Table Of Contents - Toshiba 14C3E1 Service Manual

CHAPTER 1 GENERAL ADJUSTMENTS
SAFETY INSTRUCTIONS ............................................................................................................................................. 3
SET-UP ADJUSTMENT ................................................................................................................................................. 4
SERVICE MODE ........................................................................................................................................................... 6
DESIGN MODE ............................................................................................................................................................. 9
ELECTRICAL ADJUSTMENTS ................................................................................................................................... 10
CIRCUIT CHECK ......................................................................................................................................................... 12
CHAPTER 2 SPECIFIC INFORMATIONS
SETTING & ADJUSTING DATA ................................................................................................................................... 13
NAMES AND FUNCTIONS OF CONTROLS .............................................................................................................. 14
PROGRAMMING CHANNEL MEMORY ...................................................................................................................... 15
PROCEDURES TO SET HOTEL MODE ..................................................................................................................... 17
CHASSIS AND CABINET REPLACEMENT PARTS LIST ........................................................................................... 18
PC BOARDS BOTTOM VIEW ...................................................................................................................................... 24
TERMINAL VIEW OF TRANSISTORS ........................................................................................................................ 26
CIRCUIT BLOCK DIAGRAM ....................................................................................................................................... 29
SPECIFICATIONS .................................................................................................................................................... END
APPENDIX:
CIRCUIT DIAGRAM
(*1)
The EC is actively promoting the WEEE & RoHS Directives that define standards for recycling and reuse of Waste
Electrical and Electronic Equipment and for the Restriction of the use of certain Hazardous Substances. From July 1,
2006, the RoHS Directive will prohibit any marketing of new products containing the restricted substances.
Increasing attention is given to issues related to the global environmental. Toshiba Corporation recognizes
environmental protection as a key management tasks, and is doing its utmost to enhance and improve the quality and
scope of its environmental activities. In line with this, Toshiba proactively promotes Green Procurement, and seeks to
purchase and use products, parts and materials that have low environmental impacts.
Green procurement of parts is not only confined to manufacture. The same green parts used in manufacture must also
be used as replacement parts.
(*2)
This product is manufactured using lead-free solder as a part of a movement within the consumer products industry at
large to be environmentally responsible. Lead-free solder must be used in the servicing and repair of this product.
DO NOT USE LEAD BASED SOLDER TO REPAIR THIS PRODUCT!
The melting temperature of lead-free solder is higher than that of leaded solder by 86°F to 104°F (30°C to 40°C). Use of
a soldering iron designed for lead-based solders to repair product made with lead-free solder may result in damage to
the component and or PCB being soldered. Great care should be made to ensure high-quality soldering when servicing
this product -especially when soldering large components, through-hole pins, and on PCBs - as the level of heat
required to melt lead-free solder is high.

TABLE OF CONTENTS

GREEN PRODUCT PROCUREMENT
LEAD-FREE SOLDER
WARNING
This product is manufactured using lead free solder.
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