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NXP Semiconductors BGA2712 Datasheet
NXP Semiconductors BGA2712 Datasheet

NXP Semiconductors BGA2712 Datasheet

Mmic wideband amplifier

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DATA SHEET
dbook, halfpage
BGA2712
MMIC wideband amplifier
Product specification
Supersedes data of 2002 Jan 31
DISCRETE SEMICONDUCTORS
MBD128
2002 Sep 10

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Summary of Contents for NXP Semiconductors BGA2712

  • Page 1 DATA SHEET dbook, halfpage BGA2712 MMIC wideband amplifier Product specification Supersedes data of 2002 Jan 31 DISCRETE SEMICONDUCTORS MBD128 2002 Sep 10...
  • Page 2 This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B. 2002 Sep 10 PINNING at 1 GHz) Marking code: E2-.
  • Page 3 1 dB gain compression; f = 1 GHz at 1 dB gain compression; f = 2.2 GHz f = 1 GHz f = 2.2 GHz f = 1 GHz f = 2.2 GHz Product specification BGA2712 CONDITIONS VALUE  90 C MIN. TYP. MAX.
  • Page 4: Application Information

    APPLICATION INFORMATION Figure 2 shows a typical application circuit for the BGA2712 MMIC. The device is internally matched to 50 , and therefore does not need any external matching. The value of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF for applications above 100 MHz.
  • Page 5 +0.5 +0.2 4 GHz 100 MHz −0.2 −0.5 −135° −1 −90° = 50  Fig.8 Output reflection coefficient (s Product specification 45° 0° −5 −2 −45° MLD904 ); typical values. 45° 0° −5 −2 −45° MLD905 ); typical values. BGA2712...
  • Page 6 ) as a function of frequency; typical values. −5 −10 −30 −20 −10 = 50  = 5.5 V. = 5 V. = 4.5 V. 2.2 GHz; typical values. Product specification BGA2712 MLD907 3000 4000 f (MHz) MLD909 P D (dBm)
  • Page 7 2002 Sep 10 MLD902 handbook, halfpage 2000 3000 f (MHz) Fig.14 Stability factor as a function of frequency; 1000 2000 = 50  = 12.3 mA; V = 5 V; Z typical values. Product specification BGA2712 MLD903 3000 4000 f (MHz)
  • Page 8 Scattering parameters = 30 dBm; Z = 50 ; T = 5 V; I = 12.3 mA; P f (MHz) MAGNITUDE ANGLE MAGNITUDE (ratio) (deg) 13.48 0.04752 0.05643 22.73 0.09546 39.62 0.13547 37.16 0.17466 32.62 1000 0.20739 27.40 1200 0.24036 23.23 1400 0.26469...
  • Page 9: Package Outline

    DIMENSIONS (mm are the original dimensions) UNIT 0.30 0.25 0.20 0.10 OUTLINE VERSION SOT363 2002 Sep 10 scale 1.35 0.65 1.15 REFERENCES JEDEC JEITA SC-88 detail X 2 mm 0.45 0.25 0.15 0.15 EUROPEAN PROJECTION Product specification BGA2712 SOT363 ISSUE DATE 04-11-08 06-03-16...
  • Page 10 Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Product specification BGA2712 DEFINITION...
  • Page 11 (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Product specification BGA2712...
  • Page 12 NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers.