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Sony DP-IF5000 Service Manual

Digital surround processor
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SERVICE MANUAL
Ver 1.1 1999. 02
•
Manufactured under license from Dolby Laboratories Licensing
Corporation.
DOLBY, the double-D symbol a , "PRO LOGIC",
"Dolby Digital (AC-3)", and "VIRTUAL DOLBY DIGITAL" are
trademarks of Dolby Laboratories Licensing Corporation.
•
DP-IF5000 is the component model block one in
MDR-DS5000.
COMPONENT MODEL NAME FOR MDR-DS5000
DIGITAL SURROUND PROCESSOR
CORDLESS STEREO HEADPHONES
MICROFILM
DP-IF5000
DP-IF5000
MDR-IF5000
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
DIGITAL SURROUND PROCESSOR
– 1 –
Canadian Model
AEP Model
SPECIFICATIONS
Modulation System
Frequency modulation
Carrier wave frequency Right channel 2.8 MHz
Left channel 2.3 MHz
Transmission distance Approx. 10 m
Frequency response
20 – 20,000 Hz
Distortion rate
1% or less (1 kHz)
Audio inputs
Optical input
(square-type) × 1
Analog input (pin jack
right/left) × 1
Power requirements
DC 9 V (from the
supplied AC power
adapter)
Approx. 85 × 190 × 180
Dimensions (w/h/d)
mm
Mass
Approx. 1.0 kg
(1000 g)
Design and specifications are subject to
change without notice.
US Model
UK Model
E Model

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Summary of Contents for Sony DP-IF5000

  • Page 1 Left channel 2.3 MHz trademarks of Dolby Laboratories Licensing Corporation. Transmission distance Approx. 10 m Frequency response 20 – 20,000 Hz • DP-IF5000 is the component model block one in Distortion rate 1% or less (1 kHz) MDR-DS5000. Audio inputs Optical input (square-type) ×...

  • Page 2: Table Of Contents

    TABLE OF CONTENTS 1. GENERAL Listening to the Sound of a Connected Component ....3 2. DISASSEMBLY 2-1. Cover Assy ................5 2-2. Panel Assy, Front ..............5 2-3. Panel Assy, Sub ..............6 2-4. TX Board ................6 3. SERVICE MODE 3-1.
  • Page 3 SECTION 1 GENERAL This section is extracted from instruction manual. – 3 –...
  • Page 4 – 4 –...

  • Page 5: Disassembly

    SECTION 2 DISASSEMBLY • The equipment can be removed using the following procedure. Cover assy Panel assy, front Panel assy, sub TX board Note : Follow the disassembly procedure in the numerical order given. 2-1. COVER ASSY 5 cover assy 3 PTT 2.6X5 2 PTT 2.6X5 4 PTT 2.6X5...

  • Page 6: Panel Assy, Sub

    2-3. PANEL ASSY, SUB 1 P 2.6X6 2 P 2.6X6 3 LED board 4 panel assy, sub 2-4. TX BOARD 2 PTT 2.6X5 4 TX board 3 PTT 2.6X5 1 P 3X6 – 6 –...

  • Page 7: Service Mode

    SECTION 3 SERVICE MODE 3-1. GENERAL *3) Digital input check : Do not use this in repair. *4) Analog input check : Other than MUTE check, do not use this This set has the test mode of the built-in microprocessor which in repair.

  • Page 8: Electrical Adjustments

    SECTION 4 ELECTRICAL ADJUSTMENTS Notes: Adjustment Location: 1. These adjustments are performed in the order that they are described. – TX board (side B) – 2. Adjustment and measurement are performed for each channel unless otherwise specified. 3. Adjustment is made for the right channel first and then the left channel.

  • Page 9: Diagrams

    DP-IF5000 SECTION 5 DIAGRAMS 5-1. BLOCK DIAGRAM — PROCESSOR SECTION — 5-2. BLOCK DIAGRAM — TRANSMITTER SECTION — OPTICAL RECEIVER (+9V) AC-3/PROLOGIC RV51 MODULE NAND LOGIC 3D SURROUND DECODER RF LEVEL IC305 IC303 PROCESSOR FRONT LR D/A CONVERTER IC301 (L-CH)
  • Page 10 DP-IF5000 5-3. PRINTED WIRING BOARD — PROCESSOR, TRANSMITTER SECTION — • Semiconductor Location Ref. No. Location D101 D102 IC101 IC102 IC103 IC105 IC201 IC202 IC204 (Page 22) IC301 IC302 IC303 IC304 (IC305) C-12 (IC801) H-14 (IC802) (IC803) C-12 (IC804) I-14...

  • Page 11: Schematic Diagram -Processor Section

    DP-IF5000 5-4. SCHEMATIC DIAGRAM — PROCESSOR SECTION — • Refer to page 27 for IC Block Diagrams. • Waveforms 5Vp-p 80µsec (Page 20) IC102 !§ (LRCK) 6.2Vp-p (Page 1.3µsec IC102 !¶ (BCKIN) 4.5Vp-p 12.288MHz IC202 2 4Vp-p 13µsec IC301 (¡ (SCKA) 3.4Vp-p...

  • Page 12: Schematic Diagram -Transmitter Section

    DP-IF5000 5-5. SCHEMATIC DIAGRAM — TRANSMITTER SECTION — • Refer to page 27 for IC Block Diagrams. 5-6. PRINTED WIRING BOARD — LED SECTION — (Page 23) (Page 16) D301-304 D305-308 INFRARED INFRARED EMITTER EMITTER (L-CH) (R-CH) (Page • Semiconductor Location Ref.

  • Page 13: Schematic Diagram -Led Section

    DP-IF5000 5-7. SCHEMATIC DIAGRAM — LED SECTION — • Refer to page 28 for IC Block Diagrams. (Page 19) Note: • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

  • Page 14: Printed Wiring Board -Amplifier Section

    DP-IF5000 5-8. PRINTED WIRING BOARD — AMPLIFIER SECTION — 5-9. SCHEMATIC DIAGRAM — AMPLIFIER SECTION — (Page 15) (Page 22) RV901 PHONES (Page 23) LEVEL (Page 17) Note: • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

  • Page 15: Ic Block Diagrams

    • IC Block Diagrams IC1 BA3308F-E2 IC102 PCM3001E-T2 VINL VCC1 RESET RSTB AGND1 VREFL FMT0 VREFR REFERENCE VINR FMT1 ANALOG ANALOG FMT2 FRONT-END FRONT-END CINPR DGND CINNR CINNL – – CINPL DELTA SIGMA MODULATOR CLKIO DECIMATION DOUT FILTER DIGITAL AUDIO BCKIN INTER- INTER-...
  • Page 16 IC205, 206 µPD6345GS 100k 100k 100k 100k 100k IC204 RN5VL42AA-TL IC801 TA7805S VREF – IC802 PQ05RD11 IC804, 805 PQ09RD11 EXCLUSIVE IC305 TORX176 VIN VOUT CIRCUIT ATC CIRCUIT IC803 BA033T REFERENCE REFERENCE CONVERTER – VOLTAGE VOLTAGE OCCURENCE CIRCUIT – – 28 –...

  • Page 17: Ic Pin Descriptions

    5-10. IC PIN DESCRIPTIONS • IC105 µPD78P018F (PROGRAM, SYSTEM CONTROL) Pin No. Pin Name Pin Description 1 – 8 P30 – 37 — Not used. (open) — Ground POWER ON/OFF key signal input L: ON INPUT key signal input L: ON OUTPUT key signal input L: ON EFFECT key signal input L: ON DEMO key signal input L: ON...
  • Page 18 • IC301 ZR38600PQC-RCB7A (AC-3/PROLOGIC SURROUND DECODER) Pin No. Pin Name Pin Description — Not used. (open) — Ground Host serial interface slave select signal input — Not used. (Connect to ground.) External interference request signal input — Power supply pin (+3.3 V) R14/RDY —...
  • Page 19 Pin No. Pin Name Pin Description GPIO1 — Not used. (open) GPIO0 General service programing signal output — Power supply pin (+3.3 V) BYPASS — Not used. (Connect to ground.) SPFRX S/P DIF receive input port Resemblance input/output, resemblance port memory select signal input. Decide to time of reset.
  • Page 20 • IC302 DSP56009FJ (LOGIC 3D PROCESSOR) Pin No. Pin Name Pin Description — Ground MCS0 — Not used. (open) MA15/MCS3 — Not used. (open) MA14 — Not used. (open) MA13 — Not used. (open) — Power supply pin (+5 V) MA12 —...
  • Page 21 Pin No. Pin Name Pin Description — Mode set up pin 62 – 65 MD7 – 4 — Not used. (open) — Ground 67 – 69 MD3 – 1 — Not used. (open) — Power supply pin (+5 V) — Not used.

  • Page 22: Exploded View

    SECTION 6 EXPLODED VIEW NOTE: • The mechanical parts with no reference • -XX and -X mean standardized parts, so • Hardware (# mark) list are given in the number in the exploded views are not supplied. they may have some difference from the last of this parts list.

  • Page 23: Electrical Parts List

    SECTION 7 ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in • Items marked “*” are not stocked since When indicating parts by reference the parts list may be different from the they are seldom required for routine service. number, please include the board.
  • Page 24 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark D210 8-719-072-96 LED TLO124(TPJ52) (HL) 1-572-199-11 SWITCH, KEY BOARD (INPUT) D211 8-719-072-96 LED TLO124(TPJ52) (HR) 1-572-199-11 SWITCH, KEY BOARD (OUTPUT) D212 8-719-072-96 LED TLO124(TPJ52) (LS) 1-572-199-11 SWITCH, KEY BOARD (EFFECT) D213 8-719-072-96 LED TLO124(TPJ52) (RS) 1-572-199-11 SWITCH, KEY BOARD (DEMO)
  • Page 25 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C107 1-124-233-11 ELECT 10uF C314 1-115-339-11 CERAMIC CHIP 0.1uF C108 1-124-233-11 ELECT 10uF C315 1-130-489-00 MYLAR 0.033uF C109 1-163-117-00 CERAMIC CHIP 100PF C316 1-115-339-11 CERAMIC CHIP 0.1uF C110 1-163-117-00 CERAMIC CHIP 100PF C317...
  • Page 26 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark IC202 8-759-530-30 IC TC74VHCU04FT(EL) 1-412-961-11 INDUCTOR 68uH IC204 8-759-526-81 IC RN5VL42AA-TL 1-409-692-11 COIL (OSC) IC301 8-759-560-81 IC ZR38600PQC-RCB7A 1-412-962-11 INDUCTOR 82uH IC302 8-759-565-85 IC DSP56009FJ88E L101 1-416-668-11 INDUCTOR 10uH IC303 8-759-491-47 IC TC74VHCT08AFT(EL)
  • Page 27 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 1-216-089-00 RES,CHIP 1/10W R243 1-216-121-00 RES,CHIP 1/10W 1-216-053-00 METAL CHIP 1.5K 1/10W R244 1-216-089-00 RES,CHIP 1/10W 1-216-025-00 RES,CHIP 1/10W R245 1-216-049-11 RES,CHIP 1/10W 1-216-053-00 METAL CHIP 1.5K 1/10W R302 1-216-089-00 RES,CHIP 1/10W...
  • Page 28 DP-IF5000 Sony Corporation 99B0481-1 Printed in Japan C1999. 2 9-924-997-12 Personal A&V Products Company Published by Quality Engineering Dept. – 40 – (Shinagawa)

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