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Which is the sum of all output currents on I/O ports associated with VDDX and VDDR.
Num
C
1
T
Thermal Resistance LQFP48, single layer PCB
Thermal Resistance LQFP48, double sided PCB with
2
T
2 internal planes
3
T
Junction to Board LQFP48
4
T
Junction to Case LQFP48
5
T
Junction to Package Top LQFP48
6
T
Thermal Resistance LQFP52, single sided PCB
Thermal Resistance LQFP52, double sided PCB with
7
T
2 internal planes
8
T
Junction to Board LQFP52
9
T
Junction to Case LQFP52
10
T
Junction to Package Top LQFP52
11
T
Thermal Resistance QFP 80, single sided PCB
Thermal Resistance QFP 80, double sided PCB with
12
T
2 internal planes
13
T
Junction to Board QFP80
14
T
Junction to Case QFP80
15
T
Junction to Package Top QFP80
NOTES:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-2
3. PC Board according to EIA/JEDEC Standard 51-7
A.1.9 I/O Characteristics
This section describes the characteristics of all I/O pins. All parameters are not always applicable, e.g. not
all pins feature pull up/down resistances.
Table A-5 Thermal Package Characteristics
Rating
3
Device User Guide — 9S12C128DGV1/D V01.05
Symbol
Min
2
-
JA
-
JA
JB
JC
JT
-
JA
-
JA
JB
JC
JT
-
JA
-
JA
JB
JC
JT
1
Typ
Max
Unit
o
-
69
o
-
53
o
30
o
20
o
4
o
-
65
o
-
49
o
31
o
17
o
3
o
-
52
o
-
42
o
28
o
18
o
4
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
89
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