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NXP Semiconductors BGD814 Datasheet
NXP Semiconductors BGD814 Datasheet

NXP Semiconductors BGD814 Datasheet

860 mhz, 20 db gain power doubler amplifier

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DATA SHEET
andbook, halfpage
BGD814
860 MHz, 20 dB gain power
doubler amplifier
Product specification
Supersedes data of 2001 Sep 07
DISCRETE SEMICONDUCTORS
M3D252
2001 Nov 01

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Summary of Contents for NXP Semiconductors BGD814

  • Page 1 DATA SHEET andbook, halfpage BGD814 860 MHz, 20 dB gain power doubler amplifier Product specification Supersedes data of 2001 Sep 07 DISCRETE SEMICONDUCTORS M3D252 2001 Nov 01...
  • Page 2 2001 Nov 01 PINNING - SOT115J 2, 3 7, 8 handbook, halfpage CONDITIONS f = 45 MHz f = 870 MHz = 24 V PARAMETER Product specification BGD814 DESCRIPTION input common common output Side view MSA319 Fig.1 Simplified outline. MIN. MAX.
  • Page 3 112 chs; f = 745.25 MHz; V = 50.2 dBmV at 745 MHz; note 2 79 chs; f = 445.25 MHz; V = 47.3 dBmV at 547 MHz; note 3 Product specification BGD814 MIN. TYP. MAX. UNIT  19.7 20.3 ...
  • Page 4            = 860.5 MHz.  6 dB; f = 858.25 MHz; V Product specification BGD814 MAX. UNIT 68 61 57 56 64 69  dBmV  dBmV  dBmV = 860.25 MHz;...
  • Page 5 Fig.3 MLD347 (dBmV) 1000 f (MHz) Product specification BGD814 f (MHz) = 24 V; 79 chs; tilt = 7.3 dB (50 to 550 MHz). (3) Typ. (4) Typ. 3 . Cross modulation as a function of frequency under tilted conditions.
  • Page 6 = 24 V; 112 chs; tilt = 10.3 dB (50 to 750 MHz). (1) V (3) Typ. (2) Typ. +3 . (4) Typ. 3 . Fig.6 Cross modulation as a function of frequency under tilted conditions. Product specification BGD814 MLD349 (dBmV) 1000 f (MHz)
  • Page 7: Package Outline

    2001 Nov 01 scale max. min. max. 2.04 4.15 2.4 38.1 25.4 10.2 4.2 44.75 13.75 2.54 5.08 12.7 8.8 2.54 3.85 REFERENCES JEDEC JEITA 10 mm 6-32 44.25 EUROPEAN PROJECTION Product specification BGD814 SOT115J max. 0.25 ISSUE DATE 04-02-04 10-06-18...
  • Page 8 NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Product specification BGD814 DEFINITION...
  • Page 9 (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Product specification BGD814...
  • Page 10 NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers.