1. SERVICE PRECAUTIONS
1.1 NOTES ON SOLDERING
• For environmental protection, lead-free solder is used on the printed circuit boards mounted in this unit.
Be sure to use lead-free solder and a soldering iron that can meet specifications for use with lead-free solders for repairs
accompanied by reworking of soldering.
• Compared with conventional eutectic solders, lead-free solders have higher melting points, by approximately 40 ºC.
Therefore, for lead-free soldering, the tip temperature of a soldering iron must be set to around 373 ºC in general, although
the temperature depends on the heat capacity of the PC board on which reworking is required and the weight of the tip of
the soldering iron.
Do NOT use a soldering iron whose tip temperature cannot be controlled.
Compared with eutectic solders, lead-free solders have higher bond strengths but slower wetting times and higher melting
temperatures (hard to melt/easy to harden).
The following lead-free solders are available as service parts:
• Parts numbers of lead-free solder:
GYP1006 1.0 in dia.
GYP1007 0.6 in dia.
GYP1008 0.3 in dia.
1.2 NOTES SPECIFIC TO THIS PRODUCT
• In same cases, there are silicon sheets on back side of POWER SUPPLY Unit, X DRIVE Assy and Y DRIVE Assy due to
heat release of these boards to panel chassis. When replacing these boards, check backside of them and if silicon sheets
are on there, surely put these silicon sheets again to the original location of them.