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HCD-HDX500/HDX501W
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3 7 6 3 1 5 1 5 0
T E
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1 3 9 4 2 2 9 6 5 1 3
w w w
HCD-HDX500/HDX501W
6-21. PRINTED WIRING BOARD – DSP Board –
• Semiconductor
Location
Ref. No. Location
IC1
B-5
IC002
B-3
IC703
A-5
IC782
B-4
A
IC783
B-4
IC785
B-4
IC786
B-4
IC787
B-4
Q781
A-4
B
C
D
E
x
a o
y
.
i
http://www.xiaoyu163.com
8
• See page 34 for Circuit Boards Location.
1
2
DSP BOARD
(COMPONENT SIDE)
C10
C9
X1
R36
C24
C34
C30
R023
R35
144
R38
C40
1
R41
R43
C45
R45
C49
IC002
C59
C62
C63
36
37
C79
C78
C75
Q
Q
3
7
6
3
DSP BOARD
(CONDUCTOR SIDE)
C85
C080
C67
C77
C76
C70
C57
R50
R49
C23
C33
C19
C35
R17
C25
R16
R30
R13
R18
R20
R29
u 1 6 3
.
50
50
http://www.xiaoyu163.com
2
4
9
9
: Uses unleaded solder.
3
4
R28
R27
R26
Q781
C36
C28
C26
C90
C
IC786
B
E
109
8 5
R781
8 5
C39
5 4
C782
R004
108
IC783
C42
1
3
1 4
1 4
C43
IC782
R006
8 5
R784
R009
IC785
C46
R90 R91
C785
R47
1 4
R048
C784
8
R52
1
R54
IC787
C61
4
5
R60
R53
R785
73
R015
C64
72
R008
29
1
C73
C71
CN001
30
2
1
5
1
5
0
8
9
2
MAIN BOARD
A
CN703
(Page 48)
R001
R66
R67
R65
R012
R59
C74
C66
R58
R014
R005
R013
C55
R51
C52
R003
R002
R782
C32
C29
C50
R92
R24
R21
R32
R25
m
c o
2
8
9
9
5
R742
1
5
C788
IC703
R744
R745
1
R4
IC1
5
R14
R788
C787
R15
C11
R783
L1
11
4
9
8
2
9
9
1-872-122-
(11)
(CHASSIS)
R007
C6
C7
C2
C732
C731
C728
11
C729
(11)
1-872-122-

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