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NXP Semiconductors TDA5051A Product Data Sheet

Home automation modem
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1. General description

The TDA5051A is a modem IC, specifically dedicated to ASK transmission by means of
the home power supply network, at 600 baud or 1200 baud data rate. It operates from a
single 5 V supply.

2. Features and benefits

3. Applications

TDA5051A
Home automation modem
Rev. 5 — 13 January 2011
Full digital carrier generation and shaping
Modulation/demodulation frequency set by clock adjustment, from microcontroller or
on-chip oscillator
High clock rate of 6-bit D/A (Digital to Analog) converter for rejection of aliasing
components
Fully integrated output power stage with overload protection
Automatic Gain Control (AGC) at receiver input
8-bit A/D (Analog to Digital) converter and narrow digital filtering
Digital demodulation delivering baseband data
Easy compliance with EN50065-1 with simple coupling network
Few external components for low cost applications
SO16 plastic package
Home appliance control (air conditioning, shutters, lighting, alarms and so on)
Energy/heating control
Amplitude Shift Keying (ASK) data transmission using the home power network
Product data sheet

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  Summary of Contents for NXP Semiconductors TDA5051A

  • Page 1: General Description

    Rev. 5 — 13 January 2011 1. General description The TDA5051A is a modem IC, specifically dedicated to ASK transmission by means of the home power supply network, at 600 baud or 1200 baud data rate. It operates from a single 5 V supply.
  • Page 2: Quick Reference Data

    Ordering information Type number Package Name Description TDA5051AT SO16 plastic small outline package; 16 leads; body width 7.5 mm TDA5051A Product data sheet Conditions = 8.48 MHz Reception mode Transmission mode; = 30 Ω DATA_IN = 0; Z Power-down mode DATA_IN = LOW;...
  • Page 3: Block Diagram

    NXP Semiconductors 6. Block diagram DGND DATA_IN CLK_OUT OSC1 OSCILLATOR OSC2 DIGITAL DATA_OUT DEMODULATOR TEST1 Fig 1. Block diagram TDA5051A Product data sheet AGND modulated carrier DAC clock CONTROL LOGIC filter clock ÷ 2 DIGITAL BAND-PASS FILTER PEAK DETECT SCANTEST All information provided in this document is subject to legal disclaimers.
  • Page 4: Pinning Information

    Symbol DATA_IN DATA_OUT CLK_OUT DGND SCANTEST OSC1 OSC2 APGND TX_OUT DDAP AGND RX_IN TEST1 TDA5051A Product data sheet DATA_IN DATA_OUT CLK_OUT TDA5051AT DGND SCANTEST OSC1 OSC2 Pin description Description digital data input (active LOW) digital data output (active LOW) digital supply voltage...
  • Page 5: Functional Description

    Direct connection to the mains is done through an LC network for low-cost applications. However, an HF signal transformer could be used when power-line insulation has to be performed. TDA5051A Product data sheet Section 8.4 “Power-down at this pin, which is present even when the All information provided in this document is subject to legal disclaimers.
  • Page 6: Reception Mode

    Pin DATA_OUT remains LOW as long as a burst is received. 8.4 Power-down mode Power-down input (pin PD) is active HIGH; this means that the power consumption is minimum when pin PD is HIGH. Now, all functions are disabled, except clock generation. TDA5051A Product data sheet 15). Figure All information provided in this document is subject to legal disclaimers.
  • Page 7: Limiting Values

    DD(PAMP)(max) supply current DATA_IN and PD inputs; DATA_OUT and CLK_OUT outputs HIGH-level input voltage LOW-level input voltage HIGH-level output voltage LOW-level output voltage TDA5051A Product data sheet Limiting values Parameter Conditions supply voltage oscillator frequency storage temperature...
  • Page 8 (measured on the first ten harmonics) bandwidth of the shaped −20dB output signal (at −20 dB) on CISPR16 load with the coupling network TDA5051A Product data sheet ° ° C to +85 C; V connected to V Conditions = −1.6 mA...
  • Page 9 The value of the total transmission mode current is the sum of I Frequency range corresponding to the EN50065-1 band. However, the modem can operate at any lower oscillator frequency. The minimum value can be improved by using an external amplifier; see application diagrams TDA5051A Product data sheet °...
  • Page 10 −50 −60 Resolution bandwidth = 100 Hz; B Fig 4. Shaped signal spectrum Fig 5. AGC time constant definition (not to scale) TDA5051A Product data sheet 132.5 kHz 117.5 = 3000 Hz (2 × 1500 Hz). −20dB RXIN modulated sine wave 122 dBμV amplitude +30 dB −6 dB...
  • Page 11: Timing

    For parameter description, see Fig 7. Typical configuration for on-chip clock circuit Table 6. Oscillator frequency f 6.080 MHz to 9.504 MHz Table 7. Symbol CLKOUT W(DI)(min) TDA5051A Product data sheet CLK_OUT XTAL MICROCONTROLLER Table CLK_OUT CLK_OUT MICROCONTROLLER DGND Table Clock oscillator parameters...
  • Page 12 Fig 8. Relationship between DATA_IN and TX_OUT (see Table 8. X = don’t care. Fig 9. Pulse shape characteristics TDA5051A Product data sheet Calculation of parameters depending on the clock frequency Parameter minimum burst time of V signal t O(DC)
  • Page 13: Timing Diagrams

    Fig 10. Timing diagram during power-up in Transmission mode CLK_OUT RX_IN DATA_OUT Fig 11. Timing diagram during power-up in Reception mode DATA_IN TX_OUT Fig 12. Power-down sequence in Transmission mode TDA5051A Product data sheet 90 % V not defined HIGH d(pu)(TX) 90 % V not defined...
  • Page 14 Fig 13. Power-down sequence in Reception mode RX_IN DATA_OUT DD(RX) DD(PD) Fig 14. Power saving by dynamic control of power-down TDA5051A Product data sheet d(dem)(su) DATA_OUT delayed by PD active(min) All information provided in this document is subject to legal disclaimers.
  • Page 15: Application Information

    NXP Semiconductors 12. Application information +5 V Fig 15. Application diagram without power line insulation TDA5051A Product data sheet 250 V (AC) T 630 mA +5 V 78L05 470 μF (16 V) 100 μF 47 nF (16 V) DATA_IN DATA_OUT...
  • Page 16 50 dB at the sampling frequency ( 95 kHz to 148.5 kHz band. Fig 16. Gain (a) and input impedance (b) of the coupling network TDA5051A Product data sheet = 115.2 kHz; L = 47 μH; C = 47 nF.
  • Page 17 L = 47 μH; C = 47 nF. Fig 17. Output voltage as a function of line impedance +5 V Fig 18. Application diagram with power line insulation TDA5051A Product data sheet (dBμV) 250 V (AC) T 630 mA...
  • Page 18 NXP Semiconductors +5 V CONTROLLER Fig 19. Application diagram without power line insulation, with improved sensitivity (68 dBμV typ.) TDA5051A Product data sheet 250 V (AC) T 630 mA +5 V 78L05 470 μF (16 V) 100 μF 47 nF...
  • Page 19 NXP Semiconductors +5 V MICRO- CONTROLLER Fig 20. Application diagram with power line insulation, with improved sensitivity (68 dBμV typ.) TDA5051A Product data sheet 250 V (AC) T 630 mA +5 V 78L05 470 μF (16 V) 100 μF 47 nF...
  • Page 20: Test Information

    (2) DATA_IN + LOW for measuring total harmonic distortion (see (3) Tuned for f (4) The CISPR16 network provides a −6 dB attenuation. Fig 22. Test set-up for measuring THD and bandwidth of the TX_OUT signal TDA5051A Product data sheet DATA_IN pulse...
  • Page 21 NXP Semiconductors DATA_IN (1) See Fig 23. Test set-up for measuring Bit Error Rate (BER) TDA5051A Product data sheet TX_OUT TDA5051A AGND, DGND, APGND OSC1 OSC2 XTAL = 8.48 MHz OSC1 OSC2 RX_IN TDA5051A (to be tested) AGND, DGND, APGND...
  • Page 22: Package Outline

    0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT162-1 075E03 Fig 24. Package outline SOT162-1 (SO16) TDA5051A Product data sheet scale 0.49 0.32 10.5 10.65 1.27 0.36 0.23...
  • Page 23: Handling Information

    Inspection and repair • Lead-free soldering versus SnPb soldering 16.3 Wave soldering Key characteristics in wave soldering are: TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 TDA5051A Home automation modem ©...
  • Page 24: Reflow Soldering

    Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see TDA5051A Product data sheet SnPb eutectic process (from J-STD-020C) Package reflow temperature (°C) Volume (mm <...
  • Page 25: Abbreviations

    For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17. Abbreviations Table 11. Acronym CMOS TDA5051A Product data sheet maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature...
  • Page 26: Revision History

    NXP Semiconductors 18. Revision history Table 12. Revision history Document ID Release date TDA5051A v.5 20110113 • Modifications: Table 1 “Quick reference – Min value changed from −10 °C to −50 °C – Max value changed from +80 °C to +100 °C •...
  • Page 27: Legal Information

    Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or TDA5051A Product data sheet Definition This document contains data from the objective specification for product development.
  • Page 28: Trademarks

    20. Contact information For more information, please visit: For sales office addresses, please send an email to: TDA5051A Product data sheet product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’...
  • Page 29: Table Of Contents

    ‘Legal information’. © NXP B.V. 2011. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All rights reserved. Date of release: 13 January 2011 Document identifier: TDA5051A...