Package Outline - Philips Bgd904L Datasheet

Philips Semiconductors
860 MHz, 20 dB gain power doubler amplifier

PACKAGE OUTLINE

Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads
A 2
L
c
d
B
U 1
DIMENSIONS (mm are the original dimensions)
A 2
A
UNIT b
max.
max.
0.51
mm 20.8 9.1 0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8
0.38
OUTLINE
VERSION
SOT115J
2001 Nov 01
E
U 2 Q
y
M
p
q
d
D E
c e
max. max.
max.
REFERENCES
IEC JEDEC
Z
A
F
S
W
B
0 5 10 mm
scale
L Q
e 1 F p
min. max.
4.15
2.4
3.85
EIAJ
8
D
p
1 2 3 5 7 8
e
b
e 1
q 2
q 1
U 1
q q 1 q 2 S
max.
38.1 25.4 10.2 4.2 44.75
EUROPEAN
PROJECTION
Product specification
BGD904L
SOT115J
9
w
M
y B
M
y
M B
Z
U 2 W w y
max.
6-32
8 0.25 0.1 3.8
UNC
ISSUE DATE
99-02-06