Sony SRS-NWM10 Service Manual page 6

SRS-NWM10
QQ
3 7 63 1515 0
• Note for Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Lead Layouts
Lead layout of conventional IC CSP (chip size package)
• IC Block Diagrams
– AMPLIFIER Board –
TE
L 13942296513
IC101, 201 TPA2010D1YZFR
INTERNAL
OSCILLATOR
+
H-
PWM
BRIDGE
–
BIAS
CIRCUITRY
1 2 3 4
IC302 PST3519UR
GND 1
VREF
www
+
–
.
VDD 2
6
http://www.xiaoyu163.com
SECTION 3
DIAGRAM
surface
5 6 7 8 9
4 OUT
x ao u163
y
i
3 CD
http://www.xiaoyu163.com
2 9
8
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 /
4
specified.
• C : panel designation.
• A : B+ Line.
• Power voltage is dc 4.5V and fed with regulated dc power
supply from battery terminal.
• Voltages are dc with respect to ground under no-signal
conditions.
no mark : POWER ON
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Signal path.
F
: AUDIO
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
– POWER Board –
Q Q
3 6 7 1 3 1 5
IC901 S-80943CNMC-G9DT2G
OUT 1
VDD 2
–
+ CIRCUIT
VREF
VSS 3
co
.
9 4 2 8
W or less unless otherwise
0 5 8 2 9 9 4 2 8
5 CD
DELAY
4 NC
m
9 9
9 9