C.
Package Dimensions
For package dimensions, dimensions described in Hitachi Semiconductor Packages have priority.
108
109
144
1
*0.22 ± 0.05
0.20 ± 0.04
*Dimension including the plating thickness
Base material dimension
Rev. 1.0, 09/01, page 904 of 904
22.0 ± 0.3
20
73
72
37
36
0.08
M
0.10
Figure C.1 Package Dimensions (FP-144H)
1.25
Hitachi Code
JEDEC
JEITA
Mass (reference value)
As of July, 2001
Unit: mm
1.0
0˚ – 8˚
0.5 ± 0.1
FP-144H
—
Conforms
1.4 g