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20.5
MAPBGA Package Dimensions
Figure 20-4 illustrates the MAPBGA 13 mm
pads. The device designator for the MAPBGA package is VF.
X
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
E
Y
12
11 10
9
8
VIEW M-M
3
b
144X
0.25 Z X Y
0.1
Z
Figure 20-4. MC68VZ328 MAPBGA Mechanical Drawing
×
13 mm package, which has 1 mm spacing between the
D
DETAIL K
e
11X
METALIZED MARK
FOR PIN 1 IDENTIFICATION
S
IN THIS AREA
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
CASE 1242A-03
ISSUE B
Mechanical Data and Ordering Information
MAPBGA Package Dimensions
M
NOTES:
1.
2.
3.
4.
5.
0.2
M
A2
A
A1
ROTATED 90 CLOCKWISE
DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
MILLIMETERS
DIM
MIN
MAX
A
---
1.60
A1
0.27
0.47
A2
1.16 REF
b
0.40
0.60
D
13.00 BSC
E
13.00 BSC
e
1.00 BSC
S
0.50 BSC
5
0.2 Z
0.12 Z
4
Z
DETAIL K
20-5
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