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NXP Semiconductors CBT3126 Product Data Sheet

Quad fet bus switch
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1. General description

2. Features

3. Ordering information

Table 1.
Ordering information
Type number
Temperature range
CBT3126D
40 C to +85 C
CBT3126DB
40 C to +85 C
CBT3126
Quad FET bus switch
Rev. 02 — 23 October 2008
The CBT3126 is a quadruple FET bus switch features independent line switches. Each
switch is disabled when the associated Output Enable (OE) input is LOW.
The CBT3126 is characterized for operation from 40 C to +85 C.
I
Standard '126-type pinout
I
Multiple package options
I
5
switch connection between two ports
I
TTL-compatible input levels
I
Minimal propagation delay through the switch
I
Latch-up protection exceeds 500 mA per JEDEC standard JESD78 class II level A
I
ESD protection:
N
HBM JESD22-A114E exceeds 2000 V
N
MM JESD22-A115-A exceeds 200 V
N
CDM JESD22-C101C exceeds 1000 V
I
Specified from 40 C to +85 C
Package
Name
SO14
SSOP14
Description
plastic small outline package; 14 leads;
body width 3.9 mm
plastic shrink small outline package; 14 leads;
body width 5.3 mm
Product data sheet
Version
SOT108-1
SOT337-1

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  Summary of Contents for NXP Semiconductors CBT3126

  • Page 1: General Description

    Rev. 02 — 23 October 2008 1. General description The CBT3126 is a quadruple FET bus switch features independent line switches. Each switch is disabled when the associated Output Enable (OE) input is LOW. The CBT3126 is characterized for operation from 40 C to +85 C.
  • Page 2: Functional Diagram

    NXP Semiconductors Table 1. Ordering information Type number Temperature range CBT3126DS 40 C to +85 C CBT3126PW 40 C to +85 C Also known as QSOP16. 4. Functional diagram Fig 1. Logic symbol CBT3126_2 Product data sheet …continued Package Name...
  • Page 3: Pinning Information

    NXP Semiconductors 5. Pinning information 5.1 Pinning CBT3126 Fig 3. Pin configuration SOT108-1 (SO14), SOT337-4 (SSOP14) and SOT402-1 (TSSOP14) 5.2 Pin description Table 2. Pin description Symbol Pin SOT108-1 SOT337-4 and SOT402-1 1OE to 4OE 1, 4, 10, 13 1A to 4A,...
  • Page 4: Limiting Values

    NXP Semiconductors 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter supply voltage input voltage supply current input clamping current storage temperature total power dissipation The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
  • Page 5: Dynamic Characteristics

    This is the increase in supply current for each input that is at the specified TTL voltage level rather than V Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. ON resistance is determined by the lowest voltage of the two (A or B) terminals.
  • Page 6 NXP Semiconductors nOE input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points are given in and V are typical voltage output levels that occur with the output load. Fig 6. Enable and disable times Table 8. Measurement points Input Output 1.5 V...
  • Page 7: Test Information

    NXP Semiconductors 12. Test information Test data is given in Table Definitions for test circuit: = Load resistance. = Load capacitance including jig and probe capacitance. = Termination resistance should be equal to the output impedance Z = External voltage for measuring switching times.
  • Page 8: Package Outline

    NXP Semiconductors 13. Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm pin 1 index DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT max. 0.25 1.45 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069...
  • Page 9 NXP Semiconductors SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm pin 1 index DIMENSIONS (mm are the original dimensions) UNIT max. 0.21 1.80 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
  • Page 10 NXP Semiconductors SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm DIMENSIONS (mm are the original dimensions) UNIT max. 0.25 1.55 1.73 0.25 0.10 1.40 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
  • Page 11 NXP Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm pin 1 index DIMENSIONS (mm are the original dimensions) UNIT max. 0.15 0.95 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
  • Page 12 NXP Semiconductors DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 x 3.5 x 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) UNIT max.
  • Page 13: Abbreviations

    NXP Semiconductors 14. Abbreviations Table 10. Abbreviations Acronym Description Charged Device Model ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic 15. Revision history Table 11. Revision history Document ID Release date CBT3126_2 20081023 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors.
  • Page 14: Legal Information

    For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
  • Page 15: Table Of Contents

    NXP Semiconductors 18. Contents General description ..... . 1 Features ....... 1 Ordering information .