Table of Contents
Advertisement
The circuit boards used in these models have been processed using
Lead Free Solder. The boards are identified by the LF logo located
close to the board designation e.g. H1 etc [ see example ]. The
servicing of these boards requires special precautions to be taken as
outlined below.
It is strongly recommended to use Lead Free Solder material in order to guarantee optimal quality of new solder joints.
Lead Free Solder is available under the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade.
This requires soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
KDL-32EX421/32EX423/32EX520/32EX521/32EX523/40EX520/40EX521/40EX523/46EX520/46EX521/46EX523
KDL-32EX421/32EX423/32EX520/32EX521/32EX523/40EX520/40EX521/40EX523/46EX520/46EX521/46EX523
P
a
t r
n
u
m
b
r e
D
a i
m
t e
r e
7
6 -
4
0
0 -
0
5
1 -
9
0
3 .
m
m
7
6 -
4
0
0 -
0
5
2 -
0
0
4 .
m
m
7
6 -
4
0
0 -
0
5
2 -
1
0
5 .
m
m
7
6 -
4
0
0 -
0
5
2 -
2
0
6 .
m
m
7
6 -
4
0
0 -
0
5
2 -
3
0
8 .
m
m
7
6 -
4
0
0 -
0
5
2 -
4
1
0 .
m
m
7
6 -
4
0
0 -
0
5
2 -
5
1
2 .
m
m
7
6 -
4
0
0 -
0
5
2 -
6
1
6 .
m
m
example
R
e
m
a
k r
s
0
2 .
5
K
g
0
5 .
0
K
g
0
5 .
0
K
g
0
2 .
5
K
g
1
0 .
0
K
g
1
0 .
0
K
g
1
0 .
0
K
g
1
0 .
0
K
g
4
Hide quick links:
Advertisement
Table of Contents
