Miscellaneous; How To Replace The Llp (Leadless Leadframe Package) Ic; Preparation; Caution - Panasonic KX-TGE240B Service Manual

13 Miscellaneous

13.1. How to Replace the LLP (Leadless Leadframe Package) IC

Note:
This description only applies to the model with Shield case.

13.1.1. Preparation

• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 F ± 20 F (370 C ± 10 C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608 F ± 68 F (320 C ± 20 C)

13.1.2. Caution

• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.

13.1.3. How to Remove the IC

1. Heat the IC with a hot air desoldering tool through the P.C.Board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely.
Note:
• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the
P.C.Board.
3. After removing the IC, clean the P.C.Board of residual solder.
P.C.Board
IC
P.C.Board
KX-TGE240/242/243/244/245/260/262/263/264/270/272/273/274/275/TG454/TG465/TGEA20/TGA20
IC
Hot Air Desoldering Tool
Tweezers, etc.
P.C.Board
Hot Air Desoldering Tools
65