Jan 28 q(tot) (mA) THD = 10% 0.5% Fig.9 Output power as a function of the supply voltage. Product specification TDA1519C mgr539 mgr540...
- Page 12 = 1 kHz. Fig.10 Total harmonic distortion as a function of the output power. BTL application. = 4 . = 1 W. Fig.11 Total harmonic distortion as a function of the operating frequency. 2004 Jan 28 Product specification TDA1519C mgr541 mgu377 (Hz)
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Page 13: Package Outlines
2004 Jan 28 scale 0.48 24.0 20.0 12.2 0.38 23.6 19.6 11.8 REFERENCES JEDEC JEITA non-concave view B: mounting base side 10 mm 17.2 2.54 16.5 EUROPEAN PROJECTION Product specification TDA1519C SOT131-2 2.00 0.25 0.03 1.45 ISSUE DATE 99-12-17 03-03-12... - Page 14 2004 Jan 28 heatsink scale 0.48 24.0 20.0 12.2 2.54 0.38 23.6 19.6 11.8 REFERENCES JEDEC JEITA heatsink θ (A 3 ) 10 mm 0.25 0.03 EUROPEAN PROJECTION Product specification TDA1519C SOT354-1 θ 2.00 3° 0.15 1.45 0° ISSUE DATE 03-03-12 06-03-16...
- Page 15 2004 Jan 28 scale 0.53 0.32 16.0 13.0 0.40 0.23 15.8 12.6 References JEDEC JEITA detail X 10 mm 11.1 14.5 1.27 10.9 13.9 European projection Product specification TDA1519C SOT397-1 θ θ ° ° 0.25 0.25 sot397-1_po Issue date 03-07-23 10-10-21...
- Page 16 0.32 16.0 13.0 11.1 0.23 15.8 12.6 10.9 REFERENCES JEDEC JEITA Product specification detail X 10 mm 14.5 1.27 0.25 0.25 0.03 13.9 EUROPEAN PROJECTION TDA1519C SOT418-3 (A 3 ) θ θ 8° 0.07 0° ISSUE DATE 02-02-12 03-07-23...
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Page 17: Soldering By Dipping Or By Solder Wave
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe Product specification TDA1519C so called thick/large packages. so called small/thin packages. - Page 18 suitable not suitable not suitable not suitable suitable not suitable suitable suitable suitable (7)(8) not recommended suitable not recommended suitable not suitable (11) not suitable Product specification TDA1519C DIPPING suitable ...
- Page 19 However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 2004 Jan 28 Product specification TDA1519C...
- Page 20 Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Product specification TDA1519C DEFINITION...
- Page 21 (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Product specification TDA1519C...
- Page 22 NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers.
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