Electrical Parts List - Sony HCD-FX100W Service Manual

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NOTE:
• Due to standardization, replacements in the
parts list may be different from the parts
specified in the diagrams or the components
used on the set.
• -XX and -X mean standardized parts, so they
may have some difference from the original
one.
• Items marked "*" are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
• CAPACITORS
uF: µF
• COILS
uH: µH
Ref. No. Part No.
A-1111-094-A DMB10 BOARD, COMPLETE
C101 1-162-970-11 CERAMIC CHIP
C102 1-162-970-11 CERAMIC CHIP
C105 1-126-205-11 ELECT CHIP
C106 1-162-970-11 CERAMIC CHIP
C108 1-162-964-11 CERAMIC CHIP
C109 1-162-964-11 CERAMIC CHIP
C112 1-126-205-11 ELECT CHIP
C113 1-162-970-11 CERAMIC CHIP
C114 1-107-826-11 CERAMIC CHIP
C115 1-107-826-11 CERAMIC CHIP
TE
L 13942296513
C116 1-107-826-11 CERAMIC CHIP
C117 1-124-779-00 ELECT CHIP
C118 1-124-779-00 ELECT CHIP
C119 1-124-779-00 ELECT CHIP
C120 1-165-908-11 CERAMIC CHIP
C121 1-165-908-11 CERAMIC CHIP
C122 1-165-908-11 CERAMIC CHIP
C123 1-165-908-11 CERAMIC CHIP
C124 1-165-908-11 CERAMIC CHIP
C125 1-107-826-11 CERAMIC CHIP
C126 1-107-826-11 CERAMIC CHIP
C127 1-162-970-11 CERAMIC CHIP
C128 1-162-965-11 CERAMIC CHIP
C129 1-124-779-00 ELECT CHIP
C130 1-107-826-11 CERAMIC CHIP
C131 1-125-838-11 CERAMIC CHIP
C132 1-107-826-11 CERAMIC CHIP
C133 1-107-826-11 CERAMIC CHIP
C135 1-164-677-11 CERAMIC CHIP
C136 1-162-970-11 CERAMIC CHIP
C137 1-107-826-11 CERAMIC CHIP
C138 1-162-964-11 CERAMIC CHIP
C139 1-162-919-11 CERAMIC CHIP
C140 1-107-826-11 CERAMIC CHIP
C141 1-107-826-11 CERAMIC CHIP
www
C142 1-107-826-11 CERAMIC CHIP
C143 1-107-826-11 CERAMIC CHIP
C144 1-162-970-11 CERAMIC CHIP
C145 1-165-908-11 CERAMIC CHIP
.
C146 1-107-826-11 CERAMIC CHIP
http://www.xiaoyu163.com

ELECTRICAL PARTS LIST

• RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
• SEMICONDUCTORS
In each case, u: µ, for example:
uA. . : µA. .,
uPB. . : µPB. .,
uPD. . : µPD. .
• Abbreviation
CND: Canadian model.
Description
**********************
< CAPACITOR >
0.01uF 10%
0.01uF 10%
47uF 20%
0.01uF 10%
0.001uF 10%
0.001uF 10%
47uF 20%
0.01uF 10%
0.1uF 10%
0.1uF 10%
0.1uF 10%
10uF 20%
10uF 20%
10uF 20%
1uF 10%
1uF 10%
1uF 10%
1uF 10%
1uF 10%
0.1uF 10%
0.1uF 10%
0.01uF 10%
0.0015uF 10%
10uF 20%
0.1uF 10%
2.2uF 10%
0.1uF 10%
0.1uF 10%
0.033uF 10%
0.01uF 10%
0.1uF 10%
0.001uF 10%
22PF 5%
0.1uF 10%
0.1uF 10%
0.1uF 10%
0.1uF 10%
x ao u163
y
0.01uF 10%
1uF 10%
i
0.1uF 10%
http://www.xiaoyu163.com
SECTION 9
2 9
8
uPA. . : µPA. .,
uPC. . : µPC. .,
Remark Ref. No. Part No.
C147 1-165-176-11 CERAMIC CHIP
C148 1-165-176-11 CERAMIC CHIP
C149 1-107-826-11 CERAMIC CHIP
C150 1-124-779-00 ELECT CHIP
C151 1-115-416-11 CERAMIC CHIP
25V
25V C152 1-162-916-11 CERAMIC CHIP
6.3V C153 1-162-916-11 CERAMIC CHIP
25V C154 1-107-826-11 CERAMIC CHIP
50V C155 1-162-970-11 CERAMIC CHIP
C156 1-162-970-11 CERAMIC CHIP
50V
6.3V C158 1-162-970-11 CERAMIC CHIP
25V C159 1-162-970-11 CERAMIC CHIP
16V C160 1-162-970-11 CERAMIC CHIP
16V C161 1-162-970-11 CERAMIC CHIP
Q Q
3 6 7 1 3 1 5
C162 1-162-970-11 CERAMIC CHIP
16V
16V C163 1-162-970-11 CERAMIC CHIP
16V C164 1-162-970-11 CERAMIC CHIP
16V C167 1-162-970-11 CERAMIC CHIP
10V C170 1-162-970-11 CERAMIC CHIP
C171 1-162-970-11 CERAMIC CHIP
10V
10V C172 1-162-970-11 CERAMIC CHIP
10V C173 1-162-970-11 CERAMIC CHIP
10V C174 1-162-970-11 CERAMIC CHIP
16V C175 1-162-970-11 CERAMIC CHIP
C176 1-162-970-11 CERAMIC CHIP
16V
25V C177 1-126-205-11 ELECT CHIP
50V C178 1-126-208-21 ELECT CHIP
16V C179 1-107-826-11 CERAMIC CHIP
16V C180 1-107-826-11 CERAMIC CHIP
C181 1-107-826-11 CERAMIC CHIP
6.3V
16V C182 1-127-715-91 CERAMIC CHIP
16V C184 1-162-970-11 CERAMIC CHIP
16V C187 1-126-208-21 ELECT CHIP
25V C188 1-127-715-91 CERAMIC CHIP
C189 1-128-934-91 CERAMIC CHIP
16V
50V C190 1-126-205-11 ELECT CHIP
50V C191 1-107-826-11 CERAMIC CHIP
16V C192 1-162-970-11 CERAMIC CHIP
16V C193 1-127-715-91 CERAMIC CHIP
C195 1-127-715-91 CERAMIC CHIP
16V
16V C196 1-162-968-11 CERAMIC CHIP
co
25V C203 1-162-970-11 CERAMIC CHIP
10V C205 1-164-230-11 CERAMIC CHIP
.
16V C206 1-164-230-11 CERAMIC CHIP
C208 1-162-970-11 CERAMIC CHIP
New part of EEP ROM (IC103) on the DMB10 board cannot be used. Therefore,
if the mounted DMB10 board (A-1111-094-A) is replaced, exchange new EEP
ROM (IC103) with that used before the replacement.
HCD-FX100W
9 4 2 8
When indicating parts by reference number,
please include the board name.
The components identified by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque 0
sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant le
numéro spécifié.
Description
0.047uF 10%
0.047uF 10%
0.1uF 10%
10uF 20%
0.001uF 5%
12PF 5%
12PF 5%
0.1uF 10%
0.01uF 10%
0.01uF 10%
0.01uF 10%
0.01uF 10%
0.01uF 10%
0.01uF 10%
0 5 8 2 9 9 4 2 8
0.01uF 10%
0.01uF 10%
0.01uF 10%
0.01uF 10%
0.01uF 10%
0.01uF 10%
0.01uF 10%
0.01uF 10%
0.01uF 10%
0.01uF 10%
0.01uF 10%
47uF 20%
47uF 20%
0.1uF 10%
0.1uF 10%
0.1uF 10%
0.22uF 10%
0.01uF 10%
47uF 20%
0.22uF 10%
0.33uF 20%
47uF 20%
0.1uF 10%
0.01uF 10%
0.22uF 10%
0.22uF 10%
m
0.0047uF 10%
0.01uF 10%
220PF 5%
220PF 5%
0.01uF 10%
Ver. 1.1
DMB10
9 9
Remark
16V
16V
16V
16V
25V
50V
50V
16V
25V
25V
25V
25V
25V
25V
9 9
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
25V
6.3V
4V
16V
16V
16V
16V
25V
4V
16V
10V
6.3V
16V
25V
16V
16V
50V
25V
50V
50V
25V
101