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Q Q
3 7 6 3 1 5 1 5 0
• Note for Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: internal component.
f
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
• Indication of transistor
C
Q
These are omitted.
B
E
• DSP board is multi-layer printed board.
However, the patterns of intermediate layers have not been
included in thsi diagrams.
T E
L
1 3 9 4 2 2 9 6 5 1 3
• Circuit Boards Location
POWER board
SW board
PANEL board
w w w
TA-F501ES
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
W or less unless otherwise
4
specified.
•
: internal component.
f
• 5 : fusible resistor.
• 2 : nonflammable resistor.
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
(When measuring the circuit with the HP board removed,
connect the ground of the HP board (EB1001) to the chas-
sis ground.)
no mark : TUNER IN
: Impossible to measure
∗
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO (ANALOG)
J
: AUDIO (DIGITAL)
E
: MIC
MIC board
DSP board
MAIN board
HP board
x
a o
y
.
i
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• Waveforms
– MAIN Board –
IC2024 q; (LRCK)
1
20.8 µ s
1 V/DIV, 10 µ s/DIV
IC2024 qa (BCK)
2
325 ns
1 V/DIV, 100 ns/DIV
IC2024 qg (SCKI)
3
Q
Q
3
7
6
3
40.6 ns
1 V/DIV, 20 ns/DIV
IC2004 1 (XCLM)
4
81.4 ns
1 V/DIV, 50 ns/DIV
IC2004 2 (BICK)
5
325 ns
1 V/DIV, 100 ns/DIV
IC2004 4 (LRCK)
6
u 1 6 3
20.8 µ s
.
1 V/DIV, 10 µ s/DIV
19
19
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2
4
9
9
8
IC2006 qh (RMCK)
7
3.3 Vp-p
3.3 Vp-p
81.4 ns
1 V/DIV, 50 ns/DIV
IC2006 qj (RBCK)
8
3.3 Vp-p
3.3 Vp-p
325 ns
1 V/DIV, 100 ns/DIV
IC2006 w; (RLRCK)
9
3.3 Vp-p
3.6 Vp-p
20.8 µ s
1
5
1
5
0
8
9
2
4
1 V/DIV, 10 µ s/DIV
IC2006 wj (XMCK)
0
5 Vp-p
3.3 Vp-p
40.7 ns
1 V/DIV, 20 ns/DIV
IC2006 wk (XOUT)
qa
3.3 Vp-p
3.6 Vp-p
24.576 MHz
1 V/DIV, 20 ns/DIV
IC2054 <zvc (X-OUT)
qs
m
c o
3.3 Vp-p
3.3 Vp-p
12.5 MHz
1 V/DIV, 50 ns/DIV
TA-F501ES
2
9
9
IC1412 wl (LRCK)
qd
3.3 Vp-p
20.8 µ s
1 V/DIV, 10 µ s/DIV
IC1412 e; (BCK)
qf
3.3 Vp-p
325 ns
1 V/DIV, 100 ns/DIV
IC1412 eh (XFSIIN)
qg
4.3 Vp-p
9
8
81.4 ns
2
9
9
1 V/DIV, 50 ns/DIV
IC1412 rk (XFSOIN)
qh
4.3 Vp-p
49.152 MHz
500 mV/DIV, 10 ns/DIV
IC1800 wd (X1)
qj
3.3 Vp-p
12.5 MHz
1 V/DIV, 50 ns/DIV
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