Hardware Specifications and Configurations
Processor
Item
CPU type*
Chipset
Item
Core logic
Features
CPU Package
CPU Core Voltage
Chapter 1
•
Intel® Core2™ Duo processor
•
Intel® Core™2 Quad processor
•
Pentium® dual-core Processor
*Dependent on model shipped.
Ibex Peak package H57
•
FCBGA package
•
Package size: 27mm x 27mm
•
Ball Count: 951
•
Ball pitch: 0.7mm
•
PCI Express* Base Specification, Revision 2.0 support for up to eight ports.
•
PCI Local Bus Specification, Revision 2.3 support for 33 MHz PCI operations
(supports up to four Req/Gnt pairs).
•
ACPI Power Management Logic Support, Revision 3.0b
•
Enhanced DMA controller, interrupt controller, and timer functions
•
Integrated Serial ATA host controllers with independent DMA operation on up to
six ports.
•
FIS-based Port Multiplier support on SATA Ports 4 and 5 in AHCI/RAID mode.
•
USB host interface with support for up to fourteen USB ports; two EHCI high-
speed USB 2.0 Host controllers, 2 rate matching hubs, seven UHCI host
controllers; o Integrated 10/100/1000 Gigabit Ethernet MAC with System
Defense
•
System Management Bus (SMBus) Specification, Version 2.0 with additional
support for I2C devices
•
Supports Intel® High Definition Audio
•
Supports Intel® Matrix Storage Technology
•
Supports Intel® Active Management Technology
•
Supports Intel® Virtualization Technology for Directed I/O
•
Supports Intel® Trusted Execution Technology
•
Dual Channel NAND Interface supporting 1.8V ONFi* 2.0 compliant NAND
•
Supports buffered mode generating extra clocks from CK505 timer.
•
•
Low Pin Count (LPC) interface
•
Firmware Hub (FWH) interface support
•
Serial Peripheral Interface (SPI) support
•
Intel® Quiet System Technology (Desktop only)
•
Intel® Anti-Theft Technology
•
Integrated TPM 1.2
•
JTAG Boundary Scan support
•
LGA1156
•
95W
Specification
Specification
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