Sony MZ-NH1 Service Manual page 24

MZ-NH1
• Note For Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
f : internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Main board is multi-layer printed board.
However, the patterns of intermediate-layer have not been in-
cluded in this diagrams.
• Lead Layouts
surface
Lead layout of conventional IC CSP (chip size package)
MZ-NH1
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
•
f : internal component.
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• Total current is measured with MD installed.
• Power voltage is dc 6 V and fed with regulated dc power
supply from CL451 (DC IN 6V) and CL460 (VBUS GND).
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAYBACK
( ) : PLAYBACK (servo on)
[ ] : PLAYBACK (servo stop)
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
E : PLAYBACK
j : REC
J : OPTICAL IN
F : LINE IN
d : USB input from PC
G : USB output to PC
N : MIC IN
• Abbreviation
E18 : 100V - 240V AC area in E model
JE : Tourist model
• Waveforms
IC701 1 (VI1), 2 (WI1),
1 7
th (UI1) (Servo on)
2.2 Vp-p
7.6 ms
1 V/DIV, 5 ms/DIV
IC701 tg (PWM1) (Servo on)
2 8
2.5 Vp-p
11.3 µ s
1 V/DIV, 5 µ s/DIV
IC501 1 (IX) (Servo on)
3 9
190 mVp-p
50 mV/DIV, 200 ns/DIV
501 8 (RFO) (Servo on)
4 q;
1.2 Vp-p
500 mV/DIV, 200 ns/DIV
IC501 ra (FE) (Servo on)
5 qa
Approx.
60 mVp-p
20 mV/DIV, 1 µ s/DIV
IC501 rs (TE) (Servo on)
6 qs
Approx.
350 mVp-p
100 mV/DIV, 1 µ s/DIV
24 24
IC501 wh (CLK) (Servo on) IC801 <czz (OSCO)
qd
3 Vp-p
88 ns
44 ns
1 V/DIV, 50 ns/DIV 1 V/DIV, 20 ns/DIV
IC901 yd (CLK)
2.7 Vp-p
5.7 µ s
1 V/DIV, 5 µ s/DIV
IC301 8 (BCLK)
2.6 Vp-p
354 ns
1 V/DIV, 200 ns/DIV
IC301 9 (MCLK)
2.9 Vp-p
88 ns
1 V/DIV, 50 ns/DIV
IC301 q; (LRCK)
2.6 Vp-p
22.8 µ s
1 V/DIV, 10 µ s/DIV
IC871 8 (OSCOUT)
960 mVp-p
30.8 µ s
500 mV/DIV, 50 µ s/DIV
2.7 Vp-p